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Analog Devices Inc. HMC553AG-SX
- Part No.:
- HMC553AG-SX
- Manufacturer:
- Analog Devices Inc.
- Category:
- RF Mixers
- Package:
- Die
- Datasheet:
-
HMC553AG-SX.pdf
- Description:
- MIXERS
- Quantity:
- Payment:
- Shipping:
Inventory:1,750
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Product details
Overview
HMC553AG-SX from Analog Devices is a GaAs MMIC double-balanced mixer operating from 6 GHz to 14 GHz RF/LO and dc to 5 GHz IF, requiring no DC bias, delivering ≤10 dB conversion loss, ≥21 dBm input IP3 (typ), and 37 dB LO-to-RF isolation - deployed in microwave VSAT radios and military EW systems.
For engineers reviewing the HMC553AG-SX datasheet, HMC553AG-SX pinout, HMC553AG-SX application, or HMC553AG-SX equivalent, this page delivers verified RF mixer specifications, bare-die pad mapping, thermal and isolation performance across temperature, and validated alternatives for high-frequency up/downconversion design.
Technical Context
The HMC553AG-SX uses a passive GaAs MESFET-based double-balanced topology with integrated balun structures, enabling simultaneous high LO-to-RF (32–37 dB) and LO-to-IF (28–35 dB) suppression without external matching. Its dc-coupled IF port supports baseband operation, while ac-coupled RF and LO ports are internally matched to 50 Ω.
It operates as both upconverter (IF dc–5 GHz → RF 6–14 GHz) and downconverter (RF 6–14 GHz → IF dc–5 GHz) with LO drive of +9 to +15 dBm. Performance remains stable across −40°C to +85°C, with P1dB up to +10.5 dBm and IP2 >40 dBm in the 6–11 GHz band.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| RF/LO Frequency Range | 6–14 GHz - enables direct use in X-band radar, point-to-point backhaul, and military C3I transceivers without frequency translation stages. |
| IF Bandwidth | dc to 5 GHz - supports zero-IF architectures and wideband modulation schemes including QPSK and 256-QAM up to 4 GHz signal bandwidth. |
| Conversion Loss | ≤10 dB (max) - minimizes cascaded noise figure impact when paired with low-noise amplifiers in receiver front-ends. |
| Input IP3 | ≥21 dBm (typ, 11–14 GHz) - ensures linearity in high-dynamic-range applications such as ECM jammers and broadband test equipment. |
| LO-to-RF Isolation | 32–37 dB (typ) - reduces LO leakage into antenna paths, easing filtering requirements and improving spectral purity in full-duplex systems. |
| Package | 7-pad bare die, 0.950 mm × 0.750 mm - requires wire-bond mounting on RF substrate; bottom-side ground enables low-inductance thermal and RF return path. |
| DC Bias | No DC bias required - eliminates bias network complexity, reduces power supply count, and improves reliability in harsh-environment deployments. |
Pinout & Package
7-pad RoHS-compliant GaAs bare die (0.950 mm × 0.750 mm); die bottom serves as RF/dc ground plane and must be eutectically bonded or attached with conductive epoxy.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| Pad 1, 4, 5, 7 | GND | RF and DC ground terminals - must be bonded to system ground plane; critical for balun balance and isolation performance. |
| Pad 2 | LO | Local oscillator input - ac-coupled, 50 Ω matched; accepts +9 to +15 dBm drive without external tuning. |
| Pad 3 | RF | Radiating-frequency port - ac-coupled, 50 Ω matched; handles up to +25 dBm RF input per absolute ratings. |
| Pad 6 | IF | Intermediate frequency port - dc-coupled; supports baseband operation but limited to ±3 mA source/sink current to prevent die malfunction. |
Key Features
| Feature | Design Value |
|---|---|
| Passive mixer architecture | Zero DC bias requirement eliminates power sequencing, reduces BOM count, and removes thermal drift from active bias networks. |
| Double-balanced topology with optimized baluns | Delivers ≥32 dB LO-to-RF and ≥28 dB LO-to-IF isolation - suppresses spurious mixing products and simplifies filter design. |
| Wide IF bandwidth (dc–5 GHz) | Enables direct sampling of IF outputs by high-speed ADCs (e.g., 4+ GSPS) without IF amplification or bandpass filtering. |
| High linearity (IP3 ≥21 dBm) | Maintains signal integrity in dense spectral environments - essential for multi-carrier VSAT and electronic warfare receivers. |
| Temperature-stable performance (−40°C to +85°C) | Conversion loss variation <1.5 dB and IP3 shift <2 dB across full range - supports uncooled outdoor radio deployments. |
Applications
| Microwave VSAT Radios | Electronic Warfare Receivers |
|---|---|
Use Scenario: Transmit/receive signal path in 11–12.75 GHz satellite terminal with dual-polarization support. IC Role / Device Role / Timing Role: Downconverts Ku-band RF to L-band IF for digitization; upconverts baseband waveforms for transmission. Use Value: 37 dB LO-to-RF isolation prevents self-interference between co-located Tx/Rx chains; dc–5 GHz IF enables flexible channelization. |
Use Scenario: Wideband signal intelligence (SIGINT) front-end capturing 6–14 GHz threat emissions. IC Role / Device Role / Timing Role: High-linearity downconverter feeding 4 GSPS ADC; operates across full RF band without retuning. Use Value: ≥21 dBm IP3 preserves dynamic range against strong adjacent-channel jammers; passive design ensures low power-up latency. |
| Point-to-Point Backhaul | Test & Measurement Equipment |
Use Scenario: 7–8 GHz licensed band link with 256-QAM modulation and 112 MHz channel bandwidth. IC Role / Device Role / Timing Role: Upconverter in transmitter chain; converts baseband I/Q signals to RF with minimal group delay variation. Use Value: ≤10 dB conversion loss maintains EVM under thermal stress; 0.95 mm × 0.75 mm die size enables compact multilayer module integration. |
Use Scenario: Vector signal analyzer front-end requiring calibrated wideband response from 6–14 GHz. IC Role / Device Role / Timing Role: Core mixer in harmonic mixing architecture; used with external LO synthesizer for phase-coherent measurements. Use Value: Stable conversion loss vs. temperature (<1.5 dB shift) ensures measurement repeatability across environmental chambers. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar double-balanced mixer applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| HMC1048LC4 | Wider RF range (4–16 GHz), higher conversion loss (11.5 dB max), larger 4 mm × 4 mm QFN package. | Better suited for lab-grade instrumentation requiring broader frequency coverage; less optimal for space-constrained VSAT modules. | Select HMC1048LC4 only if 4–6 GHz extension is mandatory and board area permits larger footprint. |
| QPC1006 | GaAs pHEMT process; 6–14 GHz range; 9 dB conversion loss (typ); 30 dB LO-to-RF isolation (typ); 3 mm × 3 mm QFN. | Higher isolation sensitivity to layout; requires external matching for optimal IF return loss below 1 GHz. | Prefer QPC1006 when surface-mount assembly is required and thermal management allows QFN packaging over bare die. |
Compared with HMC553AG-SX, HMC1048LC4 extends low-end frequency at the cost of conversion loss and size, while QPC1006 trades bare-die integration flexibility for simplified assembly - neither offers identical passive operation, dc-coupled IF, or 0.95 mm × 0.75 mm footprint.
Availability
HMC553AG-SX is available at Aetrix Electronics and suitable for microwave VSAT radios, electronic warfare receivers, and point-to-point backhaul systems requiring stable component supply across extended temperature ranges and high-frequency linearity.
Supply support for HMC553AG-SX includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Analog Devices is a global leader in high-performance analog, mixed-signal, and RF ICs, serving aerospace, defense, communications, and industrial markets with precision signal processing solutions.
The HMC553AG-SX belongs to Analog Devices' Hittite Microwave MMIC product line, engineered specifically for demanding microwave and millimeter-wave up/downconversion in defense and infrastructure applications.
FAQ
What is the recommended LO drive level for optimal performance of the HMC553AG-SX?
The HMC553AG-SX achieves best linearity and conversion loss across its 6–14 GHz band with LO drive between +11 dBm and +13 dBm. At +13 dBm, typical input IP3 reaches 21 dBm (11–14 GHz), and conversion loss remains ≤10 dB. Drive below +9 dBm degrades IP3 and increases conversion loss; above +15 dBm risks reliability per absolute maximum ratings.
Can the HMC553AG-SX operate with dc-coupled IF output in zero-IF receiver designs?
Yes - the HMC553AG-SX features a dc-coupled IF port, enabling true zero-IF architectures. However, the IF pad must not source or sink more than ±3 mA to avoid die malfunction. For baseband operation, ensure external circuitry (e.g., op-amp input stage) complies with this current limit while maintaining dc path integrity.
How is thermal management handled for the HMC553AG-SX bare die?
The HMC553AG-SX die bottom is electrically and thermally grounded. It must be attached directly to a copper ground plane using eutectic die attach or conductive epoxy. Junction temperature must remain ≤175°C; at TA = +85°C, continuous power dissipation is derated to 414 mW. Thermal vias under the ground pads improve heat extraction.
Does the HMC553AG-SX require external matching components for 50 Ω operation?
No - the HMC553AG-SX integrates internal 50 Ω matching on its ac-coupled LO and RF ports. Only the IF port may require external series capacitance if dc blocking is needed. No baluns, transformers, or stubs are required for nominal operation, simplifying PCB layout and reducing insertion loss.
What is the maximum RF input power the HMC553AG-SX can handle without damage?
The absolute maximum RF input power for the HMC553AG-SX is +25 dBm, as specified in the Absolute Maximum Ratings table. Sustained operation above this level risks permanent damage. For reliable linear operation, RF input should be kept ≤−10 dBm during standard downconversion testing; compression begins near +9.5 dBm (P1dB).
HMC553AG-SX Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Analog Devices Inc.
- Series:
- -
- Package/Case:
- Die
- Packaging:
- Tray
- Product Status:
- Active
- RF Type:
- VSAT
- Frequency:
- 6GHz ~ 14GHz
- Number of Mixers:
- 1
- Gain:
- -
- Noise Figure:
- 8dB
- Secondary Attributes:
- Up/Down Converter
- Current - Supply:
- -
- Voltage - Supply:
- -
- Mounting Type:
- -
- Supplier Device Package:
- Die
HMC553AG-SX FAQ
1.How can I place an order for HMC553AG-SX through Aetrix?
Please submit a Request for Quotation (RFQ) for HMC553AG-SX on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for HMC553AG-SX reliable?
The price and inventory of HMC553AG-SX are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for HMC553AG-SX is usually 5 days.
3.What payment methods are accepted for HMC553AG-SX?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for HMC553AG-SX transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for HMC553AG-SX?
HMC553AG-SX orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your HMC553AG-SX order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for HMC553AG-SX?
For technical support, including HMC553AG-SX datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your HMC553AG-SX requirements.
6.How does Aetrix verify that HMC553AG-SX is sourced from the original manufacturer or authorized distributors?
All HMC553AG-SX products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that HMC553AG-SX meets industry standards.
7.What is the process for return or replacement of HMC553AG-SX?
All HMC553AG-SX units undergo pre-shipment inspection (PSI). If there is an issue with HMC553AG-SX, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The HMC553AG-SX part is unused and in its original packaging.
Return procedure for HMC553AG-SX:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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