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Analog Devices Inc. HMC402MS8ETR
- Part No.:
- HMC402MS8ETR
- Manufacturer:
- Analog Devices Inc.
- Category:
- RF Mixers
- Package:
- 8-TSSOP, 8-MSOP (0.118", 3.00mm Width)
- Datasheet:
-
HMC402MS8ETR.pdf
- Description:
- IC MMIC MIXER HIGH IP3 8MSOP
- Quantity:
- Payment:
- Shipping:
Inventory:2,634
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Product details
Overview
HMC402MS8ETR from Analog Devices (formerly Hittite Microwave) is a high-dynamic-range passive GaAs MMIC mixer in an 8-lead MSOP package, operating from 1.8 to 2.2 GHz RF with high-side LO injection. It delivers +31 dBm input IP3 (downconversion), 8.5 dB typical conversion loss, and +21 dBm input P1dB - enabling robust signal handling in UMTS/PCS base station transceivers without external bias or components.
For engineers reviewing the HMC402MS8ETR datasheet, HMC402MS8ETR pinout, HMC402MS8ETR application, or HMC402MS8ETR equivalent, key selection criteria include its 14.8 mm² footprint, DC-coupled RF/IF ports, 50 Ω impedance matching across band, and compatibility with +16 to +18 dBm LO drive for infrastructure-grade linearity.
Technical Context
This monolithic passive mixer uses GaAs FET architecture with no DC bias required, supporting both upconversion and downconversion. Its high-side LO configuration enables IF output from DC to 500 MHz, with LO-to-RF isolation of 24–30 dB and LO-to-IF isolation of 19–24 dB at +17 dBm LO drive.
The device operates over –40°C to +85°C, features MSL1 rating, and requires all ground pins (3, 6, 7) and exposed paddle to be soldered directly to PCB RF ground. Pin 1 (LO) and Pin 8 (RF) are AC-coupled and 50 Ω matched; Pin 5 (IF) is DC-coupled with ±40 mA absolute max current.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| RF Frequency Range | 1.8–2.2 GHz - covers full PCS/UMTS Band II (1850–1990 MHz) and Band I (2110–2170 MHz) for cellular infrastructure. |
| Input IP3 (Downconv.) | +31 dBm - enables high linearity in multi-carrier GSM/CDMA/UMTS base stations without active biasing. |
| Conversion Loss | 8.5 dB typical - defines signal attenuation between RF and IF paths; impacts receiver noise figure and transmitter efficiency. |
| LO Drive Level | +16 to +18 dBm - compatible with standard LO synthesizers; eliminates need for external amplification. |
| IF Bandwidth | DC to 500 MHz - supports wideband modulation schemes including W-CDMA, LTE, and DOCSIS upstream channels. |
| P1dB (Input) | +21 dBm - allows high RF input power before compression, critical for saturated-stage front-end designs. |
| LO–RF Isolation | 24–30 dB - reduces LO leakage into antenna path, easing filtering requirements in TDD/FDD systems. |
Pinout & Package
Package: RoHS-compliant 8-lead MSOP (Mini Small Outline Package), body size 3.0 × 3.0 × 0.85 mm, 14.8 mm² footprint, matte Sn lead finish, MSL1 rated (260 °C peak reflow).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1 | LO Input | AC-coupled, 50 Ω matched port; requires external blocking capacitor if DC potential ≠ 0 V. |
| 2, 4 | No Connect | Internally unconnected; must remain floating - no PCB trace or solder mask opening required. |
| 3, 6, 7 | Ground | RF ground terminals; must be soldered directly to low-inductance PCB ground plane with multiple vias. |
| 5 | IF Output/Input | DC-coupled port; supports DC–500 MHz IF; limits ±40 mA DC current to prevent damage. |
| 8 | RF Input/Output | DC-coupled, 50 Ω matched port; handles +27 dBm absolute max RF input per absolute ratings. |
Key Features
| Feature | Design Value |
|---|---|
| No external bias or components | Eliminates DC power supply, decoupling capacitors, and bias tees - reduces BOM count and layout area. |
| High-side LO architecture | Enables flexible IF placement below or above RF band; simplifies filter design for PCS/UMTS transmit/receive chains. |
| Ultra-small 14.8 mm² MSOP footprint | Reduces PCB real estate by >50% vs. traditional SOIC-8 mixers; supports dense RF module integration. |
| Wide IF bandwidth (DC–500 MHz) | Supports zero-IF, low-IF, and complex IF architectures - compatible with direct-conversion receivers and broadband modems. |
| Robust thermal operation (–40°C to +85°C) | Validated performance across industrial temperature range - suitable for outdoor macrocell and remote radio head deployments. |
Applications
| Cellular Base Station Transceiver | Cable Modem Termination System (CMTS) |
|---|---|
Use Scenario: Downconverting 2.1 GHz UMTS Band I signals to 300 MHz IF in macrocell BTS receive chain. IC Role / Device Role / Timing Role: Passive mixer performing RF-to-IF translation with high linearity and minimal added noise. Use Value: +31 dBm IP3 prevents intermodulation distortion from adjacent carriers; 8.5 dB conversion loss preserves system NF budget. | Use Scenario: Upconverting DOCSIS upstream channels (5–42 MHz) to 5–42 MHz IF for transmission at 5–65 MHz in CMTS upstream path. IC Role / Device Role / Timing Role: Passive mixer translating baseband IF to RF with high dynamic range and wide IF bandwidth. Use Value: DC–500 MHz IF support enables full DOCSIS 3.1 upstream channel aggregation without IF filtering bottlenecks. |
| W-CDMA Femtocell Front-End | GSM/EDGE Baseband Transmitter |
Use Scenario: Integrating compact RF front-end for indoor femtocell operating in 1.9–2.0 GHz Band II. IC Role / Device Role / Timing Role: Single-ended passive mixer providing RF/IF interface with no DC bias dependency. Use Value: 14.8 mm² MSOP package enables miniaturized RF module design; +21 dBm P1dB accommodates high-power PA output coupling. | Use Scenario: Transmitting dual-band GSM/EDGE signals (900/1800 MHz) using shared LO and IF processing. IC Role / Device Role / Timing Role: High-linearity passive mixer used in final IF-to-RF upconversion stage. Use Value: +27 dBm upconversion IP3 ensures clean spectral emission compliance; high-side LO avoids image interference in dual-band architectures. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar passive mixer applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| HMC1048LP3E | Wider RF range (1.7–2.7 GHz), higher +34 dBm IP3, but larger 3×3 mm QFN package. | Better suited for multi-band macrocell where wider frequency coverage is needed. | Select HMC1048LP3E when broader RF bandwidth or higher linearity justifies larger footprint and cost premium. |
| ADL5801ACPZ-R7 | Active double-balanced mixer; requires +5 V bias; offers 7.8 dB conversion gain (not loss); 2.3–2.9 GHz RF range. | Used where gain is preferred over loss, and DC power is available for active biasing. | Select ADL5801ACPZ-R7 only when system architecture supports active bias and IF gain is required to offset downstream losses. |
Compared with HMC1048LP3E and ADL5801ACPZ-R7, the HMC402MS8ETR provides optimal trade-off of ultra-compact size, zero-bias operation, and proven +31 dBm IP3 in the 1.8–2.2 GHz band - making it ideal for space-constrained, high-reliability infrastructure transceivers.
Availability
HMC402MS8ETR is available at Aetrix Electronics and suitable for cellular base station transceivers, cable modem termination systems, and W-CDMA femtocell front-ends requiring stable component supply and long-term lifecycle support.
Supply support for HMC402MS8ETR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Analog Devices is a global leader in high-performance analog, mixed-signal, and RF ICs, serving communications, industrial, and aerospace markets with precision signal processing solutions.
The HMC402MS8ETR belongs to Analog Devices' legacy Hittite Microwave MMIC mixer product line, designed specifically for high-linearity, zero-bias RF front-ends in wireless infrastructure equipment.
FAQ
What is the recommended LO drive level for optimal performance of the HMC402MS8ETR?
The HMC402MS8ETR achieves best-in-class IP3 and conversion loss at +16 to +18 dBm LO drive. Operating outside this range degrades linearity: below +16 dBm increases conversion loss; above +18 dBm risks LO port damage or spurious generation. The datasheet specifies +17 dBm as the nominal test condition for all key specs including +31 dBm IP3 and 8.5 dB conversion loss.
Does the HMC402MS8ETR require external DC biasing or passive components?
No, the HMC402MS8ETR is a fully passive GaAs MMIC mixer requiring no DC bias voltage or current. It also needs no external baluns, transformers, or matching networks - only AC coupling capacitors on LO (Pin 1) if DC potential differs from ground, and optional DC blocking on IF (Pin 5) for non-DC-coupled applications. All other pins either connect to ground or carry RF/IF signals directly.
What is the maximum RF input power the HMC402MS8ETR can handle without damage?
The absolute maximum RF input power for the HMC402MS8ETR is +27 dBm, as specified in the Absolute Maximum Ratings table. Exceeding this level risks permanent degradation of the GaAs FET structure. For reliable operation, the datasheet recommends limiting continuous RF input to ≤+21 dBm (P1dB point) to avoid compression and maintain linearity - especially critical in multi-carrier environments like UMTS or LTE.
Can the HMC402MS8ETR be used for both upconversion and downconversion?
Yes, the HMC402MS8ETR supports both upconversion and downconversion modes. In downconversion (RF→IF), it achieves +31 dBm input IP3; in upconversion (IF→RF), it delivers +27 dBm input IP3 at IF = 200 MHz. Its symmetric single-ended architecture and wide IF bandwidth (DC–500 MHz) enable flexible use in transceiver architectures where the same device serves both transmit and receive paths.
What are the grounding requirements for the HMC402MS8ETR's MSOP package?
The HMC402MS8ETR requires all ground pins (3, 6, 7) and the exposed paddle (per package drawing) to be soldered directly to a low-inductance RF ground plane using multiple thermal vias. Failure to do so degrades LO–RF isolation (spec'd 24–30 dB) and increases conversion loss. The datasheet explicitly states "all ground leads must be soldered to PCB RF ground" - floating or poorly connected grounds cause measurable performance loss and thermal instability.
HMC402MS8ETR Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Analog Devices Inc.
- Series:
- -
- Package/Case:
- 8-TSSOP, 8-MSOP (0.118", 3.00mm Width)
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Obsolete
- RF Type:
- General Purpose
- Frequency:
- 1.8GHz ~ 2.2GHz
- Number of Mixers:
- 1
- Gain:
- -
- Noise Figure:
- 8.5dB
- Secondary Attributes:
- Up/Down Converter
- Current - Supply:
- -
- Voltage - Supply:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 8-MSOP
HMC402MS8ETR FAQ
1.How can I place an order for HMC402MS8ETR through Aetrix?
Please submit a Request for Quotation (RFQ) for HMC402MS8ETR on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for HMC402MS8ETR reliable?
The price and inventory of HMC402MS8ETR are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for HMC402MS8ETR is usually 5 days.
3.What payment methods are accepted for HMC402MS8ETR?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for HMC402MS8ETR transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for HMC402MS8ETR?
HMC402MS8ETR orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your HMC402MS8ETR order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for HMC402MS8ETR?
For technical support, including HMC402MS8ETR datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your HMC402MS8ETR requirements.
6.How does Aetrix verify that HMC402MS8ETR is sourced from the original manufacturer or authorized distributors?
All HMC402MS8ETR products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that HMC402MS8ETR meets industry standards.
7.What is the process for return or replacement of HMC402MS8ETR?
All HMC402MS8ETR units undergo pre-shipment inspection (PSI). If there is an issue with HMC402MS8ETR, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The HMC402MS8ETR part is unused and in its original packaging.
Return procedure for HMC402MS8ETR:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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