Analog Devices Inc. HMC520ALC4TR

Overview

HMC520ALC4TR from Analog Devices is a GaAs MMIC in-phase/quadrature (I/Q) mixer operating from 6 GHz to 10 GHz RF and LO frequencies, with dc–3.5 GHz IF bandwidth, 8 dB typical conversion loss, and 23 dBc image rejection - deployed in microwave point-to-point radios and instrumentation signal chains.

For engineers reviewing the HMC520ALC4TR datasheet, HMC520ALC4TR pinout, HMC520ALC4TR application, or HMC520ALC4TR equivalent, this page delivers verified RF/LO/IF frequency ranges, I/Q amplitude/phase balance metrics, isolation specs, thermal limits, and surface-mount ceramic LCC package implementation guidance.

Technical Context

The HMC520ALC4TR integrates two double-balanced mixer cells and an on-die 90° hybrid in a GaAs MESFET process, enabling image-reject downconversion or single-sideband upconversion without external hybrids. It operates with 15 dBm LO drive and supports both high-side and low-side LO injection.

Its RF, LO, and IF ports are internally matched to 50 Ω (RF and LO ac-coupled; LO dc-coupled), and it requires external 90° IF hybrid for optimal image rejection. The exposed thermal pad must be grounded to maintain junction temperature ≤175°C under 400 mW dissipation at 85°C ambient.

Key Specifications

Pinout & Package

24-terminal RoHS-compliant ceramic leadless chip carrier (LCC) package (E-24-11), 4.0 mm × 4.0 mm footprint, with exposed thermal pad requiring solder connection to ground plane.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar I/Q mixer applications.

Compared with HMC520ALC4TR, HMC774A extends frequency range but sacrifices conversion efficiency, while ADMV1013 replaces discrete LO architecture with integrated synthesis at the cost of design compatibility and power consumption trade-offs.

Availability

HMC520ALC4TR is available at Aetrix Electronics and suitable for point-to-point microwave radios, test instrumentation, and satellite communication systems requiring stable component supply, RoHS compliance, and surface-mount manufacturability.

Supply support for HMC520ALC4TR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Analog Devices is a global leader in high-performance analog, mixed-signal, and RF ICs, serving communications, industrial, and aerospace markets with precision signal processing solutions.

The HMC520ALC4TR belongs to the Hittite Microwave (acquired by Analog Devices) GaAs MMIC mixer family, engineered for microwave infrastructure demanding high linearity, image rejection, and thermal robustness in compact form factors.

FAQ

What is the recommended LO drive level for optimal performance of the HMC520ALC4TR?

The HMC520ALC4TR is characterized at 15 dBm LO input, delivering 8 dB typical conversion loss and 23 dBc image rejection across 6–10 GHz. LO drive between 13 dBm and 19 dBm is supported; below 13 dBm increases conversion loss, while above 19 dBm risks exceeding absolute maximum ratings. Always verify LO return loss (>10 dB) at the target frequency using the datasheet's Figure 80.

Does the HMC520ALC4TR require external matching networks on its RF, LO, or IF ports?

No - the HMC520ALC4TR features internal 50 Ω matching on RF (ac-coupled) and LO (dc-coupled) ports, and IF1/IF2 ports are designed for direct connection to an external 90° hybrid. External DC blocking is only needed on IF pins if dc operation is not required; otherwise, current sourcing/sinking must stay within ±12 mA per pin to prevent malfunction.

Can the HMC520ALC4TR be used for upconversion, and what sideband is generated?

Yes - the HMC520ALC4TR functions as a single-sideband upconverter. With high-side LO injection (LO > RF), it generates the lower sideband; with low-side LO (LO < RF), it produces the upper sideband. Sideband rejection is 22 dBc typical, confirmed in Table 1's upconverter section and Figure 60–63.

What is the thermal resistance (θJC) of the HMC520ALC4TR, and how does it impact PCB layout?

The HMC520ALC4TR has θJC = 225°C/W (E-24-11 package). To maintain TJ ≤175°C at 400 mW dissipation, the PCB must provide low-thermal-resistance grounding via ≥9 thermal vias (3×3 array) under the exposed pad, connected to a solid inner-layer ground plane - per JEDEC JESD51-2 and datasheet Figure 105 land pattern recommendations.

How does the HMC520ALC4TR achieve image rejection without an external 90° hybrid at IF?

The HMC520ALC4TR does not achieve image rejection without an external 90° hybrid - its on-die hybrid handles RF/LO phase splitting, but the IF ports (IF1/IF2) require an external 90° hybrid to combine outputs coherently and cancel the image. Figures 1 and 5–6 explicitly show this configuration; omitting the external hybrid reduces image rejection to <15 dBc.