Analog Devices Inc. HMC523LC4

Overview

HMC523LC4 from Analog Devices (formerly Hittite Microwave) is a GaAs MMIC I/Q mixer in a 24-lead 4×4 mm SMT package, operating from 15–23 GHz RF/LO and DC–3.5 GHz IF. It functions as either an Image Reject Mixer or Single Sideband Upconverter with 25 dB image rejection, +25 dBm input IP3, and 47 dB LO-to-RF isolation-enabling compact, wire-bond-free microwave transceivers for point-to-point radios.

For engineers reviewing the HMC523LC4 datasheet, HMC523LC4 pinout, HMC523LC4 application, or HMC523LC4 equivalent, this device supports high-frequency upconversion with quadrature IF outputs at 100 MHz USB, requires no external hybrid for basic operation, and delivers stable amplitude/phase balance (<0.3 dB / <4°) across temperature and LO drive levels.

Technical Context

The HMC523LC4 integrates two double-balanced GaAs MESFET mixer cells with an on-die 90° hybrid to generate I/Q outputs, enabling image suppression without external hybrids. Its DC–3.5 GHz IF bandwidth supports baseband and wideband intermediate frequencies, while its 15–23 GHz RF/LO range targets E-band wireless infrastructure.

It operates as both downconverter (IRM mode) and upconverter, with conversion loss specified at 8–13 dB depending on frequency subband. LO drive sensitivity is optimized for +17 dBm, delivering 25 dB image rejection and maintaining <4° phase balance from –40°C to +85°C.

Key Specifications

Pinout & Package

Package: 24-lead, 4×4 mm leadless RoHS-compliant SMT package with alumina body, gold-over-nickel plating, and exposed ground paddle requiring soldering to PCB RF ground.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar I/Q mixer applications.

Compared with HMC523LC4, HMC1048LP4E extends RF coverage but trades off conversion loss, while ADMV1013ACPZ adds LO integration at the cost of requiring external IF hybrids and higher minimum RF frequency-making HMC523LC4 optimal for fixed 15–23 GHz upconversion with minimal BOM count.

Availability

HMC523LC4 is available at Aetrix Electronics and suitable for point-to-point radios, VSAT terminals, and test equipment requiring stable component supply, consistent RF performance, and RoHS-compliant SMT packaging.

Supply support for HMC523LC4 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Analog Devices acquired Hittite Microwave in 2014 and leads in high-performance RF, microwave, and mmWave ICs for communications, defense, and instrumentation.

The HMC523LC4 belongs to Hittite's legacy GaAs MMIC mixer product line, designed specifically for compact, high-isolation I/Q upconversion and image-reject downconversion in E-band wireless infrastructure.

FAQ

What is the primary function of the HMC523LC4?

The HMC523LC4 is a GaAs MMIC I/Q mixer that operates as either an Image Reject Mixer (IRM) or Single Sideband Upconverter. It uses integrated double-balanced mixer cells and an on-die 90° hybrid to deliver 25 dB image rejection and 100 MHz USB IF output. The HMC523LC4 supports RF/LO frequencies from 15–23 GHz and IF from DC–3.5 GHz, making it suitable for E-band wireless infrastructure and test equipment where compact, wire-bond-free SMT integration is critical.

Does the HMC523LC4 require an external IF hybrid?

The HMC523LC4 does not require an external IF hybrid for basic I/Q operation, as it integrates a 90° hybrid for quadrature signal generation. However, external hybrids may be used to enhance sideband rejection beyond 25 dB or adapt to non-100 MHz IF center frequencies. The HMC523LC4 datasheet confirms functional I/Q outputs with and without external hybrids, and its pinout provides dedicated IF1 and IF2 ports for direct connection to baseband processing circuitry.

What are the absolute maximum ratings for the HMC523LC4?

The HMC523LC4 has an absolute maximum RF/IF input power of +20 dBm, LO drive of +27 dBm, operating temperature range of –55°C to +85°C, and storage temperature of –65°C to +150°C. Its junction-to-package thermal resistance is 191.5 °C/W, with continuous power dissipation rated at 340 mW at 85°C (derated by 5.22 mW/°C above that). Exceeding these limits risks permanent damage, and ESD sensitivity is Class 1A-requiring strict handling precautions per the HMC523LC4 datasheet.

How is the HMC523LC4 packaged and what are its grounding requirements?

The HMC523LC4 uses a 24-lead, 4×4 mm leadless SMT package with an alumina body and gold-over-nickel plating. All ground pins (3, 5, 12, 14, 16) and the exposed bottom paddle must be soldered directly to the PCB RF ground plane using multiple low-inductance vias. The HMC523LC4 datasheet specifies that failure to properly ground the paddle degrades RF performance, particularly LO-to-RF isolation and conversion loss consistency across frequency.

Can the HMC523LC4 operate as both upconverter and downconverter?

Yes, the HMC523LC4 is bidirectional and functions as both an upconverter (RF output from IF/LO inputs) and downconverter (IF output from RF/LO inputs), with electrical specifications measured in both configurations. Its datasheet provides separate performance tables for IRM (downconversion) and upconverter modes, confirming 25 dB image rejection and stable quadrature balance in each. The HMC523LC4 pinout and internal architecture support flexible signal routing without hardware modification.