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Analog Devices Inc. HMC329-SX
- Part No.:
- HMC329-SX
- Manufacturer:
- Analog Devices Inc.
- Category:
- RF Mixers
- Package:
- Die
- Datasheet:
-
HMC329-SX.pdf
- Description:
- IC MMIC MIXER DBL-BAL DIE
- Quantity:
- Payment:
- Shipping:
Inventory:3,120
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Product details
Overview
HMC329-SX from Analog Devices (formerly Hittite Microwave) is a GaAs MMIC double-balanced passive mixer operating from 25–40 GHz, requiring no DC bias and delivering +19 dBm input IP3, 42 dB LO/RF isolation, and 0.85 × 0.55 mm chip-scale footprint. It serves as upconverter or downconverter in millimeter-wave SATCOM transceivers.
For engineers reviewing the HMC329-SX datasheet, HMC329-SX pinout, HMC329-SX application, or HMC329-SX equivalent, key selection criteria include RF/LO frequency coverage (25–40 GHz), IF bandwidth (DC–8 GHz), conversion loss (9.5–11.5 dB), noise figure (9.5–11.5 dB), and ESD sensitivity (HBM Class 1B).
Technical Context
The HMC329-SX integrates on-chip baluns to achieve high LO/RF (42 dB typ), LO/IF (35 dB typ), and RF/IF (28 dB typ) isolations without external components. Its passive architecture eliminates DC bias requirements and supports operation across -55°C to +85°C.
Designed for microstrip mounting on 5-mil alumina substrates, the chip uses 3-mil gold ribbon bonds (<0.31 mm length) to minimize parasitic inductance at millimeter-wave frequencies. Performance data includes fixture parasitics measured in a 50-Ω test environment with K-connectors.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Frequency Range (RF & LO) | 25–40 GHz - Enables full-band LMDS and point-to-point radio operation in E-band |
| Frequency Range (IF) | DC–8 GHz - Supports baseband through wideband IF architectures including 1 GHz downconversion |
| Conversion Loss | 9.5–11.5 dB - Defines signal attenuation between RF and IF ports under +13 dBm LO drive |
| Input IP3 | +16 to +19 dBm - Determines third-order intermodulation distortion performance in multi-carrier systems |
| LO/RF Isolation | 38–42 dB - Limits LO leakage into RF path, critical for receiver dynamic range and transmitter spectral purity |
| Operating Temperature | -55°C to +85°C - Validates suitability for outdoor microwave radios and aerospace SATCOM terminals |
| ESD Sensitivity | HBM Class 1B - Requires strict handling protocols during assembly to prevent gate oxide damage |
Pinout & Package
Package: Bare die, 0.85 × 0.55 × 0.1 mm (0.004″ thick), gold backside metallization, gold bond pads. Mounting requires eutectic (AuSn) or conductive epoxy attachment to grounded substrate.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| RF | Radio Frequency port | Differential RF input/output node; matched to 50 Ω via integrated balun; used for signal injection or extraction at 25–40 GHz |
| LO | Local Oscillator port | Differential LO input node; accepts +13 dBm typical drive; no DC blocking required due to passive design |
| IF | Intermediate Frequency port | Single-ended IF output/input; supports DC–8 GHz; connects directly to baseband or IF amplifier without external coupling |
| GND | Ground terminal | Backside metallization serves as primary RF ground reference; must be bonded to system ground plane |
Key Features
| Feature | Design Value |
|---|---|
| No DC bias required | Enables simplified power architecture and eliminates bias network design, filtering, and thermal drift concerns |
| On-chip baluns | Provides inherent differential-to-single-ended conversion, eliminating external transformers and reducing layout area |
| Small chip size | 0.85 × 0.55 mm footprint allows dense integration in compact E-band modules and phased array front-ends |
| High LO/RF isolation | 42 dB typ minimizes LO radiation into antenna path, easing filter requirements in full-duplex transceivers |
| Wide IF bandwidth | DC–8 GHz enables direct sampling of wideband signals and compatibility with high-speed ADCs/DACs |
Applications
| LMDS Base Station Transceiver | Microwave Point-to-Point Radio |
|---|---|
Use Scenario: Full-duplex 28 GHz LMDS base station using separate RF chains for transmit and receive. IC Role / Device Role / Timing Role: Downconverter for 28 GHz received signal to 1 GHz IF; upconverter for 1 GHz baseband to 28 GHz transmit path. Use Value: Passive architecture avoids LO pulling; 42 dB LO/RF isolation prevents transmit LO leakage from degrading adjacent-channel receiver sensitivity. |
Use Scenario: 38 GHz licensed backhaul link with 500 MHz channel bandwidth and high-order QAM modulation. IC Role / Device Role / Timing Role: Core mixer in both ends of the link, enabling precise frequency translation while maintaining EVM integrity. Use Value: +19 dBm IP3 ensures low intermodulation distortion under multi-tone excitation; DC–8 GHz IF supports wide instantaneous bandwidth processing. |
| SATCOM Terminal (VSAT) | Millimeter-Wave Test Instrumentation |
Use Scenario: Mobile satellite terminal operating in Ka-band (30 GHz uplink, 20 GHz downlink) with compact form factor constraints. IC Role / Device Role / Timing Role: Downconverter for 30 GHz downlink signal to L-band IF; upconverter for L-band uplink to 30 GHz. Use Value: Chip-scale size (0.85 × 0.55 mm) reduces module volume; -55°C to +85°C rating supports operation in uncontrolled environmental enclosures. |
Use Scenario: Signal generator or spectrum analyzer front-end requiring broadband harmonic mixing and calibration stability. IC Role / Device Role / Timing Role: Passive mixer core in harmonic sampling architecture, leveraging wide IF bandwidth for time-domain waveform capture. Use Value: No DC bias simplifies automated test equipment (ATE) interface; HBM Class 1B rating aligns with ESD-safe lab handling standards. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar passive double-balanced mixer applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| HMC774A-SX | Wider RF/LO range (18–44 GHz); higher LO drive (+17 dBm); larger die (1.1 × 0.7 mm) | Better suited for 18–26 GHz legacy systems; requires higher LO power and more board area | Select when broader low-band coverage or higher LO tolerance is needed; not drop-in compatible due to size and drive differences |
| QPC1006 | Same 25–40 GHz range; GaN-based; +27 dBm P1dB; requires +28 V DC bias | Active design enables higher output power but adds bias complexity and thermal management overhead | Choose for high-power transmit stages where passive mixers lack sufficient linearity; not interchangeable without circuit redesign |
Compared with HMC329-SX, HMC774A-SX extends low-frequency coverage but increases footprint and LO drive demand, while QPC1006 trades passive simplicity for active gain and power handling-neither is pin-compatible, and both require layout and bias changes.
Availability
HMC329-SX is available at Aetrix Electronics and suitable for LMDS infrastructure, microwave point-to-point radios, and SATCOM terminals requiring stable component supply across extended temperature ranges and high-frequency performance consistency.
Supply support for HMC329-SX includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Analog Devices acquired Hittite Microwave in 2014 and maintains its high-frequency RF/Microwave product portfolio, specializing in GaAs and GaN MMICs for defense, communications, and instrumentation markets.
The HMC329-SX belongs to Analog Devices' legacy Hittite mixer family, engineered specifically for millimeter-wave wireless infrastructure where passive performance, small size, and thermal robustness are critical.
FAQ
What is the recommended LO drive level for optimal performance of the HMC329-SX?
The HMC329-SX achieves best conversion loss (9.5 dB typ) and IP3 (+19 dBm) at +13 dBm LO drive. Performance degrades below +11 dBm (increased conversion loss) and above +15 dBm (risk of compression). The datasheet specifies +13 dBm as the standard test condition for all key metrics including isolation and noise figure.
Does the HMC329-SX require external DC bias or matching components?
No. The HMC329-SX is a fully passive double-balanced mixer with integrated baluns and requires no DC bias, external filters, or impedance-matching networks. All ports are internally matched to 50 Ω, and operation relies solely on proper microstrip mounting and short ribbon bonds.
What is the maximum RF input power the HMC329-SX can handle without damage?
The absolute maximum RF/IF input power for the HMC329-SX is +13 dBm. Exceeding this risks permanent degradation of on-chip Schottky diodes. For reliable operation, input power should remain ≤ +11 dBm to avoid 1 dB compression (P1dB = +8 to +11 dBm).
How is thermal management handled for the HMC329-SX in high-power applications?
The HMC329-SX has no active power dissipation since it is passive, but thermal stability relies on mechanical mounting. Backside gold metallization must be eutectically or conductively bonded to a thermally conductive ground plane. Die attach methods (e.g., AuSn preform at 255°C) are specified to avoid thermal stress-induced delamination.
Can the HMC329-SX be used for both upconversion and downconversion?
Yes. The HMC329-SX is bidirectional: RF and LO ports are interchangeable per application. As a downconverter, RF is input and IF is output; as an upconverter, IF is input and RF is output. All specifications-including conversion loss, isolation, and IP3-are validated for both modes at 25–40 GHz.
HMC329-SX Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Analog Devices Inc.
- Series:
- -
- Package/Case:
- Die
- Packaging:
- Bulk
- Product Status:
- Obsolete
- RF Type:
- General Purpose
- Frequency:
- 25GHz ~ 40GHz
- Number of Mixers:
- 1
- Gain:
- -
- Noise Figure:
- 9.5dB
- Secondary Attributes:
- Up/Down Converter
- Current - Supply:
- -
- Voltage - Supply:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- Die
HMC329-SX FAQ
1.How can I place an order for HMC329-SX through Aetrix?
Please submit a Request for Quotation (RFQ) for HMC329-SX on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for HMC329-SX reliable?
The price and inventory of HMC329-SX are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for HMC329-SX is usually 5 days.
3.What payment methods are accepted for HMC329-SX?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for HMC329-SX transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for HMC329-SX?
HMC329-SX orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your HMC329-SX order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for HMC329-SX?
For technical support, including HMC329-SX datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your HMC329-SX requirements.
6.How does Aetrix verify that HMC329-SX is sourced from the original manufacturer or authorized distributors?
All HMC329-SX products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that HMC329-SX meets industry standards.
7.What is the process for return or replacement of HMC329-SX?
All HMC329-SX units undergo pre-shipment inspection (PSI). If there is an issue with HMC329-SX, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The HMC329-SX part is unused and in its original packaging.
Return procedure for HMC329-SX:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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