Analog Devices Inc. HMC524LC3BTR
- Part No.:
- HMC524LC3BTR
- Manufacturer:
- Analog Devices Inc.
- Category:
- RF Mixers
- Package:
- 12-VFQFN Exposed Pad
- Datasheet:
-
HMC524LC3BTR.pdf
- Description:
- IC MMIC IQ MIXER 12SMD
- Quantity:
- Payment:

- Shipping:

Inventory:2,109
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Product details
Overview
HMC524LC3BTR from Analog Devices (formerly Hittite Microwave) is a GaAs MMIC I/Q mixer operating from 22–32 GHz RF/LO and DC–4.5 GHz IF, delivering 13 dB typical conversion loss, 20 dB image rejection, +20 dBm input IP3, and 40 dB LO-to-RF isolation - used in point-to-point radios and military radar front-ends as an image-reject mixer or single-sideband upconverter.
For engineers reviewing the HMC524LC3BTR datasheet, HMC524LC3BTR pinout, HMC524LC3BTR application, or HMC524LC3BTR equivalent, this page provides verified RF performance data, package interface details, thermal limits, absolute maximum ratings, and validated alternatives for millimeter-wave transceiver design.
Technical Context
The HMC524LC3BTR integrates standard Hittite mixer cells with an on-die 90° hybrid to enable quadrature mixing without external hybrids. It operates as either an image-reject downconverter (with external IF hybrid) or SSB upconverter, supporting USB IF output at 100 MHz.
Its GaAs MESFET process enables wide IF bandwidth (DC–4.5 GHz), high linearity (+20 dBm IP3), and stable amplitude/phase balance (±0.5 dB / ±2.5°) across temperature and frequency - critical for coherent receiver architectures requiring precise I/Q signal integrity.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| RF/LO Frequency Range | 22–32 GHz - supports E-band wireless infrastructure and military SATCOM links |
| IF Frequency Range | DC–4.5 GHz - enables baseband-to-intermediate-frequency sampling without AC coupling constraints |
| Conversion Loss (IRM) | 10–13 dB - defines RF-to-IF power transfer efficiency in image-reject configuration |
| Image Rejection | 18–20 dB - determines suppression of unwanted sideband in coherent demodulation |
| Input IP3 | +20 dBm - sets third-order intermodulation distortion floor for multi-carrier operation |
| LO-to-RF Isolation | 35–40 dB - minimizes LO leakage into antenna path, reducing self-interference |
| Amplitude Balance | ±0.5 dB - ensures matched gain between I and Q paths for accurate vector signal reconstruction |
| Phase Balance | ±2.5° - maintains quadrature orthogonality required for low EVM in QAM systems |
Pinout & Package
12-lead 3×3 mm surface-mount package with alumina body, gold-over-nickel plating, and exposed ground paddle requiring soldering to PCB RF ground per MSL3 reflow profile (peak 260°C).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1, 3, 7, 8, 10, 11, 12 | GND | RF/DC ground connections - all must be soldered to minimize parasitic inductance and ensure return path integrity |
| 2 | RF | 50 Ω AC-coupled RF input - requires external DC blocking capacitor for bias-sensitive sources |
| 4 | IF1 | DC-coupled I-channel IF output - limited to ±3 mA DC current to prevent die damage |
| 6 | IF2 | DC-coupled Q-channel IF output - same DC current limit and coupling rules as IF1 |
| 5 | N/C | No internal connection - may be grounded without performance impact |
| 9 | LO | 50 Ω DC-coupled LO input - accepts +17 dBm drive; higher levels risk permanent damage |
Key Features
| Feature | Design Value |
|---|---|
| Integrated 90° hybrid | Eliminates need for external quadrature coupler - reduces board area and assembly complexity |
| Wide IF bandwidth (DC–4.5 GHz) | Supports direct baseband digitization and flexible IF planning in software-defined radios |
| High LO-to-RF isolation (40 dB typ.) | Reduces need for external LO filtering - simplifies front-end filtering requirements |
| ESD rating (HBM Class 1A) | Requires strict handling protocol but enables robust production assembly with proper grounding |
| Thermal resistance (191.5 °C/W) | Enables 340 mW dissipation at 85°C ambient - mandates thermal via array under ground paddle |
Applications
| Point-to-Point Radios | VSAT Terminals |
|---|---|
Use Scenario: High-capacity backhaul links operating in E-band (24–28 GHz) requiring low-EVM modulation and interference immunity. IC Role / Device Role / Timing Role: Image-reject downconverter converting RF to 100 MHz USB IF for ADC sampling. Use Value: 20 dB image rejection and ±0.5 dB amplitude balance preserve constellation fidelity in 256-QAM systems. |
Use Scenario: Outdoor satellite terminals needing compact, surface-mount RF front-end for receive-only operation. IC Role / Device Role / Timing Role: Single-sideband upconverter translating L-band IF to 29–31 GHz transmit band. Use Value: +20 dBm IP3 and 40 dB LO-to-RF isolation reduce adjacent-channel interference in shared spectrum. |
| Military Radar Receivers | Test Equipment Signal Generators |
Use Scenario: Coherent pulsed radar receivers requiring phase-stable I/Q demodulation across wide instantaneous bandwidth. IC Role / Device Role / Timing Role: Quadrature downconverter with DC–4.5 GHz IF output feeding real-time digital beamforming ASICs. Use Value: ±2.5° phase balance and DC-coupled IF outputs maintain time-aligned I/Q sample pairs for Doppler processing. |
Use Scenario: Vector signal analyzers generating calibrated millimeter-wave test tones with minimal spurious content. IC Role / Device Role / Timing Role: SSB upconverter driven by DAC-based IF synthesizer to produce clean 22–32 GHz output. Use Value: Low conversion loss (13 dB typ.) and high sideband rejection (>35 dBc) improve dynamic range and measurement accuracy. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar I/Q mixer applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| HMC1048LC3BTR | Wider RF range (17–32 GHz), lower conversion loss (11 dB typ.), but narrower IF bandwidth (DC–2.5 GHz) | Better suited for sub-22 GHz legacy systems; less suitable for full 4.5 GHz IF digitization | Select when RF coverage below 22 GHz is required and IF bandwidth <2.5 GHz suffices |
| Qorvo QM11024 | Same 22–32 GHz RF range, +18 dBm P1dB, but no integrated hybrid - requires external 90° coupler | Higher board-level integration effort; better thermal performance (RθJA = 140 °C/W) | Select when thermal management is critical and external hybrid layout is acceptable |
Compared with HMC524LC3BTR, HMC1048LC3BTR extends low-end RF coverage at the cost of IF bandwidth, while QM11024 trades integration for improved thermal dissipation - both require redesign of IF routing or hybrid placement, unlike the drop-in-ready HMC524LC3BTR.
Availability
HMC524LC3BTR is available at Aetrix Electronics and suitable for point-to-point radios, VSAT terminals, and military radar receivers requiring stable component supply, consistent RF performance across temperature, and long-term obsolescence mitigation.
Supply support for HMC524LC3BTR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Analog Devices acquired Hittite Microwave in 2014 and maintains its high-frequency RF portfolio, specializing in GaAs and GaN MMICs for defense, aerospace, and communications infrastructure.
The HMC524LC3BTR belongs to Hittite's legacy I/Q mixer product line, designed specifically for compact, surface-mount E-band transceivers where hybrid assemblies were previously required - enabling smaller form factors and automated assembly.
FAQ
What is the maximum LO drive level for HMC524LC3BTR?
The absolute maximum LO drive level for HMC524LC3BTR is +27 dBm. Operation above this level risks permanent damage to the GaAs MESFET structure. For optimal performance and reliability, Analog Devices specifies +17 dBm as the recommended LO drive - delivering 13 dB typical conversion loss and 20 dB image rejection. Exceeding +17 dBm increases conversion gain marginally but degrades linearity and accelerates thermal stress on the HMC524LC3BTR die.
Can HMC524LC3BTR operate as both an image-reject mixer and an upconverter?
Yes, the HMC524LC3BTR can operate as either an image-reject downconverter (IRM) or a single-sideband (SSB) upconverter. As an IRM, it uses external IF hybrids to achieve 20 dB image rejection; as an upconverter, it generates clean USB output at 100 MHz IF. The HMC524LC3BTR's internal 90° hybrid and balanced topology support both modes without hardware change - only LO and IF port routing differs per application.
What is the DC current limit on the IF1 and IF2 ports of HMC524LC3BTR?
The IF1 and IF2 ports of HMC524LC3BTR are DC-coupled and must not source or sink more than ±3 mA of DC current. Exceeding this limit risks non-function or irreversible die failure due to junction overcurrent. For AC-coupled IF paths, external series capacitors should be selected to pass the required IF band (e.g., 100 MHz) while blocking DC bias - ensuring compliance with the HMC524LC3BTR's absolute maximum rating.
Does HMC524LC3BTR require external matching networks?
No, the HMC524LC3BTR features internally matched 50 Ω RF and LO inputs, and DC-coupled IF outputs - eliminating the need for external matching networks at those ports. The RF and LO pads are designed for direct connection to 50 Ω microstrip lines. However, IF output filtering or amplification may be added externally depending on system noise figure and dynamic range requirements - the HMC524LC3BTR itself requires no impedance tuning circuitry.
What is the thermal resistance and power dissipation limit of HMC524LC3BTR?
The HMC524LC3BTR has a junction-to-die-bottom thermal resistance (RTH) of 191.5 °C/W. At 85°C ambient, its continuous power dissipation limit is 340 mW, derating by 9.8 mW/°C above that temperature. To meet this spec, the exposed ground paddle and all GND pins (1, 3, 7, 8, 10, 11, 12) must be soldered to a thermally robust PCB ground plane with multiple vias - insufficient thermal relief will cause junction temperatures to exceed 150°C, triggering permanent failure of the HMC524LC3BTR.
HMC524LC3BTR Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Analog Devices Inc.
- Series:
- -
- Package/Case:
- 12-VFQFN Exposed Pad
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Obsolete
- RF Type:
- General Purpose
- Frequency:
- 22GHz ~ 32GHz
- Number of Mixers:
- 2
- Gain:
- -
- Noise Figure:
- -
- Secondary Attributes:
- Up Converter
- Current - Supply:
- -
- Voltage - Supply:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 12-SMT (3x3)
HMC524LC3BTR FAQ
1.How can I place an order for HMC524LC3BTR through Aetrix?
Please submit a Request for Quotation (RFQ) for HMC524LC3BTR on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for HMC524LC3BTR reliable?
The price and inventory of HMC524LC3BTR are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for HMC524LC3BTR is usually 5 days.
3.What payment methods are accepted for HMC524LC3BTR?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for HMC524LC3BTR transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for HMC524LC3BTR?
HMC524LC3BTR orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your HMC524LC3BTR order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for HMC524LC3BTR?
For technical support, including HMC524LC3BTR datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your HMC524LC3BTR requirements.
6.How does Aetrix verify that HMC524LC3BTR is sourced from the original manufacturer or authorized distributors?
All HMC524LC3BTR products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that HMC524LC3BTR meets industry standards.
7.What is the process for return or replacement of HMC524LC3BTR?
All HMC524LC3BTR units undergo pre-shipment inspection (PSI). If there is an issue with HMC524LC3BTR, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The HMC524LC3BTR part is unused and in its original packaging.
Return procedure for HMC524LC3BTR:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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