My Inquiry
My Account
Analog Devices Inc. HMC524ALC3BTR-R5
- Part No.:
- HMC524ALC3BTR-R5
- Manufacturer:
- Analog Devices Inc.
- Category:
- RF Mixers
- Package:
- 12-CLCC Exposed Pad
- Datasheet:
-
HMC524ALC3BTR-R5.pdf
- Description:
- GAAS MMIC I/Q MIXER / IRM CHIP,
- Quantity:
- Payment:
- Shipping:
Inventory:1,810
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
HMC524ALC3BTR-R5 from Analog Devices is a GaAs MMIC I/Q mixer operating from 22 GHz to 32 GHz RF, with dc–4.5 GHz IF bandwidth and 9 dB typical conversion loss. It functions as an image-reject downconverter or single-sideband upconverter in point-to-point radio front-ends requiring high-frequency signal translation without DC bias.
For engineers reviewing the HMC524ALC3BTR-R5 datasheet, HMC524ALC3BTR-R5 pinout, HMC524ALC3BTR-R5 application, or HMC524ALC3BTR-R5 equivalent, key selection criteria include image rejection (20 dB typ), LO–RF isolation (35 dB typ), P1dB (17 dBm typ), IP3 (18 dBm typ), and its 12-lead 3 mm × 3 mm ceramic SMT package for millimeter-wave PCB integration.
Technical Context
The HMC524ALC3BTR-R5 integrates two double-balanced mixer cells and an on-die 90° hybrid coupler in a GaAs MESFET process, enabling intrinsic quadrature phase generation. It operates passively-no DC bias required-and supports both upper and lower sideband configurations via external IF hybrid coupling.
Its RF and LO ports are DC-coupled and 50 Ω matched; IF ports (IF1/IF2) are AC-coupled with ±2 mA absolute current limit for DC-coupled operation. Thermal design requires exposed pad grounding to maintain junction temperature ≤175°C under 560 mW dissipation at 85°C ambient.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| RF Frequency Range | 22–32 GHz: Enables E-band wireless infrastructure and test equipment coverage. |
| IF Bandwidth | DC–4.5 GHz: Supports baseband-to-microwave IF interfaces including 100 MHz and 2.5 GHz IF signals. |
| Conversion Loss | 9 dB typical: Defines signal attenuation through mixing path; impacts system noise figure and gain budget. |
| Image Rejection | 20 dB typical: Determines suppression of unwanted image sideband without external calibration. |
| LO–RF Isolation | 35 dB typical: Minimizes LO leakage into antenna path, critical for transmitter spectral purity. |
| P1dB | 17 dBm typical: Sets maximum usable input power before compression degrades linearity. |
| IP3 | 18 dBm typical: Quantifies third-order intermodulation distortion performance in multi-tone environments. |
Pinout & Package
12-lead, 3 mm × 3 mm RoHS-compliant leadless ceramic surface-mount package with exposed thermal pad requiring RF/dc ground connection.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1, 3, 7, 8, 10 | GND | RF and DC ground reference; must be low-inductance connected to PCB ground plane and exposed pad. |
| 2 | RF | Radio frequency input/output port; 50 Ω matched, DC-coupled; handles 22–32 GHz signals. |
| 4, 6 | IF1 / IF2 | Quadrature IF outputs (downconversion) or inputs (upconversion); AC-coupled, ±2 mA max DC current. |
| 9 | LO | Local oscillator port; 50 Ω matched, DC-coupled; accepts 22–32 GHz LO drive at 17 dBm typical. |
| 5, 11, 12 | NIC | No internal connection; must remain unconnected on PCB layout. |
| EPAD | Exposed Pad | Thermal and electrical ground; mandatory solder connection to PCB ground for thermal management and RF stability. |
Key Features
| Feature | Design Value |
|---|---|
| No DC bias required | Passive GaAs MESFET architecture eliminates bias circuitry, reducing BOM count and layout complexity. |
| Integrated 90° hybrid | On-die quadrature generation enables compact image-reject architecture without external hybrid components. |
| High LO–RF isolation | 35 dB typical minimizes LO radiation risk in full-duplex or TDD systems with shared antenna paths. |
| Wide IF bandwidth | DC–4.5 GHz IF support allows direct baseband sampling or wideband IF digitization in modern receivers. |
| SMT ceramic package | 3 mm × 3 mm footprint enables dense mmWave PCB layouts with repeatable RF performance across production lots. |
Applications
| Point-to-Point Radios | Test Equipment & Sensors |
|---|---|
Use Scenario: High-capacity backhaul links operating in E-band (60–90 GHz carrier with 22–32 GHz IF-staging). IC Role / Device Role / Timing Role: Image-reject downconverter translating 28 GHz RF to 100 MHz IF for demodulation and error correction. Use Value: 20 dB image rejection reduces adjacent-channel interference without post-mixer filtering, shrinking system size and cost. | Use Scenario: Vector network analyzer (VNA) receiver front-end requiring broadband IF output from 22–32 GHz sweep. IC Role / Device Role / Timing Role: Single-sideband upconverter generating calibrated 28 GHz stimulus from 2.5 GHz IF source with precise phase control. Use Value: 26 dB sideband rejection ensures clean stimulus spectrum, improving measurement dynamic range by >20 dB. |
| Military Radar Systems | Millimeter-Wave 5G FR2 Transceivers |
Use Scenario: Compact seeker radar modules needing low-SWaP image-reject reception in 24–32 GHz bands. IC Role / Device Role / Timing Role: Downconverter with dc–4.5 GHz IF output feeding ADC for digital beamforming and pulse-Doppler processing. Use Value: 17 dBm P1dB enables high dynamic range operation in pulsed radar environments with minimal gain compression. | Use Scenario: FR2 (24.25–52.6 GHz) base station transceiver using 28 GHz carrier with 2.5 GHz IF interface to FPGA-based modem. IC Role / Device Role / Timing Role: Upconverter translating complex I/Q baseband to RF with 18 dBm IP3 supporting 256-QAM modulation fidelity. Use Value: 18 dBm IP3 maintains EVM < 3% under multi-carrier LTE/NR conditions, meeting 3GPP conformance requirements. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar I/Q mixer applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| HMC525ALC3BTR-R5 | Same package and pinout; optimized for 17–27 GHz RF range with 10 dB lower LO drive requirement (13 dBm). | Better suited for battery-powered portable test gear where LO power efficiency is critical. | Select when RF band is ≤27 GHz and LO amplifier headroom is constrained. |
| Qorvo QM11036 | SiGe-based; 24–34 GHz RF range; 11 dB conversion loss; requires external 90° hybrid for I/Q operation. | Lacks integrated hybrid; demands additional passive components but offers higher temperature rating (−55°C to +105°C). | Choose for extended temperature deployments where hybrid integration is acceptable to reduce part count. |
Compared with HMC524ALC3BTR-R5, HMC525ALC3BTR-R5 trades RF bandwidth for lower LO drive and improved power efficiency, while QM11036 sacrifices monolithic integration for wider temperature tolerance and SiGe process robustness-neither is pin-compatible, but both serve overlapping E-band transceiver roles.
Availability
HMC524ALC3BTR-R5 is available at Aetrix Electronics and suitable for point-to-point radios, military radar systems, and millimeter-wave 5G FR2 transceivers requiring stable component supply across high-frequency RF design cycles.
Supply support for HMC524ALC3BTR-R5 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Analog Devices is a global leader in high-performance analog, mixed-signal, and RF ICs, serving communications, industrial, and defense markets with precision signal processing solutions.
The HMC524ALC3BTR-R5 belongs to Analog Devices' Hittite Microwave MMIC product line, engineered specifically for millimeter-wave infrastructure and instrumentation where integration, linearity, and thermal reliability are critical.
FAQ
What is the operating temperature range for the HMC524ALC3BTR-R5?
The HMC524ALC3BTR-R5 operates from −40°C to +85°C ambient temperature. Its maximum junction temperature is rated at 175°C, and thermal design must ensure proper heat sinking via the exposed pad to avoid derating above 85°C ambient. The device's RF performance-including conversion loss and image rejection-is characterized across this full range per datasheet Figures 7–13 and 17–24.
Does the HMC524ALC3BTR-R5 require DC bias voltage or current?
No, the HMC524ALC3BTR-R5 is a passive GaAs MMIC mixer and requires no DC bias voltage or current. Its operation relies solely on LO drive power (typically 17 dBm) and RF/IF signal levels. This eliminates bias networks, simplifies layout, and improves reliability in high-frequency designs where bias feedthrough could degrade isolation or matching.
Can the HMC524ALC3BTR-R5 be used for both upconversion and downconversion?
Yes, the HMC524ALC3BTR-R5 supports both modes: as an image-reject downconverter (RF → IF) and as a single-sideband upconverter (IF → RF). In downconversion, it delivers quadrature IF outputs (IF1/IF2); in upconversion, those same pins accept I/Q IF inputs. External 90° hybrid coupling at the IF ports determines sideband selection in both directions.
What is the maximum allowable LO input power for the HMC524ALC3BTR-R5?
The absolute maximum LO input power for the HMC524ALC3BTR-R5 is 25 dBm, per Absolute Maximum Ratings Table 2. However, optimal performance-including 9 dB conversion loss and 20 dB image rejection-is achieved at 17 dBm LO drive. Exceeding 20 dBm may increase distortion or accelerate long-term degradation without functional benefit.
How should the exposed pad (EPAD) of the HMC524ALC3BTR-R5 be connected on the PCB?
The exposed pad of the HMC524ALC3BTR-R5 must be soldered directly to a solid RF/dc ground plane on the PCB. It serves as both thermal path and electrical ground reference. Use ≥4 thermal vias (0.3 mm diameter) connecting the pad to inner ground layers, and ensure solder paste coverage ≥90% to maintain θJC = 161°C/W and prevent junction overheating during continuous operation.
HMC524ALC3BTR-R5 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Analog Devices Inc.
- Series:
- -
- Package/Case:
- 12-CLCC Exposed Pad
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- RF Type:
- VSAT
- Frequency:
- 22GHz ~ 32GHz
- Number of Mixers:
- 2
- Gain:
- -
- Noise Figure:
- -
- Secondary Attributes:
- -
- Current - Supply:
- -
- Voltage - Supply:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 12-CLCC (2.9x2.9)
HMC524ALC3BTR-R5 FAQ
1.How can I place an order for HMC524ALC3BTR-R5 through Aetrix?
Please submit a Request for Quotation (RFQ) for HMC524ALC3BTR-R5 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for HMC524ALC3BTR-R5 reliable?
The price and inventory of HMC524ALC3BTR-R5 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for HMC524ALC3BTR-R5 is usually 5 days.
3.What payment methods are accepted for HMC524ALC3BTR-R5?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for HMC524ALC3BTR-R5 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for HMC524ALC3BTR-R5?
HMC524ALC3BTR-R5 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your HMC524ALC3BTR-R5 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for HMC524ALC3BTR-R5?
For technical support, including HMC524ALC3BTR-R5 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your HMC524ALC3BTR-R5 requirements.
6.How does Aetrix verify that HMC524ALC3BTR-R5 is sourced from the original manufacturer or authorized distributors?
All HMC524ALC3BTR-R5 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that HMC524ALC3BTR-R5 meets industry standards.
7.What is the process for return or replacement of HMC524ALC3BTR-R5?
All HMC524ALC3BTR-R5 units undergo pre-shipment inspection (PSI). If there is an issue with HMC524ALC3BTR-R5, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The HMC524ALC3BTR-R5 part is unused and in its original packaging.
Return procedure for HMC524ALC3BTR-R5:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
HMC524ALC3BTR-R5 Tags
-
MAX2671EUT+T
Analog Devices Inc./Maxim Integrated
-
ADEX-10+
Mini-Circuits
-
ADE-2+
Mini-Circuits
-
ADE-1+
Mini-Circuits
-
LT5560EDD#PBF
Analog Devices Inc.
-
LT5560EDD#TRPBF
Analog Devices Inc.
-
LTC5562IUC#TRPBF
Analog Devices Inc.
-
MAX2681EUT+T
Analog Devices Inc./Maxim Integrated
-
ADE-1ASK+
Mini-Circuits
-
ADE-1L+
Mini-Circuits
-
ADL5350ACPZ-R7
Analog Devices Inc.
-
AD608ARZ-RL
Analog Devices Inc.
Tech Hub
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…
