Analog Devices Inc. HMC284AMS8GTR
- Part No.:
- HMC284AMS8GTR
- Manufacturer:
- Analog Devices Inc.
- Category:
- RF Switches
- Package:
- 8-TSSOP, 8-MSOP (0.118", 3.00mm Width) Exposed Pad
- Datasheet:
-
HMC284AMS8GTR.pdf
- Description:
- IC RF SWITCH SPDT 3.5GHZ 8MSOP
- Quantity:
- Payment:

- Shipping:

Inventory:4,038
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Product details
Overview
HMC284AMS8GTR from Analog Devices is a non-reflective SPDT RF switch optimized for DC–3.5 GHz operation, delivering 0.7 dB typical insertion loss at 3.5 GHz, >45 dB isolation between RF1/RF2 paths, and +29 dBm input power handling at 3.5 GHz. It serves as a signal path selector in cellular base station front-ends, ISM band transceivers, and wireless local loop systems.
For engineers reviewing the HMC284AMS8GTR datasheet, HMC284AMS8GTR pinout, HMC284AMS8GTR application, or HMC284AMS8GTR equivalent, key selection criteria include its 0/+5 V positive control logic, MSOP8G grounded-base package, non-reflective OFF-state termination, and verified performance across -40°C to +85°C industrial temperature range.
Technical Context
The HMC284AMS8GTR implements a monolithic GaAs pHEMT-based SPDT architecture with integrated DC blocking and on-chip termination for both RF1 and RF2 ports in the OFF state. Its control interface accepts TTL/CMOS-compatible 0/+5 V inputs with sub-1 µA leakage current, enabling direct drive without level-shifting circuitry.
Thermal design relies on a thermally enhanced MSOP8G package with exposed paddle soldered to PCB ground, achieving 130 °C/W thermal resistance along the insertion loss path. The device maintains stable RF performance under hot-switch conditions up to +18 dBm and supports fast switching with 5 ns rise/fall times and 20 ns ON/OFF delays.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Frequency Range | DC to 3.5 GHz - supports full-band operation from baseband through 3.5 GHz wireless local loop and ISM bands |
| Insertion Loss (3.5 GHz) | 0.7 dB typ - ensures minimal signal attenuation in active path for high-efficiency RF routing |
| Isolation (RF1/RF2, 3.5 GHz) | 40 dB min - prevents crosstalk between switched paths in dense multi-antenna systems |
| Input P1dB (3.5 GHz) | +29 dBm - enables use in medium-power transmit/receive front-ends without external attenuation |
| Switching Speed (tRISE) | 5 ns - supports rapid TDD mode transitions and time-division multiplexing |
| Control Voltage | 0/+5 V - directly interfaces with standard CMOS/TTL logic without level shifters or pull-up resistors |
| Operating Temp | -40°C to +85°C - qualified for outdoor base station and industrial wireless infrastructure deployment |
Pinout & Package
Package: MSOP8G (8-lead grounded-base mini small outline package) with exposed thermal paddle requiring solder connection to PCB RF ground plane per Analog Devices layout guidelines.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| RFC | Common RF Input | Single-port RF entry point shared by both switched paths; requires DC blocking capacitor |
| RF1 | RF Output Path 1 | Non-reflective termination when OFF; matched to 50 Ω in ON state |
| RF2 | RF Output Path 2 | Non-reflective termination when OFF; matched to 50 Ω in ON state |
| A | Control Input A | Logic-selects RFC→RF1 path when low (0 V); tolerates ±0.2 V DC offset |
| B | Control Input B | Logic-selects RFC→RF2 path when low (0 V); complements A for SPDT truth table |
| GND | Ground Terminal | All eight pins include ground connections; bottom paddle must be soldered to PCB ground for thermal and RF integrity |
Key Features
| Feature | Design Value |
|---|---|
| Non-reflective OFF-state | Both RF1 and RF2 present 50 Ω termination when inactive, preventing signal reflections in antenna diversity or T/R switching |
| Ultra-small MSOP8G | 3 mm × 3 mm footprint with thermal paddle - enables high-density RF module layouts in space-constrained baseband boards |
| Positive voltage control | 0/+5 V logic eliminates need for negative bias supplies or level translators in modern digital control systems |
| High isolation >45 dB | Measured at 2.5 GHz - suppresses inter-path coupling critical for MIMO and carrier aggregation architectures |
Applications
| Cellular Base Station Front-End | 2.4 GHz ISM Transceiver |
|---|---|
Use Scenario: Antenna switching between transmit and receive paths in macrocell BTS with dual-polarized antennas. IC Role / Device Role / Timing Role: SPDT RF switch routing main RF signal between PA output and LNA input while maintaining isolation during TDD guard intervals. Use Value: 40 dB isolation at 3.5 GHz prevents PA leakage from desensitizing LNA; non-reflective OFF-state avoids VSWR degradation on shared antenna port. | Use Scenario: Channel selection between two independent 2.4 GHz ISM band radios sharing a single antenna. IC Role / Device Role / Timing Role: Signal path selector enabling time-shared antenna access for Wi-Fi/BT coexistence or dual-radio IoT gateways. Use Value: 0.7 dB insertion loss preserves link budget; 5 ns switching speed supports fast channel hopping protocols like IEEE 802.15.4g. |
| 3.5 GHz Wireless Local Loop | Point-to-Multipoint Radio Access |
Use Scenario: Uplink/downlink path selection in fixed wireless access CPE operating in 3.5 GHz licensed band. IC Role / Device Role / Timing Role: Bidirectional RF switch managing duplexing function where FDD is unavailable and TDD timing demands fast path reconfiguration. Use Value: +29 dBm P1dB handles peak transmit power without compression; -40°C to +85°C rating ensures outdoor cabinet reliability. | Use Scenario: Sector antenna switching in multi-sector base stations serving overlapping coverage zones. IC Role / Device Role / Timing Role: RF path router directing common RF chain to one of multiple directional antennas under microcontroller control. Use Value: MSOP8G package allows placement adjacent to antenna connectors; grounded paddle minimizes radiation from switch substrate in high-isolation arrays. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar SPDT RF switch applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| HMC547LP3E | Wider bandwidth (DC–6 GHz), higher isolation (48 dB @ 3.5 GHz), but larger 16-lead QFN package and +3.3 V control | Suitable for 5G NR FR1 and higher-frequency test equipment where bandwidth exceeds 3.5 GHz | Select HMC547LP3E only if extended frequency coverage or tighter isolation is required; not drop-in due to different pinout and voltage |
| Qorvo QM11036 | Same MSOP8G footprint, 0/+3.3 V control, lower P1dB (+24 dBm @ 3.5 GHz), and reduced isolation (35 dB) | Targeted at cost-sensitive consumer ISM modules where +24 dBm linearity suffices | Choose QM11036 for 3.3 V logic systems with relaxed linearity needs; verify layout compatibility despite identical package outline |
Compared with HMC547LP3E and QM11036, the HMC284AMS8GTR delivers optimal balance of 3.5 GHz performance, 0/+5 V compatibility, and compact MSOP8G integration-making it preferred for industrial-grade wireless infrastructure where proven reliability and thermal robustness are prioritized over maximum bandwidth or lowest cost.
Availability
HMC284AMS8GTR is available at Aetrix Electronics and suitable for cellular base stations, 2.4 GHz ISM transceivers, and 3.5 GHz wireless local loop systems requiring stable component supply, long-term lifecycle support, and traceable sourcing from authorized channels.
Supply support for HMC284AMS8GTR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Analog Devices, Inc. is a global leader in high-performance analog, mixed-signal, and RF ICs, serving communications, industrial, automotive, and healthcare markets with precision signal processing solutions.
The HMC284AMS8GTR belongs to Analog Devices' Hittite Microwave RF Switch product line, engineered specifically for high-isolation, low-loss signal routing in wireless infrastructure and test instrumentation where thermal stability and non-reflective behavior are mandatory.
FAQ
What is the recommended DC blocking capacitor value for HMC284AMS8GTR RF ports?
The HMC284AMS8GTR requires external DC blocking capacitors at RFC, RF1, and RF2 ports. A 100 pF, 0402-size capacitor is specified in the official evaluation board (PCB #107821) and supports operation down to ~50 MHz. Lower values extend upper frequency response but reduce low-end cutoff; higher values improve low-frequency passband at the expense of size and parasitic inductance. Always verify impedance match with vector network analyzer.
Does HMC284AMS8GTR require a separate Vdd supply?
No, the HMC284AMS8GTR does not require a Vdd supply. It operates solely from the 0/+5 V control signals applied to pins A and B. No external power rail is needed-the device draws negligible DC current (<1 µA per control pin) and derives all bias internally from the control inputs. This simplifies system-level power architecture and eliminates need for dedicated LDOs or filtering.
Can HMC284AMS8GTR be used in hot-switch applications?
Yes, the HMC284AMS8GTR is rated for hot-switch operation up to +18 dBm RF input power with control voltages at 0/+5 V. This capability is validated per Analog Devices' absolute maximum ratings and enables use in TDD systems where RF signal remains present during path reconfiguration. Exceeding +18 dBm during switching may cause accelerated degradation; always limit hot-switch power to this threshold unless using elevated control voltages (e.g., 0/+7 V) per datasheet guidance.
What is the ESD sensitivity classification for HMC284AMS8GTR?
The HMC284AMS8GTR is classified as Class 1A per Human Body Model (HBM) ESD testing, indicating sensitivity to discharges as low as 250 V. Handling requires strict adherence to ESD-safe practices: grounded wrist straps, conductive foam storage, ionized air environments, and avoidance of direct pin contact. The device's exposed paddle and fine-pitch leads increase vulnerability-never place bare HMC284AMS8GTR on ungrounded surfaces or handle with ungloved fingers.
How should the thermal paddle of HMC284AMS8GTR be connected on the PCB?
The exposed thermal paddle of the HMC284AMS8GTR must be soldered to a solid, low-impedance RF ground plane on the PCB using a grid of ≥ nine 0.3 mm diameter thermal vias spaced ≤ 1 mm apart beneath the paddle. Per Analog Devices' layout notes, all eight perimeter ground pins and the paddle must connect to the same ground net. Failure to properly solder the paddle results in thermal runaway above +20 dBm and degraded isolation due to ground inductance.
HMC284AMS8GTR Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Analog Devices Inc.
- Series:
- -
- Package/Case:
- 8-TSSOP, 8-MSOP (0.118", 3.00mm Width) Exposed Pad
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Obsolete
- RF Type:
- Cellular, ISM, PCS
- Topology:
- Absorptive
- Circuit:
- SPDT
- Frequency Range:
- 0Hz ~ 3.5GHz
- Isolation:
- 40dB
- Insertion Loss:
- 0.7dB
- Test Frequency:
- 3.5GHz
- P1dB:
- 29dBm
- IIP3:
- 50dBm (min)
- Features:
- -
- Impedance:
- 50Ohm
- Voltage - Supply:
- -
- Operating Temperature:
- -40°C ~ 85°C
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 8-MSOPG
HMC284AMS8GTR FAQ
1.How can I place an order for HMC284AMS8GTR through Aetrix?
Please submit a Request for Quotation (RFQ) for HMC284AMS8GTR on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for HMC284AMS8GTR reliable?
The price and inventory of HMC284AMS8GTR are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for HMC284AMS8GTR is usually 5 days.
3.What payment methods are accepted for HMC284AMS8GTR?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for HMC284AMS8GTR transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for HMC284AMS8GTR?
HMC284AMS8GTR orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your HMC284AMS8GTR order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for HMC284AMS8GTR?
For technical support, including HMC284AMS8GTR datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your HMC284AMS8GTR requirements.
6.How does Aetrix verify that HMC284AMS8GTR is sourced from the original manufacturer or authorized distributors?
All HMC284AMS8GTR products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that HMC284AMS8GTR meets industry standards.
7.What is the process for return or replacement of HMC284AMS8GTR?
All HMC284AMS8GTR units undergo pre-shipment inspection (PSI). If there is an issue with HMC284AMS8GTR, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The HMC284AMS8GTR part is unused and in its original packaging.
Return procedure for HMC284AMS8GTR:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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