Analog Devices Inc. HMC264LM3TR
- Part No.:
- HMC264LM3TR
- Manufacturer:
- Analog Devices Inc.
- Category:
- RF Mixers
- Package:
- 6-TQFN Exposed Pad
- Datasheet:
-
HMC264LM3TR.pdf
- Description:
- IC MIXER SUB-HARMONIC CERAMIC
- Quantity:
- Payment:

- Shipping:

Inventory:3,094
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Product details
Overview
HMC264LM3 from Analog Devices (formerly Hittite Microwave) is a GaAs MMIC sub-harmonically pumped (×2) mixer with integrated LO amplifier, operating as a downconverter or upconverter in 20–30 GHz RF systems. It delivers 9–12 dB conversion loss, 9–12 dB noise figure (SSB), and 20–35 dB 2LO-to-RF isolation at +3V to +4V supply, enabling compact microwave radios without external LO filtering.
For engineers reviewing the HMC264LM3 datasheet, HMC264LM3 pinout, HMC264LM3 application, or HMC264LM3 equivalent, key selection criteria include its 10–15 GHz LO range (half of RF), -4 dBm LO drive requirement, LM3 SMT package compatibility with CPWG PCB transitions, and DC-coupled IF interface requiring external blocking capacitor.
Technical Context
The HMC264LM3 implements a sub-harmonic (×2) mixing architecture where the LO frequency is half the RF band (10–15 GHz LO for 20–30 GHz RF), eliminating need for high-frequency LO synthesis. Its integrated two-stage LO amplifier operates from a single +3V to +4V bias and accepts only -4 dBm input, reducing external driver complexity.
RF and LO ports are AC-coupled and 50 Ω matched across full bands; IF is DC-coupled and requires external series capacitor for DC blocking. The device achieves >30 dB 2LO-to-IF isolation and supports IF bandwidths up to 4 GHz, with absolute maximum ratings including +13 dBm RF/LO input and -40°C to +85°C operating temperature.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| RF Frequency Range | 20–30 GHz - defines usable microwave band for point-to-point radio and SATCOM front-ends |
| LO Frequency Range | 10–15 GHz - sub-harmonic (×2) pumping enables lower-cost LO generation |
| IF Frequency Range | DC–4 GHz - supports baseband through L-band IF interfaces with DC coupling |
| Conversion Loss | 9–12 dB - measured at IF = 1 GHz, LO = -4 dBm, Vdd = +3V/+4V; impacts system NF and gain budget |
| 2LO-to-RF Isolation | 20–35 dB - suppresses 2×LO feedthrough, reducing need for external RF bandpass filtering |
| Input IP3 | 4–12 dBm - determines third-order intermodulation performance in multi-carrier microwave links |
| Supply Current (Idd) | 25–28 mA - at Vdd = +3V to +4V; sets power dissipation and thermal management requirements |
| Operating Temperature | -40°C to +85°C - qualified for outdoor microwave radio and LMDS infrastructure deployment |
Pinout & Package
The HMC264LM3 is housed in an LM3 leadless chip carrier package (plastic body, gold-over-nickel plating), measuring 2.0 × 2.0 mm with 7 terminals. Ground pins (1, 2, 7) must be soldered to PCB RF ground; RF, LO, and IF ports are impedance-matched for CPWG or microstrip transitions.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1, 2 | No Connect (N/C) | May be tied to housing ground or left floating; no internal connection to die |
| 3 | Vdd | +3V to +4V supply for integrated LO amplifier; requires 100–330 pF RF bypass capacitor adjacent to pin |
| 4 | RF | AC-coupled, 50 Ω matched input/output port for 20–30 GHz signals; designed for GSG probe testing |
| 5 | IF | DC-coupled port; external series capacitor required to block DC and pass IF band (DC–4 GHz) |
| 6 | LO | AC-coupled, 50 Ω matched port for 10–15 GHz sub-harmonic drive; -4 dBm typical requirement |
| 7 | GND | Mandatory RF ground connection; must be soldered to low-inductance PCB ground plane |
Key Features
| Feature | Design Value |
|---|---|
| Integrated LO Amplifier | Reduces external driver count; accepts -4 dBm LO input and operates from single +3V/+4V rail |
| Sub-Harmonic (×2) Pumping | Enables use of 10–15 GHz LO sources for 20–30 GHz RF, lowering synthesizer cost and complexity |
| High 2LO-to-RF Isolation | 20–35 dB isolation minimizes spurious response and eliminates discrete LO harmonic filters in RF path |
| LM3 SMT Package | 2.0 × 2.0 mm leadless ceramic package optimized for millimeter-wave CPWG transitions and automated assembly |
| DC-Coupled IF Interface | Supports zero-IF and complex IF architectures; requires external blocking capacitor sized for target IF bandwidth |
Applications
| 20/30 GHz Microwave Radios | Point-to-Point Radio Up/Down Converters |
|---|---|
|
Use Scenario: High-capacity backhaul links operating in E-band (71–76 GHz, 81–86 GHz) or V-band (60 GHz) often use 20–30 GHz IF stages before final upconversion. IC Role / Device Role / Timing Role: Downconverter translating 20–30 GHz RF to 1–4 GHz IF for digitization and baseband processing. Use Value: Sub-harmonic architecture avoids need for 20–30 GHz LO synthesis; integrated LO amp reduces component count and board area. |
Use Scenario: Licensed fixed wireless access (FWA) systems using 24–28 GHz or 27.5–29.5 GHz licensed bands for last-mile connectivity. IC Role / Device Role / Timing Role: Bidirectional mixer in transceiver front-end, supporting both transmit upconversion and receive downconversion. Use Value: Single-supply operation (+3V/+4V) and consistent 9–12 dB conversion loss simplify dual-path RF design and calibration. |
| LMDS Infrastructure | SATCOM Terminals |
|
Use Scenario: Local Multipoint Distribution Service base stations delivering broadband via 27.5–29.5 GHz spectrum in urban deployments. IC Role / Device Role / Timing Role: Receive-chain mixer converting 27.5–29.5 GHz air interface signals to 1–3 GHz IF for demodulation. Use Value: 2LO-to-RF isolation >30 dB prevents LO harmonics from desensitizing adjacent channels in dense multi-sector sites. |
Use Scenario: Mobile satellite communication terminals (e.g., maritime, aeronautical) requiring rugged, compact 20–30 GHz transceivers. IC Role / Device Role / Timing Role: Transmit mixer upconverting 1–2 GHz IF to 27.5–30 GHz for satellite uplink; receives 17.7–20.2 GHz downlink. Use Value: -40°C to +85°C operating range and DC-coupled IF support cold-start and wide-temperature environmental operation. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar sub-harmonic mixer applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| HMC1048LP3E | Wider RF range (17–32 GHz), higher conversion loss (11–14 dB), no integrated LO amp; requires +5V LO driver | Better suited for wideband test equipment where LO drive headroom is available | Select when broader RF coverage is needed and external LO amplification is acceptable |
| QPC1006 | Same LM3 package, 20–30 GHz RF, but uses fundamental LO (20–30 GHz); no sub-harmonic pumping | Requires full-band LO source; lacks 2LO-to-RF isolation advantage of HMC264LM3 | Select when LO synthesis at RF frequency is already available and harmonic suppression is handled elsewhere |
Compared with HMC1048LP3E and QPC1006, the HMC264LM3 uniquely combines sub-harmonic pumping, integrated LO amplification, and 2.0 × 2.0 mm LM3 packaging-enabling lower-system-cost microwave radios where LO frequency division and space-constrained layouts are critical.
Availability
HMC264LM3 is available at Aetrix Electronics and suitable for 20/30 GHz microwave radios, point-to-point radio up/down converters, and LMDS infrastructure requiring stable component supply across extended temperature ranges and high-frequency performance consistency.
Supply support for HMC264LM3 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Analog Devices acquired Hittite Microwave in 2014 and maintains its high-frequency RF IC portfolio, specializing in GaAs and GaN solutions for defense, communications, and instrumentation markets.
The HMC264LM3 belongs to the Hittite legacy MMIC mixer product line, engineered specifically for millimeter-wave wireless infrastructure where sub-harmonic efficiency, integration, and SMT manufacturability are essential.
FAQ
What is the recommended LO drive level for optimal performance of the HMC264LM3?
The HMC264LM3 is characterized and optimized for -4 dBm LO drive at Vdd = +3V or +4V. At this level, it achieves typical conversion loss of 9–12 dB and 2LO-to-RF isolation of 25–35 dB. Deviating significantly (e.g., -8 dBm or 0 dBm) degrades conversion gain flatness and increases distortion; the datasheet confirms -4 dBm as the nominal design point across temperature and frequency.
Can the HMC264LM3 be used as an upconverter, and what are the IF interface requirements?
Yes, the HMC264LM3 supports bidirectional operation as both upconverter and downconverter. Its IF port is DC-coupled, so any applied DC voltage will cause non-function or die failure. An external series capacitor must be placed on the IF line to block DC while passing the required IF bandwidth (DC–4 GHz); capacitor value must be selected to maintain impedance match and low insertion loss across the IF band.
What is the function of pins 1 and 2 on the HMC264LM3, and how should they be handled on the PCB?
Pins 1 and 2 on the HMC264LM3 are No Connect (N/C) terminals with no internal die connection. Per the official datasheet, they may be connected to housing ground or left unconnected. In practice, tying them to the PCB RF ground plane improves mechanical stability and thermal conduction without electrical impact, but floating them does not affect RF performance.
Does the HMC264LM3 require external filtering between LO and RF paths?
No-external LO harmonic filtering is not required due to the HMC264LM3's inherent 2LO-to-RF isolation of 20–35 dB. This performance eliminates the need for discrete bandpass filters typically used with fundamental mixers, simplifying front-end design and reducing insertion loss. However, system-level spurious analysis should still verify compliance with spectral mask requirements.
What PCB layout techniques are critical for achieving specified HMC264LM3 performance at 30 GHz?
To achieve datasheet performance, the HMC264LM3 requires grounded coplanar waveguide (CPWG) transitions with precise geometry: 0.016" signal line width, 0.005" gap to ground, and 0.008" via diameter. The LM3-01 land pattern tolerance is ±0.003", and RF bypass capacitors (100–330 pF, 0402) must be placed within 100 mils of pin 3 (Vdd). Rogers 4003 substrate with 0.008" dielectric thickness is recommended.
HMC264LM3TR Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Analog Devices Inc.
- Series:
- -
- Package/Case:
- 6-TQFN Exposed Pad
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- RF Type:
- -
- Frequency:
- 20GHz ~ 30GHz
- Number of Mixers:
- 1
- Gain:
- -
- Noise Figure:
- 9dB
- Secondary Attributes:
- -
- Current - Supply:
- 28mA
- Voltage - Supply:
- 3V ~ 4V
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 6-SMT (5.08x5.08)
HMC264LM3TR FAQ
1.How can I place an order for HMC264LM3TR through Aetrix?
Please submit a Request for Quotation (RFQ) for HMC264LM3TR on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for HMC264LM3TR reliable?
The price and inventory of HMC264LM3TR are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for HMC264LM3TR is usually 5 days.
3.What payment methods are accepted for HMC264LM3TR?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for HMC264LM3TR transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for HMC264LM3TR?
HMC264LM3TR orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your HMC264LM3TR order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for HMC264LM3TR?
For technical support, including HMC264LM3TR datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your HMC264LM3TR requirements.
6.How does Aetrix verify that HMC264LM3TR is sourced from the original manufacturer or authorized distributors?
All HMC264LM3TR products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that HMC264LM3TR meets industry standards.
7.What is the process for return or replacement of HMC264LM3TR?
All HMC264LM3TR units undergo pre-shipment inspection (PSI). If there is an issue with HMC264LM3TR, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The HMC264LM3TR part is unused and in its original packaging.
Return procedure for HMC264LM3TR:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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