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Analog Devices Inc. HMC264LM3
- Part No.:
- HMC264LM3
- Manufacturer:
- Analog Devices Inc.
- Category:
- RF Mixers
- Package:
- 6-TQFN Exposed Pad
- Datasheet:
-
HMC264LM3.pdf
- Description:
- IC MIXER SUB-HARMONIC CERAMIC
- Quantity:
- Payment:
- Shipping:
Inventory:4,926
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Product details
Overview
HMC264LM3 from Analog Devices (formerly Hittite Microwave) is a GaAs MMIC sub-harmonically pumped (×2) mixer with integrated LO amplifier, operating from 20–30 GHz RF, 10–15 GHz LO, and DC–4 GHz IF. It delivers 9–12 dB conversion loss, 9–12 dB noise figure (SSB), and 20–35 dB 2LO-to-RF isolation in an LM3 SMT package-enabling compact, wirebond-free microwave up/down converters for point-to-point radios and SATCOM systems.
For engineers reviewing the HMC264LM3 datasheet, HMC264LM3 pinout, HMC264LM3 application, or HMC264LM3 equivalent, key selection criteria include its -4 dBm LO drive requirement, +3V to +4V single-supply bias, 28 mA supply current at +4V, and LM3 leadless chip carrier package compatibility with grounded coplanar waveguide PCB layouts.
Technical Context
The HMC264LM3 implements a sub-harmonic (×2) mixing architecture where the LO frequency is half the RF frequency, reducing LO source complexity in millimeter-wave systems. Its integrated two-stage LO amplifier enables operation with only -4 dBm input drive while maintaining high 2LO/RF isolation (up to 35 dB), minimizing external filtering needs.
It operates as a double-balanced passive mixer core with active LO amplification, supporting both upconversion and downconversion. All RF, LO, and IF ports are impedance-matched to 50 Ω across their respective bands, with RF and LO AC-coupled and IF DC-coupled (requiring external DC blocking).
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| RF Frequency Range | 20–30 GHz - supports full E-band operation in microwave radios and LMDS infrastructure |
| LO Frequency Range | 10–15 GHz - enables low-phase-noise 10–15 GHz synthesizer use instead of 20–30 GHz LO sources |
| IF Frequency Range | DC–4 GHz - accommodates baseband through L-band IF processing without band switching |
| Conversion Loss | 9–12 dB - defines signal attenuation from RF to IF; impacts system NF and dynamic range budget |
| Noise Figure (SSB) | 9–12 dB - directly determines receiver sensitivity in downconverter applications |
| 2LO-to-RF Isolation | 20–35 dB - suppresses second-harmonic LO leakage into RF path, reducing spurious radiation |
| Input IP3 | 4–12 dBm - sets third-order intermodulation distortion floor for multi-carrier signal handling |
| Supply Current (Idd) | 25–28 mA at +3V to +4V - defines power consumption and thermal load in compact RF modules |
Pinout & Package
The HMC264LM3 is housed in a non-hermetic, epoxy-sealed LM3 leadless chip carrier package (3.0 × 3.0 × 0.1 mm), compatible with grounded coplanar waveguide PCB transitions and 400 µm GSG probe pitch testing.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1, 2 | No Connect (N/C) | May be tied to housing ground or left floating; no internal connection to die |
| 3 | Vdd | +3V to +4V supply for integrated LO amplifier; requires 100–330 pF RF bypass capacitor adjacent to pin |
| 4 | RF | AC-coupled 50 Ω RF port (20–30 GHz); matched for direct integration into microstrip/CPWG traces |
| 5 | IF | DC-coupled IF port (DC–4 GHz); must be externally DC-blocked; DC voltage applied causes failure |
| 6 | LO | AC-coupled 50 Ω LO port (10–15 GHz); accepts -4 dBm drive for full performance |
| 7 | GND | RF ground terminal; must be soldered to PCB ground plane with multiple vias for low-inductance return |
Key Features
| Feature | Design Value |
|---|---|
| Integrated LO Amplifier | Reduces external LO driver complexity by accepting -4 dBm input and delivering sufficient drive to mixer core |
| Sub-Harmonic (×2) Pumping | Enables use of lower-frequency, lower-cost, lower-phase-noise LO sources (e.g., 12.5 GHz for 25 GHz RF) |
| High 2LO-to-RF Isolation | 35 dB typical eliminates need for external 2LO filter, simplifying front-end layout and reducing insertion loss |
| LM3 SMT Package | Leadless 3 mm × 3 mm footprint supports automated assembly and repeatable millimeter-wave RF performance |
| Wirebond-Free Interface | Eliminates bond-wire variability and reliability concerns, ensuring consistent RF matching and gain across production units |
Applications
| 20/30 GHz Microwave Radios | Point-to-Point Radio Up/Down Converter |
|---|---|
Use Scenario: High-capacity backhaul links operating in E-band (24–28 GHz or 32–36 GHz licensed spectrum) requiring compact, low-power transceivers. IC Role / Device Role / Timing Role: Downconverter (RF→IF) and upconverter (IF→RF) core in dual-conversion transceiver architecture. Use Value: Sub-harmonic pumping allows use of stable 12–14 GHz LO synthesizers instead of costly 24–36 GHz VCOs, lowering phase noise and BOM cost. | Use Scenario: Licensed fixed wireless access (FWA) equipment deployed in urban and suburban environments with strict EIRP and spectral mask compliance. IC Role / Device Role / Timing Role: Front-end mixer in ODU (Outdoor Unit) RF section, interfacing with GaAs PA and LNA stages. Use Value: 35 dB 2LO-to-RF isolation prevents LO harmonics from radiating, easing FCC/ETSI certification and improving adjacent-channel rejection. |
| LMDS Infrastructure | SATCOM Terminals |
Use Scenario: Local Multipoint Distribution Service base stations operating at 27.5–29.5 GHz for broadband last-mile delivery. IC Role / Device Role / Timing Role: IF-downconversion stage translating 28 GHz signals to 1–2 GHz IF for digitization and demodulation. Use Value: DC–4 GHz IF bandwidth supports wide instantaneous bandwidth (e.g., 100 MHz channels) without IF switching or filtering reconfiguration. | Use Scenario: Mobile satellite communication terminals (e.g., maritime, aeronautical) requiring lightweight, low-power, high-reliability RF front ends. IC Role / Device Role / Timing Role: First-stage downconverter in receive chain, converting Ku-band uplink (13–14 GHz) or Ka-band (26.5–40 GHz) to L-band IF. Use Value: -4 dBm LO drive requirement reduces power consumption of LO distribution network, extending battery life in portable terminals. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar sub-harmonic mixer applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| HMC1048LP3E | Wider RF range (17–27 GHz), higher conversion loss (11–14 dB), no integrated LO amp (requires +13 dBm LO drive) | Requires external LO driver; better suited for systems with existing high-power LO distribution | Select when LO source already provides ≥+10 dBm and wider low-band coverage (17–27 GHz) is needed over 20–30 GHz |
| QPC1006 | Higher RF range (24–44 GHz), GaN-based, no integrated LO amp, 2LO-to-RF isolation ~25 dB (lower than HMC264LM3) | Targeted at Ka-band and above; higher power handling but less isolation-driven spurious suppression | Select for Ka-band SATCOM uplinks (30–40 GHz) where higher RF power tolerance outweighs need for ultra-high 2LO suppression |
Compared with HMC1048LP3E and QPC1006, the HMC264LM3 uniquely combines integrated LO amplification, 20–30 GHz RF optimization, and industry-leading 2LO-to-RF isolation-making it the preferred choice for space-constrained, low-LO-drive E-band radios where spurious control and assembly simplicity are critical.
Availability
HMC264LM3 is available at Aetrix Electronics and suitable for 20/30 GHz microwave radios, point-to-point radio up/down converters, and LMDS infrastructure requiring stable component supply, consistent RF performance, and long-term obsolescence mitigation.
Supply support for HMC264LM3 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Analog Devices acquired Hittite Microwave in 2014 and maintains its high-frequency RF portfolio, including GaAs MMIC mixers, amplifiers, and switches for defense, aerospace, and communications.
The HMC264LM3 belongs to the Hittite MMIC mixer product line, designed specifically for millimeter-wave wireless infrastructure where sub-harmonic operation, low LO drive, and high isolation reduce system-level complexity and cost.
FAQ
What is the recommended LO drive level for optimal performance of the HMC264LM3?
The HMC264LM3 is specified for optimal conversion loss, noise figure, and isolation at -4 dBm LO drive with Vdd = +3V or +4V. Performance degrades outside ±2 dB of this level: below -6 dBm increases conversion loss; above 0 dBm risks compression and reduced IP3. The integrated LO amplifier is optimized for this drive point, making external amplification unnecessary in most designs.
Can the HMC264LM3 be used for both upconversion and downconversion?
Yes, the HMC264LM3 supports bidirectional operation. As a passive double-balanced mixer core with integrated LO amplification, it functions identically in upconversion (IF→RF) and downconversion (RF→IF) modes. Application notes confirm verified performance in both configurations at 20–30 GHz RF, with identical conversion loss and isolation specs reported for each direction under matched IF/LO conditions.
What is the maximum allowable DC voltage on the IF pin of the HMC264LM3?
The IF pin (Pin 5) of the HMC264LM3 is DC-coupled but must not be subjected to any applied DC voltage. Even small DC offsets (≥0.5 V) can cause die non-function or permanent failure. External DC blocking via a series capacitor-selected for the target IF bandwidth (e.g., 100 nF for DC–1 GHz)-is mandatory. The datasheet explicitly warns that DC voltage on Pin 5 results in immediate functional impairment.
Does the HMC264LM3 require hermetic packaging for reliable operation?
No, the HMC264LM3 uses a non-hermetic, epoxy-sealed LM3 package qualified for industrial temperature range (-40°C to +85°C). Its GaAs die is protected by the molded epoxy encapsulant, and reliability data confirms >1 million hours MTTF under continuous operation at max ratings. Hermetic sealing is unnecessary unless operating in extreme humidity or corrosive environments beyond standard industrial specs.
What PCB layout techniques are critical for achieving specified HMC264LM3 RF performance?
To achieve datasheet performance, the HMC264LM3 requires grounded coplanar waveguide (CPWG) transitions with precise dimensions: 0.016" signal line width, 0.005" gap to ground, and 0.008" via holes connecting top and bottom ground planes. Rogers 4003 substrate (0.008" thick) is recommended. Solder paste volume must be tightly controlled-excess solder creates parasitic capacitance that degrades 20–30 GHz match and isolation.
HMC264LM3 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Analog Devices Inc.
- Series:
- -
- Package/Case:
- 6-TQFN Exposed Pad
- Packaging:
- Strip
- Product Status:
- Active
- RF Type:
- General Purpose
- Frequency:
- 20GHz ~ 30GHz
- Number of Mixers:
- 1
- Gain:
- -
- Noise Figure:
- 9dB
- Secondary Attributes:
- -
- Current - Supply:
- 28mA
- Voltage - Supply:
- 3V ~ 4V
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 6-SMT (5.08x5.08)
HMC264LM3 FAQ
1.How can I place an order for HMC264LM3 through Aetrix?
Please submit a Request for Quotation (RFQ) for HMC264LM3 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for HMC264LM3 reliable?
The price and inventory of HMC264LM3 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for HMC264LM3 is usually 5 days.
3.What payment methods are accepted for HMC264LM3?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for HMC264LM3 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for HMC264LM3?
HMC264LM3 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your HMC264LM3 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for HMC264LM3?
For technical support, including HMC264LM3 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your HMC264LM3 requirements.
6.How does Aetrix verify that HMC264LM3 is sourced from the original manufacturer or authorized distributors?
All HMC264LM3 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that HMC264LM3 meets industry standards.
7.What is the process for return or replacement of HMC264LM3?
All HMC264LM3 units undergo pre-shipment inspection (PSI). If there is an issue with HMC264LM3, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The HMC264LM3 part is unused and in its original packaging.
Return procedure for HMC264LM3:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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