Analog Devices Inc. HMC553LC3B

Overview

HMC553LC3B from Analog Devices (formerly Hittite Microwave) is a GaAs MMIC double-balanced passive mixer operating from 7 to 14 GHz RF/LO and DC–5 GHz IF, delivering 7 dB typical conversion loss, 50 dB LO-to-RF isolation, and +22 dBm input IP3 - ideal for microwave up/downconversion in point-to-point radios and test equipment.

For engineers reviewing the HMC553LC3B datasheet, HMC553LC3B pinout, HMC553LC3B application, or HMC553LC3B equivalent, this page provides verified RF performance data, validated 12-lead ceramic SMT package mapping, functional pin roles, and two confirmed alternative mixers with documented frequency and linearity trade-offs.

Technical Context

The HMC553LC3B implements a passive double-balanced topology using GaAs MESFET process technology, eliminating need for external matching components or bias circuitry. Its optimized balun structures enable high LO-to-RF and LO-to-IF isolation across the full 7–14 GHz band.

It operates as both upconverter and downconverter with LO drive as low as +9 dBm, supports DC-coupled LO, RF, and IF ports, and maintains stable conversion gain and noise figure over –40°C to +85°C ambient temperature.

Key Specifications

Pinout & Package

12-lead leadless ceramic SMT package (3×3 mm, 9 mm² body), alumina substrate with gold-over-nickel plating, MSL3 rating, and exposed ground paddle requiring solder connection to PCB RF ground plane.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar passive double-balanced mixer applications.

Compared with HMC553LC3B, HMC1048LP3E extends usable bandwidth at the cost of 1.5 dB higher conversion loss and 3 dB lower IP3, while QPC1006 improves power handling but sacrifices DC IF capability and adds external matching complexity.

Availability

HMC553LC3B is available at Aetrix Electronics and suitable for point-to-point radios, test equipment, and military communications systems requiring stable component supply, RoHS-compliant SMT integration, and guaranteed performance across –40°C to +85°C.

Supply support for HMC553LC3B includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Analog Devices acquired Hittite Microwave in 2014, integrating its high-frequency RF IC portfolio into a broad mixed-signal and RF solutions platform.

The HMC553LC3B belongs to Hittite's legacy GaAs MMIC mixer product line, designed specifically for microwave communication systems demanding high isolation, wide IF bandwidth, and simplified surface-mount integration.

FAQ

What is the recommended LO drive level for optimal performance of the HMC553LC3B?

The HMC553LC3B achieves best conversion loss and isolation at +13 dBm LO drive, though it operates reliably from +9 dBm to +25 dBm. At +9 dBm, conversion loss increases by ~1.5 dB and LO-to-RF isolation drops ~5 dB versus +13 dBm. The HMC553LC3B datasheet specifies all key parameters at +13 dBm, making it the reference condition for design validation and system link budgeting.

Can the HMC553LC3B be used for DC-coupled IF operation?

Yes, the HMC553LC3B supports true DC-coupled IF operation on Pin 5, but only if the IF port sources or sinks ≤ ±2 mA DC current. Exceeding this limit risks non-function or permanent damage. For AC-coupled applications, a series capacitor sized for the lowest IF frequency (e.g., ≥100 pF for 10 MHz) is recommended. The HMC553LC3B's DC-coupled IF enables baseband I/Q demodulation without external blocking networks.

Does the HMC553LC3B require external matching components?

No, the HMC553LC3B requires no external matching components: all RF, LO, and IF ports are internally matched to 50 Ω and DC-coupled. This eliminates discrete baluns, transformers, or tuning stubs typically needed with passive mixers. The HMC553LC3B's monolithic GaAs MMIC design integrates optimized balun structures, enabling direct PCB connection to 50 Ω transmission lines per the evaluation board layout guidelines.

What is the thermal resistance and maximum channel temperature of the HMC553LC3B?

The HMC553LC3B has a channel-to-ground paddle thermal resistance of 364 °C/W and a maximum channel temperature rating of 150 °C. At 85 °C case temperature, its continuous power dissipation is 178 mW, derating linearly by 2.75 mW/°C above that. Proper thermal design - including soldering the exposed ground paddle and using ≥6 thermal vias to inner ground planes - is essential to maintain HMC553LC3B reliability under sustained RF load.

Is the HMC553LC3B pin-compatible with other Hittite mixer variants like HMC554LC3B?

No, the HMC553LC3B is not pin-compatible with HMC554LC3B or other variants in the LC3B family. While both use the same 12-lead 3×3 mm ceramic package footprint, their pin functions differ: HMC554LC3B swaps RF and IF pin assignments (Pin 5 = RF, Pin 8 = IF), and its internal balun configuration is optimized for different frequency sub-bands. Using HMC554LC3B as a drop-in replacement for HMC553LC3B will result in incorrect signal routing and degraded isolation.