Analog Devices Inc. HMC272AMS8
- Part No.:
- HMC272AMS8
- Manufacturer:
- Analog Devices Inc.
- Category:
- RF Mixers
- Package:
- 8-TSSOP, 8-MSOP (0.118", 3.00mm Width)
- Datasheet:
-
HMC272AMS8.pdf
- Description:
- IC MIXER SGL-BAL 1.7-3GHZ 8-MSOP
- Quantity:
- Payment:

- Shipping:

Inventory:4,292
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Product details
Overview
HMC272AMS8 from Analog Devices (formerly Hittite Microwave) is a GaAs MMIC single-balanced passive mixer in an 8-lead MSOP package, operating from 1.7–3.0 GHz RF/LO and DC–0.8 GHz IF, with +20 dBm input IP3, 10.5 dB typical conversion loss at 100 MHz IF, and 32 dB LO-to-RF isolation - deployed in PCS up/down converters and W-CDMA transceivers.
For engineers reviewing the HMC272AMS8 datasheet, HMC272AMS8 pinout, HMC272AMS8 application, or HMC272AMS8 equivalent, key selection criteria include its ultra-miniature MSOP8 footprint, GaAs Schottky diode + planar transformer balun architecture, LO drive sensitivity (+7 to +13 dBm), temperature-stable P1dB (7–11 dBm), and RF/IF port return loss >10 dB across band.
Technical Context
The HMC272AMS8 integrates a monolithic GaAs MMIC die with on-chip planar transformer balun for RF port balancing, while the LO connects directly to Schottky diodes - enabling broadband single-balanced mixing without external baluns. Its passive architecture eliminates bias requirements and supports wide IF bandwidth (DC–800 MHz).
Performance is specified at TA = +25°C with LO = +10 dBm; conversion loss, noise figure, and isolation vary predictably with IF frequency (100/400/800 MHz) and temperature (−40°C to +85°C), and spurious outputs are suppressed ≥35 dBc for critical nLO/mRF products at 2.6 GHz RF / 2.2 GHz LO.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| RF/LO Frequency Range | 1.7–3.0 GHz: Covers PCS (1.85–1.99 GHz), W-CDMA (2.11–2.17 GHz), and 2.4 GHz ISM bands without retuning. |
| IF Frequency Range | DC–0.8 GHz: Supports baseband I/Q downconversion and IF-sampling architectures up to 800 MHz. |
| Conversion Loss | 10.5 dB typ @ 100 MHz IF: Defines signal attenuation through mixer; impacts cascaded noise figure and gain budget. |
| Input IP3 | +20 dBm typ @ LO = +10 dBm: Indicates strong linearity for multi-carrier systems like W-CDMA with adjacent channel interference rejection. |
| LO-to-RF Isolation | 32 dB typ: Minimizes LO leakage into antenna path, easing filter requirements in transmit chains. |
| Operating Temp | −40°C to +85°C: Qualified for industrial and outdoor wireless infrastructure environments. |
| ESD Rating | HBM Class 1A (≤250 V): Requires strict ESD handling during assembly; no on-board protection circuitry. |
Pinout & Package
Package: 8-lead MSOP (Mini Small Outline Package), 3.0 mm × 3.0 mm body, exposed paddle for thermal and RF grounding. Sn/Pb lead finish, MSL1 rating, peak reflow ≤235°C.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1 | RF+ (Balanced Input) | Non-inverting RF port of internal balun; requires 50 Ω match to antenna or PA output. |
| 2 | RF− (Balanced Input) | Inverting RF port; must be terminated symmetrically with RF+ for common-mode rejection. |
| 3 | GND | Ground connection for RF balun center-tap; soldered directly to PCB ground plane via multiple vias. |
| 4 | LO | Single-ended LO drive input; accepts +7 to +13 dBm; no DC blocking required. |
| 5 | IF | Differential IF output (unbalanced configuration per eval board); DC-coupled, 50 Ω output impedance. |
| 6 | GND | Ground reference for IF stage; ties to same ground plane as Pin 3 and exposed paddle. |
| 7 | GND | Ground for LO path; minimizes LO radiation and improves isolation. |
| 8 | Exposed Paddle | Thermal and RF ground; must be soldered to solid copper ground plane for performance and reliability. |
Key Features
| Feature | Design Value |
|---|---|
| Ultra-small MSOP8 package | 3.0 × 3.0 mm footprint enables dense RF front-end layouts in space-constrained 2.4 GHz ISM and MMDS modules. |
| GaAs MMIC + integrated planar balun | Eliminates discrete balun components and associated parasitics, improving amplitude/phase balance over 1.7–3.0 GHz. |
| No DC bias required | Passive operation simplifies power design, reduces BOM count, and avoids bias network noise injection into IF path. |
| High LO-to-RF isolation (32 dB) | Reduces need for external LO filtering in transmitter architectures, lowering system insertion loss and cost. |
| DC–800 MHz IF bandwidth | Supports direct-conversion receivers and zero-IF architectures without IF amplification limitations. |
Applications
| PCS Up/Down Converter | W-CDMA Transceiver |
|---|---|
Use Scenario: Frequency translation in 1.9 GHz PCS base stations for uplink (RF→IF) and downlink (IF→RF) paths. IC Role / Device Role / Timing Role: Single-balanced passive mixer providing image-reject capable downconversion and high-linearity upconversion. Use Value: +20 dBm IP3 and 32 dB LO-RF isolation reduce adjacent channel interference and simplify transmit filter design. | Use Scenario: Dual-conversion receiver in 3G W-CDMA user equipment, translating 2.1 GHz RF to first IF at 190 MHz. IC Role / Device Role / Timing Role: First-stage RF mixer with DC–800 MHz IF bandwidth enabling flexible IF planning and I/Q demodulation. Use Value: Stable conversion loss (±0.5 dB) over −40°C to +85°C ensures consistent receiver sensitivity across environmental conditions. |
| 2.4 GHz ISM Radio | MMDS Receiver |
Use Scenario: Low-cost 2.4 GHz Wi-Fi or Bluetooth coexistence module requiring compact, low-power RF front-end. IC Role / Device Role / Timing Role: Passive mixer used in zero-IF receiver architecture with integrated LNA and baseband ADC. Use Value: MSOP8 size and no-bias operation enable minimal PCB area and simplified power delivery vs. active mixers. | Use Scenario: Fixed wireless broadband receiver operating in 2.5–2.7 GHz MMDS band, converting to 70 MHz IF for demodulation. IC Role / Device Role / Timing Role: High-isolation mixer minimizing LO feedthrough into sensitive LNA stages upstream. Use Value: 30 dB min LO-to-RF isolation prevents desensitization of front-end LNAs during simultaneous transmit/receive operation. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar passive mixer applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| HMC1048LP3E | Wider RF range (1.5–4.0 GHz), higher IP3 (+23 dBm), QFN16 package (4×4 mm), requires external balun for balanced RF. | Better suited for 3.5 GHz LTE and 5 GHz UNII bands; larger footprint limits ultra-compact designs. | Select when broader RF coverage or higher linearity outweighs MSOP8 size constraint. |
| ADL5801ACPZ-R7 | Active double-balanced mixer, 0.4–6.0 GHz RF, +26 dBm IP3, +15 dB conversion gain, 5×5 mm LFCSP. | Provides gain instead of loss; requires 5 V/60 mA bias; not drop-in due to active architecture and different port matching. | Choose for receiver chains needing gain and improved noise figure, accepting added power and complexity. |
Compared with HMC1048LP3E and ADL5801ACPZ-R7, the HMC272AMS8 offers the smallest footprint and zero-bias operation ideal for size- and power-constrained PCS/W-CDMA modules, whereas alternatives trade size for bandwidth or add gain at the cost of biasing and layout overhead.
Availability
HMC272AMS8 is available at Aetrix Electronics and suitable for PCS infrastructure, W-CDMA handsets, and 2.4 GHz ISM radio designs requiring stable component supply, RoHS-compliant sourcing, and long-term industrial availability.
Supply support for HMC272AMS8 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Analog Devices acquired Hittite Microwave in 2014, integrating its high-frequency RF/Microwave portfolio into ADI's Communications and RF Solutions division.
The HMC272AMS8 belongs to Hittite's legacy GaAs MMIC SMT mixer family, designed specifically for compact, high-performance wireless infrastructure and portable radio front-ends operating below 3 GHz.
FAQ
What is the recommended LO drive level for optimal performance of the HMC272AMS8?
The HMC272AMS8 achieves best linearity and conversion loss at LO = +10 dBm, with usable range from +7 dBm to +13 dBm. At +10 dBm, typical input IP3 is +20 dBm and conversion loss is 10.5 dB at 100 MHz IF. Lower LO drive increases conversion loss; higher drive risks compression or degradation of IP3. The HMC272AMS8 does not require DC bias, so LO drive is the sole operational control parameter.
Does the HMC272AMS8 require external baluns for RF port operation?
No, the HMC272AMS8 integrates a monolithic planar transformer balun on the GaAs die, making it a self-contained single-balanced mixer. Pins 1 and 2 form the balanced RF port; no external balun is needed. This integration improves amplitude/phase balance and saves PCB area versus discrete solutions. The IF port (Pin 5) is unbalanced and DC-coupled, matching standard 50 Ω IF amplifier inputs.
What is the thermal management requirement for the HMC272AMS8 in continuous operation?
The HMC272AMS8 has no DC power dissipation (passive device), but RF/LO power handling depends on thermal conduction via the exposed paddle. The datasheet mandates soldering the paddle to a solid PCB ground plane with ≥4 thermal vias (0.3 mm diameter) to maintain junction temperature within −40°C to +85°C ambient. Without proper paddle grounding, RF performance degrades and ESD robustness falls below Class 1A specification.
Can the HMC272AMS8 be used in a direct-conversion (zero-IF) receiver architecture?
Yes, the HMC272AMS8 supports DC–800 MHz IF bandwidth and is routinely used in zero-IF receivers. Its DC-coupled IF output (Pin 5) interfaces directly with baseband amplifiers or ADC drivers. Because it is passive and unidirectional, LO leakage to IF is negligible, and its balanced RF port rejects even-order distortion - both critical for I/Q demodulator front-ends in 2.4 GHz ISM and W-CDMA applications.
How does the HMC272AMS8 differ from the HMC272AMS8E variant?
The HMC272AMS8E is the RoHS-compliant version with 100% matte tin lead finish and MSL1 rating for peak reflow at 260°C, while the HMC272AMS8 uses Sn/Pb finish and max reflow of 235°C. Both share identical electrical specs, pinout, and package dimensions. The "E" suffix denotes environmental compliance only; they are functionally interchangeable in new designs where RoHS is required, though legacy Sn/Pb assembly lines may prefer the non-E variant.
HMC272AMS8 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Analog Devices Inc.
- Series:
- -
- Package/Case:
- 8-TSSOP, 8-MSOP (0.118", 3.00mm Width)
- Packaging:
- Strip
- Product Status:
- Obsolete
- RF Type:
- General Purpose
- Frequency:
- 1.7GHz ~ 3GHz
- Number of Mixers:
- 1
- Gain:
- -
- Noise Figure:
- 9dB
- Secondary Attributes:
- Up/Down Converter
- Current - Supply:
- -
- Voltage - Supply:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 8-MSOP
HMC272AMS8 FAQ
1.How can I place an order for HMC272AMS8 through Aetrix?
Please submit a Request for Quotation (RFQ) for HMC272AMS8 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for HMC272AMS8 reliable?
The price and inventory of HMC272AMS8 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for HMC272AMS8 is usually 5 days.
3.What payment methods are accepted for HMC272AMS8?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for HMC272AMS8 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for HMC272AMS8?
HMC272AMS8 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your HMC272AMS8 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for HMC272AMS8?
For technical support, including HMC272AMS8 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your HMC272AMS8 requirements.
6.How does Aetrix verify that HMC272AMS8 is sourced from the original manufacturer or authorized distributors?
All HMC272AMS8 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that HMC272AMS8 meets industry standards.
7.What is the process for return or replacement of HMC272AMS8?
All HMC272AMS8 units undergo pre-shipment inspection (PSI). If there is an issue with HMC272AMS8, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The HMC272AMS8 part is unused and in its original packaging.
Return procedure for HMC272AMS8:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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