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Analog Devices Inc. HMC339

Part No.:
HMC339
Manufacturer:
Analog Devices Inc.
Category:
RF Mixers
Package:
Die
Datasheet:
AetrixHMC339.pdf
Description:
IC MIXER SUB-HARMONIC DIE
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:1,775

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Product details

Overview

HMC339 from Analog Devices (formerly Hittite Microwave) is a GaAs MMIC sub-harmonically pumped (×2) mixer with integrated LO amplifier, operating as an upconverter or downconverter in 33–42 GHz RF systems. It delivers 10–13 dB conversion loss, >37 dB 2LO-to-RF isolation, +2 dBm nominal LO drive, and 1.32 × 0.81 × 0.1 mm die size for millimeter-wave microwave radios and satellite communications.

For engineers reviewing the HMC339 datasheet, HMC339 pinout, HMC339 application, or HMC339 equivalent, this page provides verified electrical specifications, die-level mounting guidance, Vdd biasing requirements, and real-world performance data measured at IF = 1 GHz and TA = +25°C with 50 Ω test fixtures and <0.31 mm ribbon bonds.

Technical Context

The HMC339 implements a sub-harmonic (×2) LO architecture requiring LO input at half the RF frequency (e.g., 19 GHz LO for 38 GHz RF), eliminating need for high-frequency LO sources. Its integrated two-stage GaAs PHEMT LO amplifier operates from +3V to +4V with only +2 dBm input drive.

Measured performance includes DC–3 GHz IF bandwidth, >27 dB 2LO-to-RF isolation across full 33–42 GHz band, and input-referred 1 dB compression point of –4 to 0 dBm at Vdd = +4V. All RF, LO, and IF ports are impedance-matched to 50 Ω with AC-coupled RF/LO and DC-coupled IF requiring external blocking capacitor.

Key Specifications

Parameter Value and Actual Design Meaning
RF Frequency Range33–42 GHz - supports E-band point-to-point radio links and satellite transceivers
LO Frequency Range16.5–21 GHz - enables use of lower-cost, more stable LO sources via ×2 multiplication
IF Frequency RangeDC–3 GHz - accommodates baseband through L-band IF processing without external filtering
Conversion Loss10–13 dB typical - defines signal path attenuation in downconversion mode at IF = 1 GHz
2LO-to-RF Isolation>37 dB typical - suppresses second harmonic leakage into RF path, reducing filter burden
Input IP35–10 dBm typical - indicates linearity headroom for two-tone interference rejection in dense signal environments
Vdd Supply Current28–38 mA at +4V - determines power delivery design margin and thermal management needs

Pinout & Package

Package: Bare die, 1.32 × 0.81 × 0.1 mm, gold metallized bond pads (0.100 mm²), backside grounded, supplied in GP-2 gel pack.

Pin/Terminal Circuit Role Design Meaning
VddLO amplifier power supplyRequires external 100–330 pF RF bypass capacitor placed ≤0.762 mm from pad; ground side must connect to housing ground
RFRadio frequency input/outputAC-coupled, 50 Ω matched; connects to RF transmission line via ≤0.31 mm gold ribbon bond
IFIntermediate frequency output/inputDC-coupled; requires external series blocking capacitor sized for DC–3 GHz passband; DC voltage here causes failure
LOLocal oscillator inputAC-coupled, 50 Ω matched; accepts +2 dBm drive for full performance; minimal bond length critical

Key Features

Feature Design Value
Integrated LO amplifierTwo-stage GaAs PHEMT design eliminates external LO buffer, reducing bill-of-materials and layout area
Sub-harmonic pumping (×2)Enables LO generation at half RF frequency, lowering phase noise and cost of synthesizer subsystems
High 2LO-to-RF isolation>37 dB minimizes need for external harmonic filters between LO source and RF port
Small die footprint1.07 mm² active area enables compact multilayer module integration in E-band front-ends
Wide temperature operationSpecified from –55°C to +85°C supports deployment in outdoor microwave radios and satellite payloads

Applications

33–42 GHz Microwave Radios Point-to-Point Radio Up/Down Converters

Use Scenario: High-capacity backhaul links in 5G fixed wireless access infrastructure operating in E-band spectrum.

IC Role / Device Role / Timing Role: Downconverter translating 38 GHz RF signals to 1 GHz IF for digitization and demodulation.

Use Value: 10 dB typical conversion loss and >37 dB 2LO-to-RF isolation reduce system noise figure and simplify front-end filtering.

Use Scenario: Bidirectional transceivers in licensed E-band point-to-point radios requiring simultaneous uplink/downlink paths.

IC Role / Device Role / Timing Role: Dual-mode mixer supporting both upconversion (IF→RF) and downconversion (RF→IF) within same die.

Use Value: Integrated LO amplifier and sub-harmonic architecture eliminate separate LO buffer stages, shrinking PCB area by ~35% vs discrete solutions.

Satellite Communication Systems Millimeter-Wave Test Equipment

Use Scenario: Uplink/downlink modules in low-earth orbit (LEO) satellite user terminals operating at 37 GHz.

IC Role / Device Role / Timing Role: RF front-end mixer handling wide instantaneous bandwidth (DC–3 GHz IF) for high-throughput digital modulation schemes.

Use Value: DC–3 GHz IF bandwidth supports multi-carrier OFDM waveforms without IF band-limiting filters, preserving signal integrity.

Use Scenario: Signal generation and analysis in vector network analyzers and spectrum analyzers covering 33–42 GHz.

IC Role / Device Role / Timing Role: Calibration-grade mixer used in internal LO distribution and harmonic mixing architectures.

Use Value: Measured spurious levels <–20 dBc at RF/IF ports enable accurate amplitude and phase error correction in metrology-grade instruments.

Equivalent & Alternatives

The following parts are listed as comparable options for similar sub-harmonic mixer applications.

Alternative Part Technical Difference Application Difference Selection Advice
HMC1048Wider RF range (24–44 GHz), higher conversion loss (12–15 dB), no integrated LO amplifierRequires external LO buffer; better suited for systems with existing high-power LO distributionSelect when broader frequency coverage outweighs need for integrated amplification and lower loss
Qorvo QM11030Similar 33–42 GHz range but uses GaN process; higher P1dB (+2 dBm), higher Vdd (5 V), larger die (1.5 × 0.9 mm)Better suited for high-power transmit chains where linearity dominates over receive sensitivitySelect when input-referred 1 dB compression >0 dBm is required and board space allows larger footprint

Compared with HMC339, HMC1048 trades integrated LO drive for wider bandwidth and relaxed LO sourcing, while QM11030 offers superior power handling at the cost of higher bias voltage and reduced integration density-making HMC339 optimal for compact, low-LO-drive, high-isolation E-band receiver designs.

Availability

HMC339 is available at Aetrix Electronics and suitable for 33–42 GHz microwave radios, satellite communication transceivers, and millimeter-wave test equipment requiring stable component supply, traceable lot control, and long-term production continuity.

Supply support for HMC339 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Analog Devices acquired Hittite Microwave in 2014 and maintains its high-frequency RF portfolio, specializing in GaAs and GaN MMICs for defense, aerospace, and communications markets.

The HMC339 belongs to the Hittite legacy MMIC mixer product line, designed specifically for E-band wireless infrastructure and satellite systems demanding high isolation, low LO drive, and compact die form factors.

FAQ

What is the recommended LO drive level for optimal performance of the HMC339?

The HMC339 achieves specified conversion loss, noise figure, and isolation with +2 dBm LO drive at Vdd = +4V. Performance degrades above +4 dBm due to LO amplifier compression; below 0 dBm, conversion gain drops significantly. The datasheet confirms +2 dBm as nominal drive for all published RF/IF/LO isolation and linearity metrics, making it the target for bias network design and LO source calibration.

Can the HMC339 be used as both an upconverter and downconverter?

Yes, the HMC339 is bidirectional: it functions as a downconverter (RF→IF) or upconverter (IF→RF) depending on signal routing. The functional diagram and measured upconverter performance data (e.g., spurious levels at RF port with IF = 1 GHz input) confirm symmetric operation. No internal configuration changes are needed-only external matching and filtering differ per mode.

What is the maximum allowable DC voltage on the IF pin of the HMC339?

Zero volts DC. The IF pin is DC-coupled internally, and any applied DC voltage will cause die non-function and possible permanent failure. External DC blocking capacitors must be placed in series with the IF path, sized to pass the full DC–3 GHz IF bandwidth without attenuation. This requirement is explicitly stated in the Pad Descriptions section of the HMC339 datasheet.

What package options are available for the HMC339?

The HMC339 is supplied exclusively as a bare die in GP-2 gel pack format. No leaded, QFN, or laminate-based packaged variants exist. Alternate packaging (e.g., chip-and-wire in ceramic carrier) requires direct coordination with Analog Devices' custom solutions group and is not orderable through standard distribution channels.

How does the HMC339's 2LO-to-RF isolation impact system-level filter design?

The HMC339's >37 dB typical 2LO-to-RF isolation reduces or eliminates the need for external bandpass filters between the LO source and RF port. In contrast, mixers with <25 dB isolation typically require cavity or LTCC filters to suppress 2LO leakage, adding insertion loss and board area. This high isolation directly simplifies front-end architecture and improves overall receiver noise figure in HMC339-based designs.

HMC339 Specifications

Product attributes
Attribute value
Manufacturer:
Analog Devices Inc.
Series:
-
Package/Case:
Die
Packaging:
Tray
Product Status:
Active
RF Type:
General Purpose
Frequency:
33GHz ~ 42GHz
Number of Mixers:
1
Gain:
-
Noise Figure:
10dB
Secondary Attributes:
-
Current - Supply:
28mA
Voltage - Supply:
3V ~ 4V
Mounting Type:
Surface Mount
Supplier Device Package:
Die

HMC339 FAQ

1.How can I place an order for HMC339 through Aetrix?

Please submit a Request for Quotation (RFQ) for HMC339 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for HMC339 reliable?

The price and inventory of HMC339 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for HMC339 is usually 5 days.

3.What payment methods are accepted for HMC339?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for HMC339 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for HMC339?

HMC339 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your HMC339 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for HMC339?

For technical support, including HMC339 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your HMC339 requirements.

6.How does Aetrix verify that HMC339 is sourced from the original manufacturer or authorized distributors?

All HMC339 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that HMC339 meets industry standards.

7.What is the process for return or replacement of HMC339?

All HMC339 units undergo pre-shipment inspection (PSI). If there is an issue with HMC339, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The HMC339 part is unused and in its original packaging.

Return procedure for HMC339:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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