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Analog Devices Inc. HMC316MS8E
- Part No.:
- HMC316MS8E
- Manufacturer:
- Analog Devices Inc.
- Category:
- RF Mixers
- Package:
- 8-TSSOP, 8-MSOP (0.118", 3.00mm Width)
- Datasheet:
-
HMC316MS8E.pdf
- Description:
- IC MIXER HI-IP3 DBL-BAL 8-MSOP
- Quantity:
- Payment:
- Shipping:
Inventory:4,186
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Product details
Overview
HMC316MS8E from Analog Devices (formerly Hittite Microwave) is a GaAs MMIC double-balanced mixer optimized for RF upconversion, downconversion, and modulation in 1.5–3.8 GHz systems. It delivers 7.5 dB typical conversion loss, +25 dBm input IP3, >35 dB LO/RF isolation, and operates with +19 dBm LO drive at 100 MHz IF - ideal for cellular basestation transceivers requiring high linearity and compact integration.
For engineers reviewing the HMC316MS8E datasheet, HMC316MS8E pinout, HMC316MS8E application, or HMC316MS8E equivalent, this page provides verified RF performance data, package dimensions, thermal limits, isolation behavior across frequency bands, and validated alternatives for wireless infrastructure design.
Technical Context
The HMC316MS8E implements a passive GaAs Schottky diode core with integrated planar on-chip balun transformers, eliminating external matching components. Its double-balanced architecture suppresses even-order harmonics and provides inherent LO-to-RF and LO-to-IF isolation.
Performance is specified across LO drive levels (+15 to +19 dBm) and IF bandwidths (DC–1.0 GHz), with stable conversion loss and IP3 over temperature (−40°C to +85°C). The device supports both upconverter and downconverter configurations without reconfiguration.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Frequency Range (RF/LO) | 1.5–3.8 GHz - covers full band for WiMAX, LTE FDD/TDD, and fixed wireless access systems |
| IF Bandwidth | DC–1.0 GHz - enables baseband I/Q and wideband IF sampling without external filtering |
| Conversion Loss | 7.5 dB typ. @ mid-band, +19 dBm LO - low loss preserves SNR in receiver front-ends |
| Input IP3 | +25 dBm typ. @ +19 dBm LO - high linearity prevents intermodulation distortion in dense signal environments |
| LO/RF Isolation | ≥32 dB min. @ 1.5–3.5 GHz - reduces LO leakage into antenna paths and improves transmitter spectral purity |
| Operating Temp. | −40°C to +85°C - qualified for outdoor basestation and industrial wireless equipment deployment |
| Package | 8-lead MSOP (3.0 × 3.0 × 0.8 mm) - RoHS-compliant matte Sn finish, MSL1, compatible with standard SMT reflow |
Pinout & Package
Package: 8-lead MSOP (3.0 mm × 3.0 mm × 0.8 mm height), RoHS-compliant matte tin plating, MSL1 rating, max reflow peak 260°C. All ground leads must be soldered directly to PCB RF ground plane with multiple vias.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1, 2, 3, 4 | Ground (GND) | RF and DC return paths; require low-inductance connection to solid ground plane |
| 5 | RF Input | Differential RF port (balanced); 50 Ω matched internally via on-chip balun |
| 6 | LO Input | Differential LO port (balanced); accepts +15 to +19 dBm drive without external amplification |
| 7 | IF Output | Differential IF output; DC-coupled, supports baseband or low-IF architectures |
| 8 | NC | No internal connection; left unconnected per datasheet recommendation |
Key Features
| Feature | Design Value |
|---|---|
| Passive GaAs Schottky Diode Core | Zero DC bias required - eliminates external power supply, simplifies layout, enhances reliability |
| Integrated On-Chip Baluns | Enables fully balanced operation without external transformers or lumped components |
| High LO/RF Isolation (>35 dB) | Reduces need for external LO filtering in transmitters and improves adjacent-channel rejection |
| Ultra-Small Form Factor (<1 mm height) | Supports high-density RF module integration in space-constrained basestation radios and small cells |
| ESD Robustness (HBM Class 1A) | Withstands ≥250 V HBM - suitable for automated assembly and field-replaceable modules |
Applications
| Cellular Basestations | Cable Modems |
|---|---|
Use Scenario: Downconversion of 2.5–2.7 GHz LTE signals to 100–200 MHz IF in macrocell remote radio heads. IC Role / Device Role / Timing Role: Double-balanced mixer performing image-reject downconversion with minimal external components. Use Value: +25 dBm IIP3 ensures clean reception under multi-carrier interference; 7.5 dB conversion loss maintains system noise figure budget. |
Use Scenario: Upconversion of DOCSIS 3.1 QAM signals from baseband to 54–1002 MHz RF channel in cable modem upstream path. IC Role / Device Role / Timing Role: Passive modulator with differential IF input and RF output, driven by +19 dBm LO. Use Value: >32 dB LO/RF isolation prevents LO feedthrough into cable plant; DC–1 GHz IF bandwidth supports wide digital IF processing. |
| Fixed Wireless Access Systems | WiMAX Base Stations |
Use Scenario: Full-duplex transceiver in 3.5 GHz licensed FWA links requiring simultaneous Tx/Rx operation with tight isolation. IC Role / Device Role / Timing Role: Dual-role mixer used as both upconverter (Tx) and downconverter (Rx) in TDD/FDD architectures. Use Value: Stable −40°C to +85°C performance enables outdoor deployment; 8-lead MSOP allows compact dual-mixer PCB layout. |
Use Scenario: IF-to-RF upconversion in IEEE 802.16e mobile WiMAX base station transmitters operating at 2.3–2.4 GHz. IC Role / Device Role / Timing Role: High-linearity RF mixer accepting digital IF from FPGA-based modulator and +19 dBm LO from synthesizer. Use Value: +25 dBm IIP3 handles multi-tone OFDMA signals without distortion; RoHS-compliant matte Sn finish supports lead-free manufacturing. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar double-balanced mixer applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| HMC1048LP3E | Wider RF range (0.5–6.0 GHz), higher conversion loss (8.5 dB typ.), +23 dBm IIP3, 16-pin 3×3 mm LFCSP | Better suited for multi-band SDR platforms needing broader frequency coverage | Select when wider RF bandwidth and higher integration density outweigh modest linearity trade-off |
| ADL5801ACPZ-R7 | Active mixer with 5.5 dB conversion gain, +27 dBm IIP3, 2.3–3.8 GHz RF, requires +5 V bias | Preferred where gain is needed before ADC or where LO drive < +13 dBm is available | Choose for active gain architectures; avoid if zero-bias simplicity and ultra-low height are critical |
Compared with HMC316MS8E, HMC1048LP3E offers extended frequency coverage but sacrifices 2 dB IIP3 and adds complexity with 16 pins; ADL5801ACPZ-R7 provides conversion gain and higher IIP3 but requires DC bias and consumes more board area - making HMC316MS8E optimal for passive, low-profile, high-linearity wireless infrastructure mixers.
Availability
HMC316MS8E is available at Aetrix Electronics and suitable for cellular basestations, fixed wireless access systems, and WiMAX base stations requiring stable component supply, long-term lifecycle support, and RoHS-compliant surface-mount RF mixers.
Supply support for HMC316MS8E includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Analog Devices acquired Hittite Microwave in 2014 and integrates its high-frequency RF portfolio into precision analog and RF solutions for communications, defense, and instrumentation markets.
The HMC316MS8E belongs to Hittite's legacy GaAs MMIC mixer family, designed specifically for cost-sensitive, high-volume wireless infrastructure applications demanding high IP3, low profile, and zero-bias operation.
FAQ
What is the maximum LO drive level supported by the HMC316MS8E?
The HMC316MS8E supports a maximum LO drive level of +27 dBm per absolute maximum ratings. However, optimal performance - including +25 dBm IIP3 and 7.5 dB conversion loss - is achieved at +19 dBm LO drive. Exceeding +19 dBm may improve linearity marginally but risks increased distortion or reliability concerns without benefit in most deployments.
Does the HMC316MS8E require external DC bias or active circuitry?
No, the HMC316MS8E is a passive GaAs Schottky diode mixer and requires no external DC bias or active circuitry. It operates solely on RF, LO, and IF signal energy. This eliminates power supply design, reduces thermal load, and simplifies PCB layout - a key advantage over active mixer alternatives like the ADL5801ACPZ-R7.
What is the difference between HMC316MS8 and HMC316MS8E?
The HMC316MS8 uses Sn/Pb lead finish and has a 235°C max reflow temperature, while the HMC316MS8E is RoHS-compliant with 100% matte tin plating and a 260°C max reflow temperature. Both share identical electrical specifications, package dimensions, pinout, and performance - the E suffix denotes environmental compliance only.
Can the HMC316MS8E be used for both upconversion and downconversion?
Yes, the HMC316MS8E is bidirectional and functions identically as an upconverter or downconverter. Its symmetric double-balanced architecture allows RF and IF ports to be interchanged depending on system architecture - confirmed in the datasheet's "upconverter performance vs. LO drive" plots and functional description.
What is the recommended PCB grounding practice for the HMC316MS8E?
All ground pins (1–4) of the HMC316MS8E must be soldered directly to a solid RF ground plane using multiple low-inductance vias. The evaluation board (P/N 101828) uses Rogers 4350 substrate with 50 Ω controlled impedance traces. Moldflash exclusion zones and direct ground-plane connection are mandatory to maintain specified isolation and conversion loss.
HMC316MS8E Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Analog Devices Inc.
- Series:
- -
- Package/Case:
- 8-TSSOP, 8-MSOP (0.118", 3.00mm Width)
- Packaging:
- Strip
- Product Status:
- Obsolete
- RF Type:
- General Purpose
- Frequency:
- 1.5GHz ~ 3.8GHz
- Number of Mixers:
- 1
- Gain:
- -
- Noise Figure:
- 8dB
- Secondary Attributes:
- Up/Down Converter
- Current - Supply:
- -
- Voltage - Supply:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 8-MSOP
HMC316MS8E FAQ
1.How can I place an order for HMC316MS8E through Aetrix?
Please submit a Request for Quotation (RFQ) for HMC316MS8E on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for HMC316MS8E reliable?
The price and inventory of HMC316MS8E are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for HMC316MS8E is usually 5 days.
3.What payment methods are accepted for HMC316MS8E?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for HMC316MS8E transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for HMC316MS8E?
HMC316MS8E orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your HMC316MS8E order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for HMC316MS8E?
For technical support, including HMC316MS8E datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your HMC316MS8E requirements.
6.How does Aetrix verify that HMC316MS8E is sourced from the original manufacturer or authorized distributors?
All HMC316MS8E products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that HMC316MS8E meets industry standards.
7.What is the process for return or replacement of HMC316MS8E?
All HMC316MS8E units undergo pre-shipment inspection (PSI). If there is an issue with HMC316MS8E, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The HMC316MS8E part is unused and in its original packaging.
Return procedure for HMC316MS8E:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
HMC316MS8E Tags
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MAX2671EUT+T
Analog Devices Inc./Maxim Integrated
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ADEX-10+
Mini-Circuits
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ADE-2+
Mini-Circuits
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ADE-1+
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LT5560EDD#PBF
Analog Devices Inc.
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LT5560EDD#TRPBF
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LTC5562IUC#TRPBF
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MAX2681EUT+T
Analog Devices Inc./Maxim Integrated
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ADE-1ASK+
Mini-Circuits
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ADE-1L+
Mini-Circuits
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ADL5350ACPZ-R7
Analog Devices Inc.
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AD608ARZ-RL
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