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Analog Devices Inc. HMC292
- Part No.:
- HMC292
- Manufacturer:
- Analog Devices Inc.
- Category:
- RF Mixers
- Package:
- Die
- Datasheet:
-
HMC292.pdf
- Description:
- IC MMIC MIXER HI IP3 DIE
- Quantity:
- Payment:
- Shipping:
Inventory:1,274
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Product details
Overview
HMC292LC3B from Analog Devices (formerly Hittite Microwave) is a GaAs MMIC passive double-balanced mixer operating from 16 to 30 GHz RF/LO and DC–8 GHz IF, delivering typical conversion loss of 9.5 dB, +20 dBm input IP3, and 40 dB LO/RF isolation in a 12-lead 3×3 mm ceramic SMT package. It functions as an upconverter or downconverter in millimeter-wave radios without external matching components.
For engineers reviewing the HMC292LC3B datasheet, HMC292LC3B pinout, HMC292LC3B application, or HMC292LC3B equivalent, key selection criteria include its LO drive requirement (+9 dBm minimum), robust Class 1C ESD rating, wide IF bandwidth supporting DC-coupled operation, and compatibility with surface-mount manufacturing due to wire-bond-free construction.
Technical Context
The HMC292LC3B implements a passive fundamental mixer architecture using balanced GaAs Schottky diode pairs integrated into optimized on-chip balun structures, enabling high LO-to-RF and LO-to-IF suppression without DC bias. Its RF and LO ports are DC-coupled and 50 Ω matched across 16–30 GHz.
Operation requires LO drive ≥+9 dBm; performance is characterized at +13 dBm LO. The IF port supports DC coupling but limits current to ±2 mA to prevent malfunction. Thermal resistance is 250 °C/W (junction-to-ground paddle), with continuous power dissipation rated at 260 mW at 85 °C ambient.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Frequency Range (RF/LO) | 16–30 GHz - Full-band operation without tuning; usable as up/downconverter in E-band systems. |
| IF Bandwidth | DC–8 GHz - Supports baseband and wideband IF signals including zero-IF architectures. |
| Conversion Loss | Typ. 9.5 dB - Predictable signal attenuation; no gain stage required for many receiver front-ends. |
| Input IP3 | +20 dBm - Enables handling of strong interferers in dense RF environments like point-to-point links. |
| LO/RF Isolation | Typ. 40 dB - Reduces LO leakage into antenna path, easing filtering requirements in transmitters. |
| ESD Rating | HBM Class 1C (1000 V) - Robust handling during SMT assembly and board-level integration. |
| Package | 12-lead ceramic 3×3 mm SMT - RoHS-compliant, MSL3, gold-over-nickel plating, ground paddle for thermal and RF grounding. |
Pinout & Package
12-lead leadless ceramic package (3×3 mm, 9 mm² body), alumina substrate, gold-over-nickel plating, exposed ground paddle requiring solder connection to PCB RF ground plane.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1, 3, 4, 6, 7, 9 | GND | RF/DC ground terminals; must be soldered to PCB ground plane for optimal isolation and thermal performance. |
| 2 | LO | DC-coupled 50 Ω matched input; accepts +9 to +27 dBm LO drive without external biasing. |
| 5 | IF | DC-coupled output; supports DC–8 GHz; limited to ±2 mA current to avoid damage or non-function. |
| 8 | RF | DC-coupled 50 Ω matched RF port; operates 16–30 GHz without external matching networks. |
| 10, 11, 12 | N/C | No internal connection; may be grounded without affecting RF performance or thermal path. |
Key Features
| Feature | Design Value |
|---|---|
| No DC bias required | Passive diode-based architecture eliminates need for bias circuitry, reducing BOM count and layout complexity. |
| Wire-bond-free construction | Monolithic GaAs MMIC design enables full SMT assembly without wire bonding, improving manufacturing yield and reliability. |
| Optimized balun structures | Integrated baluns deliver >40 dB LO/RF isolation and >32 dB LO/IF isolation, minimizing spurious mixing products. |
| Robust ESD protection | Class 1C (1000 V HBM) rating allows safe handling in standard SMT lines without special ESD controls beyond Class 1C compliance. |
| DC-coupled IF port | Enables true zero-IF and complex I/Q architectures without series DC-blocking capacitors in critical signal paths. |
Applications
| Point-to-Point Radios | Test Equipment & Sensors |
|---|---|
Use Scenario: High-capacity backhaul links operating in 24 GHz or 28 GHz licensed bands requiring low-conversion-loss, high-linearity mixing. IC Role / Device Role / Timing Role: Downconverter in receiver chain and upconverter in transmitter chain, translating between RF and baseband/IF. Use Value: 9.5 dB typical conversion loss and +20 dBm IP3 maintain SNR and dynamic range under high adjacent-channel interference. | Use Scenario: Vector network analyzers and spectrum analyzers needing broadband, repeatable mixing performance across E-band. IC Role / Device Role / Timing Role: Fundamental mixer core in signal generation and analysis modules covering 16–30 GHz. Use Value: Wide 16–30 GHz RF/LO range and DC–8 GHz IF support enable single-device coverage of multiple test bands without reconfiguration. |
| Point-to-Multi-Point Radios & VSAT | Military End-Use |
Use Scenario: Subscriber unit and base station transceivers in fixed wireless access systems operating near 26 GHz. IC Role / Device Role / Timing Role: Bidirectional mixer in full-duplex or TDD radio front-ends, handling both transmit and receive paths. Use Value: 40 dB LO/RF isolation minimizes self-interference in compact form factors where LO leakage could desensitize receive path. | Use Scenario: Radar warning receivers and electronic warfare subsystems requiring rugged, high-reliability millimeter-wave mixing. IC Role / Device Role / Timing Role: Front-end mixer in wideband intercept receivers covering E-band threat frequencies. Use Value: Class 1C ESD rating and -40°C to +85°C operating range ensure survivability in harsh environmental deployments. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar passive double-balanced mixer applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| HMC1048LC3B | Wider RF/LO range (10–40 GHz); higher conversion loss (11.5 dB typ); same 3×3 mm package. | Better suited for multi-band test equipment spanning X through W-band; less optimal for narrowband 24–28 GHz radios. | Select when broader frequency coverage outweighs conversion loss penalty and LO drive margin is available. |
| QPC1006 | Higher IP3 (+24 dBm typ); narrower IF bandwidth (DC–4 GHz); GaN-on-SiC process; different 4×4 mm package. | Preferred for high-power EW systems where linearity dominates over IF bandwidth; not drop-in compatible. | Choose for extreme linearity demands above +22 dBm IP3, accepting larger footprint and reduced IF bandwidth. |
Compared with HMC292LC3B, HMC1048LC3B trades 2 dB higher conversion loss for 14 GHz lower RF cutoff, while QPC1006 delivers +4 dB IP3 in a larger package with half the IF bandwidth-making HMC292LC3B the optimal balance of size, linearity, and IF flexibility for E-band radios.
Availability
HMC292LC3B is available at Aetrix Electronics and suitable for point-to-point radios, test equipment & sensors, and military end-use applications requiring stable component supply, consistent parametric performance, and long-term obsolescence management.
Supply support for HMC292LC3B includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Analog Devices acquired Hittite Microwave in 2014 and maintains its high-frequency RF portfolio, specializing in microwave and millimeter-wave ICs for communications, defense, and instrumentation.
The HMC292LC3B belongs to Hittite's legacy GaAs MMIC mixer product line, designed specifically for compact, high-performance E-band transceivers where passive architecture, wide IF bandwidth, and SMT manufacturability are critical.
FAQ
What is the minimum LO drive level required for proper operation of the HMC292LC3B?
The HMC292LC3B requires a minimum LO drive level of +9 dBm for specified performance, as confirmed in the datasheet's General Description and Electrical Specifications table. Operating below this level degrades conversion loss, isolation, and IP3. Typical characterization uses +13 dBm LO drive, and absolute maximum LO is +27 dBm. Exceeding +27 dBm risks permanent damage to the GaAs diode junctions within the HMC292LC3B.
Can the HMC292LC3B be used in zero-IF (direct-conversion) receiver architectures?
Yes, the HMC292LC3B supports zero-IF operation because its IF port is DC-coupled and specified from DC to 8 GHz. However, the IF pin must not source or sink more than ±2 mA DC current to prevent malfunction or failure. For true DC-coupled baseband interfaces, external current-limiting or biasing networks may be required to comply with this constraint while maintaining signal integrity in the HMC292LC3B.
What is the thermal management requirement for the HMC292LC3B in continuous operation?
The HMC292LC3B has a thermal resistance of 250 °C/W (junction-to-ground paddle) and a maximum continuous power dissipation of 260 mW at 85 °C ambient. To maintain reliability, the exposed ground paddle must be soldered to a thermally robust PCB ground plane with multiple vias to an internal ground layer or heatsink. Derating is 4.0 mW/°C above 85 °C ambient, meaning operation at 100 °C ambient reduces max dissipation to 200 mW for the HMC292LC3B.
Does the HMC292LC3B require external matching components for RF, LO, or IF ports?
No, the HMC292LC3B requires no external matching components: all RF, LO, and IF ports are DC-coupled and internally matched to 50 Ω across their specified frequency ranges (16–30 GHz for RF/LO, DC–8 GHz for IF). This eliminates discrete matching networks, simplifies layout, and improves repeatability-key advantages explicitly stated in the device's General Description and confirmed in the Functional Diagram and Pin Descriptions for the HMC292LC3B.
What does the "LC3B" suffix indicate in the HMC292LC3B part number?
The "LC3B" suffix denotes the package variant: "L" = leadless, "C" = ceramic, "3" = 3×3 mm body size, and "B" = specific revision or internal process variant per Hittite/Analog Devices' naming convention. This matches the documented 12-lead ceramic 3×3 mm SMT package with gold-over-nickel plating and MSL3 rating, distinguishing it from older leaded or larger-footprint variants of the HMC292 family.
HMC292 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Analog Devices Inc.
- Series:
- -
- Package/Case:
- Die
- Packaging:
- Bulk
- Product Status:
- Obsolete
- RF Type:
- General Purpose
- Frequency:
- 16GHz ~ 30GHz
- Number of Mixers:
- 1
- Gain:
- -
- Noise Figure:
- 9.5dB
- Secondary Attributes:
- Up/Down Converter
- Current - Supply:
- -
- Voltage - Supply:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- Die
HMC292 FAQ
1.How can I place an order for HMC292 through Aetrix?
Please submit a Request for Quotation (RFQ) for HMC292 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for HMC292 reliable?
The price and inventory of HMC292 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for HMC292 is usually 5 days.
3.What payment methods are accepted for HMC292?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for HMC292 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for HMC292?
HMC292 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your HMC292 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for HMC292?
For technical support, including HMC292 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your HMC292 requirements.
6.How does Aetrix verify that HMC292 is sourced from the original manufacturer or authorized distributors?
All HMC292 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that HMC292 meets industry standards.
7.What is the process for return or replacement of HMC292?
All HMC292 units undergo pre-shipment inspection (PSI). If there is an issue with HMC292, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The HMC292 part is unused and in its original packaging.
Return procedure for HMC292:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
HMC292 Tags
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MAX2671EUT+T
Analog Devices Inc./Maxim Integrated
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ADEX-10+
Mini-Circuits
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ADE-2+
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ADE-1+
Mini-Circuits
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LT5560EDD#PBF
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LT5560EDD#TRPBF
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LTC5562IUC#TRPBF
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MAX2681EUT+T
Analog Devices Inc./Maxim Integrated
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ADE-1ASK+
Mini-Circuits
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ADE-1L+
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ADL5350ACPZ-R7
Analog Devices Inc.
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AD608ARZ-RL
Analog Devices Inc.
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