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Analog Devices Inc. HMC329LC3BTR-R5

Part No.:
HMC329LC3BTR-R5
Manufacturer:
Analog Devices Inc.
Category:
RF Mixers
Package:
12-VFCQFN Exposed Pad
Datasheet:
AetrixHMC329LC3BTR-R5.pdf
Description:
IC MIXER MIXER 24-32GHZ 12SMD
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:4,451

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Product details

Overview

HMC329LC3BTR-R5 from Analog Devices (formerly Hittite Microwave) is a GaAs MMIC double-balanced passive mixer operating from 24–32 GHz RF/LO and DC–8 GHz IF, delivering 12.5 dB typical conversion loss, +18 dBm input IP3, and 38 dB LO/RF isolation in a 12-lead 3×3 mm ceramic SMT package. It functions as upconverter or downconverter in millimeter-wave radios without external matching or DC bias.

For engineers reviewing the HMC329LC3BTR-R5 datasheet, HMC329LC3BTR-R5 pinout, HMC329LC3BTR-R5 application, or HMC329LC3BTR-R5 equivalent, key selection criteria include its 24–32 GHz fundamental mixing capability, Class 1B ESD robustness, 50 Ω DC-coupled LO/RF/IF ports, and compatibility with surface-mount manufacturing for high-frequency wireless infrastructure.

Technical Context

The HMC329LC3BTR-R5 implements a passive double-balanced architecture using integrated baluns to achieve high LO-to-RF and LO-to-IF suppression-38 dB and 40 dB typical-enabling clean signal translation in dense spectral environments. Its fundamental mixing operation eliminates subharmonic LO drive requirements and supports wide IF bandwidth down to DC.

Designed for operation with LO drive ≥+9 dBm (optimal at +13 dBm), the device delivers stable conversion gain across –40°C to +85°C and maintains >20 dB RF-to-IF isolation. The absence of DC bias simplifies system power design while the 12-lead ceramic package ensures thermal stability and repeatable RF performance at Ka-band frequencies.

Key Specifications

Parameter Value and Actual Design Meaning
RF/LO Frequency Range24–32 GHz: Enables Ka-band point-to-point radio and VSAT up/downconversion without harmonic mixing.
IF BandwidthDC–8 GHz: Supports baseband through low microwave IF signals including radar pulse modulation and wideband test instrumentation.
Conversion Loss12.5 dB typical: Defines RF-to-IF signal attenuation; impacts receiver noise figure and transmitter output power budget.
Input IP3+18 dBm: Indicates strong two-tone linearity for handling adjacent-channel interferers in multi-carrier systems.
LO/RF Isolation38 dB typical: Reduces LO leakage into antenna paths, easing filtering requirements in full-duplex transceivers.
ESD RatingHBM Class 1B (500 V): Confirms robustness against handling-induced discharge during SMT assembly and board-level testing.
Operating Temp–40°C to +85°C: Validates suitability for outdoor wireless infrastructure and military environmental conditions.

Pinout & Package

12-lead leadless ceramic SMT package (3 × 3 × 0.9 mm), alumina body with gold-over-nickel plating, MSL Level 3, ground paddle soldered to PCB RF ground per datasheet requirement.

Pin/Terminal Circuit Role Design Meaning
1, 3, 4, 6, 7, 9GNDRF/DC ground terminals; all must be soldered to PCB ground plane to maintain 50 Ω impedance integrity and thermal dissipation.
2LODC-coupled 50 Ω matched port; accepts +9 to +15 dBm LO drive without external biasing or matching.
5IFDC-coupled port; supports DC–8 GHz IF; requires external series capacitor if DC blocking needed; ≤2 mA current limit.
8RFDC-coupled 50 Ω matched port; handles 24–32 GHz RF input/output with no external tuning components.
10, 11, 12N/CNo-connect pins; may be grounded without performance impact but require no routing or termination.

Key Features

Feature Design Value
No DC bias requiredEliminates bias networks and associated parasitics, reducing component count and layout complexity in Ka-band designs.
Double-balanced topologyProvides inherent rejection of LO feedthrough and even-order distortion, improving dynamic range in sensitive receivers.
Wide IF bandwidth (DC–8 GHz)Enables direct baseband sampling and wide instantaneous bandwidth applications such as electronic warfare and spectrum analyzers.
Robust 500 V HBM ESD protectionEnsures reliability during automated SMT placement and board handling without additional protection circuitry.
Leadless 3×3 mm ceramic packageOffers repeatable RF performance, low thermal resistance (170 °C/W), and compatibility with standard reflow profiles (MSL3).

Applications

Point-to-Point Radios VSAT Terminals

Use Scenario: High-capacity backhaul links operating in 26–28 GHz licensed bands requiring low-conversion-loss signal translation.

IC Role / Device Role / Timing Role: Downconverter translating 27 GHz RF to 1–3 GHz IF for ADC digitization; also used as upconverter in transmit path.

Use Value: 12.5 dB conversion loss and 38 dB LO/RF isolation minimize receive chain noise figure and reduce need for image-reject filtering.

Use Scenario: Outdoor satellite terminal transceivers needing reliable Ka-band mixing under temperature extremes and vibration.

IC Role / Device Role / Timing Role: Fundamental mixer in both LNB (downconversion) and BUC (upconversion) modules, operating from –40°C to +85°C.

Use Value: DC-coupled ports and Class 1B ESD support ruggedized field deployment without external bias or protection components.

Millimeter-Wave Test Equipment Military Radar Sensors

Use Scenario: Vector network analyzer front-ends and signal generators requiring wide IF bandwidth and low spurious generation.

IC Role / Device Role / Timing Role: Core mixing element in broadband stimulus-response measurement architectures covering DC–8 GHz IF.

Use Value: DC–8 GHz IF bandwidth enables single-instrument characterization of modulated waveforms up to 8 GHz modulation bandwidth.

Use Scenario: Active electronically scanned array (AESA) radar T/R module downconversion at 30 GHz for seeker or fire-control systems.

IC Role / Device Role / Timing Role: Low-phase-noise mixer in receiver chain, rejecting LO harmonics and suppressing m×n spurs per datasheet table (e.g., 2LO−RF = –72 dBc).

Use Value: High LO/IF isolation (40 dB typ.) prevents LO pulling in tightly coupled T/R modules, preserving radar coherence.

Equivalent & Alternatives

The following parts are listed as comparable options for similar Ka-band passive mixer applications.

Alternative Part Technical Difference Application Difference Selection Advice
HMC1048LP3EWider RF range (17–27 GHz), higher conversion loss (14 dB), smaller 3×3 mm QFN package without ground paddle.Better suited for lower Ka-band (UWB radar) but lacks DC–8 GHz IF bandwidth and 32 GHz upper edge.Select HMC1048LP3E only if operating below 27 GHz and board space constraints preclude ground paddle soldering.
Qorvo QM11024Same 24–32 GHz range, +16 dBm IP3, 34 dB LO/RF isolation, 4×4 mm QFN with exposed thermal pad.Higher thermal dissipation (Pdiss = 500 mW vs. 382 mW), but lower isolation increases filtering burden in full-duplex systems.Choose QM11024 when thermal management is critical and LO leakage can be filtered externally; verify IF bandwidth meets DC–6 GHz requirement.

Compared with HMC329LC3BTR-R5, HMC1048LP3E trades bandwidth and isolation for compactness, while QM11024 offers higher power handling at the cost of linearity and isolation-making HMC329LC3BTR-R5 optimal for balanced Ka-band performance where DC-coupled IF and robust ESD are mandatory.

Availability

HMC329LC3BTR-R5 is available at Aetrix Electronics and suitable for point-to-point radios, VSAT terminals, and millimeter-wave test equipment requiring stable component supply, RoHS-compliant SMT packaging, and guaranteed long-term availability for industrial and defense programs.

Supply support for HMC329LC3BTR-R5 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Analog Devices acquired Hittite Microwave in 2014 and integrates its high-frequency RF portfolio into ADI's broader signal chain solutions, emphasizing precision, speed, and reliability in wireless, defense, and instrumentation markets.

The HMC329LC3BTR-R5 belongs to Hittite's legacy GaAs MMIC mixer family, engineered specifically for fundamental Ka-band mixing in infrastructure-grade wireless systems where passive architecture, wide IF bandwidth, and manufacturability are critical.

FAQ

What is the recommended LO drive level for optimal performance of the HMC329LC3BTR-R5?

The HMC329LC3BTR-R5 achieves best conversion loss and linearity at +13 dBm LO drive, with functional operation from +9 dBm to +15 dBm. Driving below +9 dBm increases conversion loss and degrades IP3; exceeding +15 dBm risks compression and potential damage. All electrical specs in the datasheet assume +13 dBm LO unless otherwise noted.

Does the HMC329LC3BTR-R5 require external DC blocking capacitors on its ports?

The HMC329LC3BTR-R5 has DC-coupled LO, RF, and IF ports and does not require external DC blocking capacitors for standard operation. However, if DC response is unwanted on the IF port, a series capacitor sized for the target IF band (e.g., 100 pF for 1–8 GHz) must be added externally-per datasheet guidance for IF port use.

Can the HMC329LC3BTR-R5 be used as both an upconverter and downconverter?

Yes, the HMC329LC3BTR-R5 is bidirectional: it operates as either an upconverter (IF→RF) or downconverter (RF→IF) across its full 24–32 GHz RF/LO and DC–8 GHz IF ranges. Its double-balanced passive architecture imposes no directional limitation, and all published specs apply equally to both configurations.

What is the thermal resistance and maximum channel temperature rating of the HMC329LC3BTR-R5?

The HMC329LC3BTR-R5 has a junction-to-ground-paddle thermal resistance of 170 °C/W and a maximum channel temperature rating of 150 °C. Continuous power dissipation is rated at 382 mW at 85 °C ambient, derating linearly by 5.88 mW/°C above that temperature-requiring proper PCB ground paddle soldering and thermal via implementation.

Is the HMC329LC3BTR-R5 pin-compatible with other Hittite mixer variants like the HMC329LC3?

The HMC329LC3BTR-R5 shares identical pinout, package dimensions, and terminal functions with the non-tray version HMC329LC3, differing only in tape-and-reel packaging (R5 = 500-piece reel). No PCB layout changes are needed when substituting between these variants; both require identical grounding and RF layout practices per the datasheet.

HMC329LC3BTR-R5 Specifications

Product attributes
Attribute value
Manufacturer:
Analog Devices Inc.
Series:
-
Package/Case:
12-VFCQFN Exposed Pad
Packaging:
Tape & Reel (TR)
Product Status:
Obsolete
RF Type:
General Purpose
Frequency:
24GHz ~ 32GHz
Number of Mixers:
1
Gain:
-
Noise Figure:
10.5dB
Secondary Attributes:
Up/Down Converter
Current - Supply:
-
Voltage - Supply:
-
Mounting Type:
Surface Mount
Supplier Device Package:
12-CSMT (3x3)

HMC329LC3BTR-R5 FAQ

1.How can I place an order for HMC329LC3BTR-R5 through Aetrix?

Please submit a Request for Quotation (RFQ) for HMC329LC3BTR-R5 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for HMC329LC3BTR-R5 reliable?

The price and inventory of HMC329LC3BTR-R5 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for HMC329LC3BTR-R5 is usually 5 days.

3.What payment methods are accepted for HMC329LC3BTR-R5?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for HMC329LC3BTR-R5 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for HMC329LC3BTR-R5?

HMC329LC3BTR-R5 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your HMC329LC3BTR-R5 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for HMC329LC3BTR-R5?

For technical support, including HMC329LC3BTR-R5 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your HMC329LC3BTR-R5 requirements.

6.How does Aetrix verify that HMC329LC3BTR-R5 is sourced from the original manufacturer or authorized distributors?

All HMC329LC3BTR-R5 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that HMC329LC3BTR-R5 meets industry standards.

7.What is the process for return or replacement of HMC329LC3BTR-R5?

All HMC329LC3BTR-R5 units undergo pre-shipment inspection (PSI). If there is an issue with HMC329LC3BTR-R5, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The HMC329LC3BTR-R5 part is unused and in its original packaging.

Return procedure for HMC329LC3BTR-R5:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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