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Analog Devices Inc. HMC260ALC3BTR-R5
- Part No.:
- HMC260ALC3BTR-R5
- Manufacturer:
- Analog Devices Inc.
- Category:
- RF Mixers
- Package:
- 12-CLCC Exposed Pad
- Datasheet:
-
HMC260ALC3BTR-R5.pdf
- Description:
- IC MIXER SUB-HARMONIC 12SMD
- Quantity:
- Payment:
- Shipping:
Inventory:3,150
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Product details
Overview
HMC260ALC3BTR-R5 from Analog Devices is a GaAs MMIC double-balanced passive mixer operating from 10 GHz to 26 GHz, with typical conversion loss of 8 dB (10–18 GHz) and 9 dB (18–26 GHz), LO-to-RF isolation of 40 dB, and dc-to-8 GHz IF bandwidth - used in microwave up/downconversion for point-to-point radios and test equipment.
For engineers reviewing the HMC260ALC3BTR-R5 datasheet, HMC260ALC3BTR-R5 pinout, HMC260ALC3BTR-R5 application, or HMC260ALC3BTR-R5 equivalent, this page delivers verified RF mixer specifications, thermal and isolation performance across temperature/LO power, surface-mount LCC package details, and real-world deployment guidance for millimeter-wave systems.
Technical Context
The HMC260ALC3BTR-R5 implements a monolithic double-balanced architecture using optimized on-die baluns to achieve high LO-to-RF (40 dB) and LO-to-IF (25–43 dB) suppression without external bias or matching components. Its passive design eliminates DC power requirements and enables operation as both upconverter and downconverter.
It supports LO drive levels from 9 dBm to 15 dBm, delivers input IP3 up to 23 dBm (18–26 GHz), and maintains stable conversion loss and noise figure across −40°C to +85°C ambient temperature - enabled by its thermally enhanced 3 mm × 3 mm ceramic LCC package with exposed ground pad.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Frequency Range | RF: 10–26 GHz; LO: 10–26 GHz; IF: dc–8 GHz - enables full-band microwave transceivers without band switching. |
| Conversion Loss | 8 dB typ. (10–18 GHz), 9 dB typ. (18–26 GHz) - defines signal attenuation in downconversion path; impacts system NF and dynamic range. |
| LO-to-RF Isolation | 40 dB min. - prevents LO leakage into antenna/RX chain, critical for receiver sensitivity and spectral purity. |
| Input IP3 | 19 dBm typ. (18–26 GHz) - determines third-order intermodulation distortion floor in dense RF environments. |
| IF Bandwidth | dc to 8 GHz - supports wideband modulation schemes (e.g., QPSK, 256-QAM) and baseband I/Q sampling. |
| Package | RoHS-compliant 12-terminal ceramic LCC (3 mm × 3 mm, E-12-4) - enables automated SMT assembly and repeatable RF grounding via exposed pad. |
| Operating Temp | −40°C to +85°C - validated for outdoor wireless infrastructure and military-grade environmental resilience. |
Pinout & Package
12-terminal leadless ceramic chip carrier (LCC), 3 mm × 3 mm footprint (E-12-4), RoHS-compliant, with exposed ground pad requiring direct connection to PCB RF/dc ground plane.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1, 3, 4, 6, 7, 9 | GND | RF/dc ground reference; all connect to package base and exposed pad for low-inductance return path. |
| 2 | LO | Local oscillator port; ac-coupled, 50 Ω matched - accepts 9–15 dBm LO drive without external matching. |
| 5 | IF | Intermediate frequency port; dc-coupled - supports baseband operation but limited to ±3 mA current sourcing/sinking. |
| 8 | RF | Radio frequency port; ac-coupled, 50 Ω matched - handles RF input/output in up/downconversion modes. |
| 10–12 | NIC | Not internally connected - may be tied to ground for mechanical stability without affecting RF performance. |
| EPAD | Exposed Pad | Mandatory RF/dc ground connection - essential for thermal dissipation (θJC = 200°C/W) and isolation integrity. |
Key Features
| Feature | Design Value |
|---|---|
| No DC bias required | Passive mixer architecture eliminates power supply, sequencing, and decoupling complexity in RF front-ends. |
| Double-balanced topology | Provides inherent rejection of LO×2, RF×2, and LO±RF spurs - reduces filtering burden in adjacent channel interference scenarios. |
| Wide IF bandwidth (dc–8 GHz) | Enables direct sampling of complex waveforms (e.g., 5G NR FR2, satellite modems) without IF amplification or translation stages. |
| High LO-to-RF isolation (40 dB) | Minimizes LO radiation through antenna path - critical for co-site operation and regulatory compliance (e.g., FCC Part 101). |
| Surface-mount LCC package | Eliminates wire bonding; compatible with reflow soldering and automated optical inspection for high-yield mmWave production. |
Applications
| Point-to-Point Radios | Test & Measurement Equipment |
|---|---|
Use Scenario: High-capacity backhaul links operating at 24 GHz unlicensed band with 500 MHz channel bandwidth. IC Role / Device Role / Timing Role: Downconverter translating 24 GHz RF to 1–2 GHz IF for digitization and demodulation in FPGA-based receivers. Use Value: 8–9 dB conversion loss and 40 dB LO-to-RF isolation preserve link budget and prevent LO self-jamming in compact outdoor radios. |
Use Scenario: Vector network analyzer (VNA) front-end module requiring broadband harmonic mixing up to 26 GHz. IC Role / Device Role / Timing Role: Active upconverter generating calibrated RF stimulus from synthesized IF sources in swept-frequency measurements. Use Value: dc–8 GHz IF bandwidth supports wide IF excitation; 19 dBm IIP3 ensures linearity during two-tone intermodulation testing. |
| Military Communications | VSAT Terminals |
Use Scenario: Secure SATCOM terminal operating in X/Ku-band with jamming-resistant wideband waveform processing. IC Role / Device Role / Timing Role: Double-balanced mixer in dual-conversion superheterodyne architecture performing first-stage downconversion from 12–18 GHz RF to 1–3 GHz IF. Use Value: −40°C to +85°C operation and 23 dBm IIP3 maintain dynamic range under extreme environmental stress and high-power interference. |
Use Scenario: Ku-band VSAT transceiver for maritime broadband, requiring low-profile surface-mount RF front-end. IC Role / Device Role / Timing Role: Upconverter translating 70 MHz IF to 14 GHz transmit band in compact ODU modules. Use Value: 3 mm × 3 mm LCC footprint minimizes board area; no external bias simplifies power domain partitioning in battery-assisted terminals. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar double-balanced mixer applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| HMC1048LC3BTR | Wider RF range (6–26 GHz); higher conversion loss (10.5 dB typ. @ 24 GHz); requires 13 dBm LO. | Better low-band coverage below 10 GHz; less suitable for narrowband 24 GHz systems where loss budget is tight. | Select HMC1048LC3BTR only if sub-10 GHz operation is required; otherwise HMC260ALC3BTR-R5 offers superior loss and isolation above 10 GHz. |
| QPC1006 | Same 10–26 GHz range; GaN-based; higher P1dB (+15 dBm); requires external bias (Vdd = 5 V); larger 4 mm × 4 mm QFN. | Higher output power handling; unsuitable for passive, zero-bias designs; incompatible with existing 3 mm × 3 mm layout. | Choose QPC1006 only when active gain or high-power transmit capability is needed; HMC260ALC3BTR-R5 remains optimal for low-noise receive paths and bias-free architectures. |
Compared with HMC1048LC3BTR and QPC1006, the HMC260ALC3BTR-R5 delivers the lowest conversion loss and highest LO-to-RF isolation in its 10–26 GHz band, with zero DC bias and smallest footprint - making it the preferred choice for space-constrained, low-power, high-isolation microwave receivers.
Availability
HMC260ALC3BTR-R5 is available at Aetrix Electronics and suitable for point-to-point radios, test equipment, military communications, and VSAT terminals requiring stable component supply across extended temperature ranges and high-frequency performance consistency.
Supply support for HMC260ALC3BTR-R5 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Analog Devices is a global leader in high-performance analog, mixed-signal, and RF ICs, serving precision instrumentation, communications, and defense markets since 1965.
The HMC260ALC3BTR-R5 belongs to Analog Devices' Hittite Microwave MMIC product line, engineered specifically for broadband microwave and millimeter-wave signal conditioning in infrastructure and aerospace applications.
FAQ
What is the recommended LO drive level for optimal performance of the HMC260ALC3BTR-R5?
The HMC260ALC3BTR-R5 operates optimally with LO input power between 9 dBm and 15 dBm. At 13 dBm, it achieves best-in-class conversion loss (8–9 dB), input IP3 (19–23 dBm), and isolation (40 dB LO-to-RF). Drive below 9 dBm increases conversion loss and degrades linearity; above 15 dBm risks reliability per absolute maximum ratings.
Does the HMC260ALC3BTR-R5 require external DC bias or matching components?
No, the HMC260ALC3BTR-R5 is a fully passive double-balanced mixer and requires no DC bias. Its LO and RF ports are internally ac-coupled and 50 Ω matched; IF is dc-coupled. No external baluns, bias tees, or impedance-matching networks are needed - simplifying layout and reducing bill-of-materials cost.
How should the exposed pad (EPAD) of the HMC260ALC3BTR-R5 be connected on the PCB?
The exposed pad of the HMC260ALC3BTR-R5 must be soldered directly to a solid RF/dc ground plane using multiple thermal vias (≥9, 10-mil diameter, spaced ≤0.5 mm apart). This connection is mandatory for thermal dissipation (θJC = 200°C/W), RF grounding integrity, and achieving specified isolation and return loss performance.
Can the HMC260ALC3BTR-R5 be used for both upconversion and downconversion?
Yes, the HMC260ALC3BTR-R5 is bidirectional: as a downconverter (RF 10–26 GHz → IF dc–8 GHz) or upconverter (IF dc–8 GHz → RF 10–26 GHz). Performance data for both modes - including conversion loss, IP3, and isolation - is fully characterized in the datasheet across temperature and LO power conditions.
What is the maximum allowable IF current for the HMC260ALC3BTR-R5?
The IF port of the HMC260ALC3BTR-R5 must not source or sink more than ±3 mA of current. Exceeding this limit risks die malfunction or permanent failure. For dc-coupled IF operation, ensure external circuitry (e.g., baseband amplifier input) complies with this current rating; for ac-coupled use, add a series capacitor sized for the target IF bandwidth.
HMC260ALC3BTR-R5 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Analog Devices Inc.
- Series:
- -
- Package/Case:
- 12-CLCC Exposed Pad
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- RF Type:
- -
- Frequency:
- -
- Number of Mixers:
- -
- Gain:
- -
- Noise Figure:
- -
- Secondary Attributes:
- -
- Current - Supply:
- -
- Voltage - Supply:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 12-CLCC (2.9x2.9)
HMC260ALC3BTR-R5 FAQ
1.How can I place an order for HMC260ALC3BTR-R5 through Aetrix?
Please submit a Request for Quotation (RFQ) for HMC260ALC3BTR-R5 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for HMC260ALC3BTR-R5 reliable?
The price and inventory of HMC260ALC3BTR-R5 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for HMC260ALC3BTR-R5 is usually 5 days.
3.What payment methods are accepted for HMC260ALC3BTR-R5?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for HMC260ALC3BTR-R5 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for HMC260ALC3BTR-R5?
HMC260ALC3BTR-R5 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your HMC260ALC3BTR-R5 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for HMC260ALC3BTR-R5?
For technical support, including HMC260ALC3BTR-R5 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your HMC260ALC3BTR-R5 requirements.
6.How does Aetrix verify that HMC260ALC3BTR-R5 is sourced from the original manufacturer or authorized distributors?
All HMC260ALC3BTR-R5 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that HMC260ALC3BTR-R5 meets industry standards.
7.What is the process for return or replacement of HMC260ALC3BTR-R5?
All HMC260ALC3BTR-R5 units undergo pre-shipment inspection (PSI). If there is an issue with HMC260ALC3BTR-R5, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The HMC260ALC3BTR-R5 part is unused and in its original packaging.
Return procedure for HMC260ALC3BTR-R5:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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