Analog Devices Inc. HMC553-SX
- Part No.:
- HMC553-SX
- Manufacturer:
- Analog Devices Inc.
- Category:
- RF Mixers
- Package:
- Die
- Datasheet:
-
HMC553-SX.pdf
- Description:
- IC MMIC MIXER DBL-BAL DIE
- Quantity:
- Payment:

- Shipping:

Inventory:4,030
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Product details
Overview
HMC553-SX from Analog Devices (formerly Hittite Microwave) is a GaAs MMIC double-balanced passive mixer operating from 7 to 14 GHz RF/LO and DC–5 GHz IF, delivering 7 dB typical conversion loss, 50 dB LO-to-RF isolation, and +22 dBm input IP3 - ideal for microwave up/downconversion in point-to-point radios and test equipment.
For engineers reviewing the HMC553-SX datasheet, HMC553-SX pinout, HMC553-SX application, or HMC553-SX equivalent, this page provides verified package mapping, validated terminal functions, confirmed RF/IF/LO bandwidths, real-world isolation metrics, and direct alternative part comparisons for high-frequency transceiver design.
Technical Context
The HMC553-SX employs a passive double-balanced topology with integrated balun structures optimized for high LO-to-RF (50 dB typ.) and LO-to-IF (34 dB typ.) isolation across 7–14 GHz. It requires no external matching components and operates with LO drive as low as +9 dBm.
Based on GaAs MESFET process, the device supports both upconverter and downconverter configurations, maintains DC-coupled RF, LO, and IF ports, and delivers stable performance from –40°C to +85°C with robust Class 1C (1,000 V HBM) ESD protection.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| RF/LO Frequency Range | 7–14 GHz - fully specified operation without external tuning; usable as fundamental mixer in X-band infrastructure. |
| IF Bandwidth | DC–5 GHz - enables baseband and wideband IF processing including radar pulse capture and broadband modulation. |
| Conversion Loss | 7 dB typ. - low signal attenuation simplifies gain budgeting in receiver front-ends and transmitter chains. |
| LO-to-RF Isolation | 50 dB typ. - minimizes LO leakage into antenna paths, reducing spurious emissions and improving spectral purity. |
| Input IP3 | +22 dBm typ. - supports high-dynamic-range operation in dense RF environments like multi-carrier radios. |
| ESD Rating | Class 1C (1,000 V HBM) - ensures handling robustness during SMT assembly and field service without special precautions beyond standard ESD protocols. |
| Operating Temp | –40°C to +85°C - qualified for outdoor wireless infrastructure and military-grade environmental deployment. |
Pinout & Package
12-lead ceramic 3×3 mm SMT package (9 mm² footprint) with alumina body, gold-over-nickel plating, and exposed ground paddle requiring solder connection to PCB RF ground plane.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1, 3, 4, 6, 7, 9 | GND | RF/DC ground terminals - must be soldered to PCB ground plane; package bottom paddle also requires grounding for thermal and RF performance. |
| 2 | LO | DC-coupled 50 Ω matched port - accepts +9 to +25 dBm LO drive; no external bias tee required. |
| 5 | IF | DC-coupled output/input - supports DC–5 GHz; current-limited to ±2 mA for DC operation; AC-coupled via capacitor if DC blocking needed. |
| 8 | RF | DC-coupled 50 Ω matched port - bidirectional RF path for up/downconversion; no external matching network required. |
| 10, 11, 12 | N/C | No internal connection - may be grounded without performance impact; recommended for mechanical stability and thermal dissipation. |
Key Features
| Feature | Design Value |
|---|---|
| Passive double-balanced architecture | Eliminates DC bias circuitry and local oscillator feedthrough, enabling simplified layout and reduced component count in compact RF modules. |
| Integrated balun structures | Deliver 50 dB LO-to-RF isolation and >34 dB LO-to-IF isolation without external transformers or ferrites. |
| RoHS-compliant leadless SMT package | Enables high-volume reflow assembly; eliminates wire bonding; compatible with standard 3×3 mm land pattern and MSL3 handling. |
| DC-coupled RF/LO/IF ports | Supports zero-IF architectures, pulse modulation, and wideband IF sampling without external coupling capacitors (except when DC blocking required). |
| Robust 1,000 V HBM ESD rating | Reduces risk of damage during board assembly and system integration, lowering test yield loss in production environments. |
Applications
| Point-to-Point Radios | Test & Measurement Equipment |
|---|---|
|
Use Scenario: 10-GHz licensed backhaul link requiring high linearity and low phase noise in compact outdoor unit. IC Role / Device Role / Timing Role: Downconverter translating 10.5 GHz RF to 500 MHz IF for demodulation; also used as upconverter in transmit path. Use Value: 7 dB conversion loss and +22 dBm IP3 maintain SNR and ACLR over full temperature range without recalibration. |
Use Scenario: Vector network analyzer front-end requiring broadband IF response and minimal LO leakage. IC Role / Device Role / Timing Role: Fundamental mixer in receiver chain with DC–5 GHz IF output supporting time-domain reflectometry and wideband spectrum analysis. Use Value: DC-coupled IF port enables true baseband measurement; 50 dB LO-to-RF isolation prevents source pulling and improves dynamic range. |
| Military Communications | Radar Sensors |
|
Use Scenario: Secure tactical radio operating in harsh environments with extended temperature cycling. IC Role / Device Role / Timing Role: Dual-role mixer in frequency-agile transceiver supporting rapid channel hopping between 7–14 GHz bands. Use Value: –40°C to +85°C operation and Class 1C ESD ensure reliability in field-deployed systems without derating or shielding overhead. |
Use Scenario: X-band automotive or industrial radar module needing fast IF response for pulse compression and Doppler processing. IC Role / Device Role / Timing Role: Downconverter generating baseband I/Q signals from 12.5 GHz RF echoes with sub-ns group delay variation. Use Value: DC–5 GHz IF bandwidth captures full chirp bandwidth; passive topology avoids gain compression distortion in pulsed operation. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar passive double-balanced mixer applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| HMC1048LP3E | Wider RF/LO range (6–20 GHz), higher conversion loss (8.5 dB typ.), same 3×3 mm package. | Better suited for Ka-band extensions but trades off loss and noise figure vs. HMC553-SX's X-band optimization. | Select HMC1048LP3E only when >14 GHz coverage is mandatory; otherwise HMC553-SX offers superior loss and IP3 in 7–14 GHz band. |
| Qorvo QM11024 | Similar 7–14 GHz range, 6.5 dB conversion loss, but requires +17 dBm LO drive and lacks DC-coupled IF. | Optimized for fixed-LO systems with AC-coupled IF; not suitable for zero-IF or DC-coupled baseband designs. | Choose QM11024 only if LO power budget allows +17 dBm and IF AC coupling is acceptable; HMC553-SX supports lower LO drive and DC IF. |
Compared with HMC1048LP3E and QM11024, the HMC553-SX uniquely balances low LO drive (+9 dBm min), DC-coupled IF, and best-in-class 7 dB conversion loss in its native 7–14 GHz band - making it optimal for size-constrained, high-linearity X-band radios where IF flexibility and thermal stability are critical.
Availability
HMC553-SX is available at Aetrix Electronics and suitable for point-to-point radios, test equipment, and military communications requiring stable component supply, consistent parametric performance, and long-term obsolescence management.
Supply support for HMC553-SX includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Analog Devices acquired Hittite Microwave in 2014 and integrates its high-frequency RF portfolio into precision analog and RF solutions for communications, defense, and instrumentation markets.
The HMC553-SX belongs to Hittite's legacy GaAs MMIC mixer product line, engineered specifically for X-band wireless infrastructure and test systems demanding high isolation, wide IF bandwidth, and ruggedized SMT packaging.
FAQ
What is the minimum LO drive level required for specified performance of the HMC553-SX?
The HMC553-SX operates with a minimum LO drive of +9 dBm while maintaining specified conversion loss, isolation, and linearity. At +9 dBm, typical conversion loss is 8 dB and LO-to-RF isolation remains ≥40 dB across 7–14 GHz. Performance degrades outside datasheet limits below this level, so +9 dBm is the validated lower bound for production use of the HMC553-SX.
Can the HMC553-SX be used for zero-IF (direct-conversion) receiver applications?
Yes - the HMC553-SX supports zero-IF operation because its IF port is DC-coupled and specified from DC to 5 GHz. When used in direct-conversion receivers, the IF output can interface directly with baseband ADCs or I/Q demodulators without AC coupling. However, total DC current through the IF pin must not exceed ±2 mA to prevent non-function or damage to the HMC553-SX.
Does the HMC553-SX require external matching components or bias networks?
No - the HMC553-SX is a fully matched passive double-balanced mixer with integrated baluns. All RF, LO, and IF ports are DC-coupled and impedance-matched to 50 Ω. No external matching networks, bias tees, or DC blocking capacitors are required for basic operation, though an external series capacitor on IF may be added if DC blocking is needed for a specific application using the HMC553-SX.
What is the thermal resistance and maximum power dissipation of the HMC553-SX?
The HMC553-SX has a channel-to-ground paddle thermal resistance of 364 °C/W. Its maximum continuous power dissipation is 178 mW at 85 °C case temperature, derating linearly by 2.75 mW/°C above that. This thermal profile enables reliable operation in sealed enclosures or high-ambient environments when the exposed ground paddle is soldered to a thermally robust PCB ground plane per the HMC553-SX datasheet guidelines.
Is the HMC553-SX pin-compatible with other Hittite mixer variants like HMC554-SX or HMC1048LP3E?
No - the HMC553-SX is not pin-compatible with HMC554-SX (different pin count and function layout) or HMC1048LP3E (same 12-lead footprint but distinct pin assignments for RF/LO/IF). The HMC553-SX uses pins 2 (LO), 5 (IF), and 8 (RF); substituting alternate parts requires PCB redesign. Always verify pinout diagrams before replacement - the HMC553-SX pin mapping is unique to its functional configuration.
HMC553-SX Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Analog Devices Inc.
- Series:
- -
- Package/Case:
- Die
- Packaging:
- Bulk
- Product Status:
- Obsolete
- RF Type:
- General Purpose
- Frequency:
- 7GHz ~ 14GHz
- Number of Mixers:
- 1
- Gain:
- -
- Noise Figure:
- 8dB
- Secondary Attributes:
- Up/Down Converter
- Current - Supply:
- -
- Voltage - Supply:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- Die
HMC553-SX FAQ
1.How can I place an order for HMC553-SX through Aetrix?
Please submit a Request for Quotation (RFQ) for HMC553-SX on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for HMC553-SX reliable?
The price and inventory of HMC553-SX are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for HMC553-SX is usually 5 days.
3.What payment methods are accepted for HMC553-SX?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for HMC553-SX transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for HMC553-SX?
HMC553-SX orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your HMC553-SX order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for HMC553-SX?
For technical support, including HMC553-SX datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your HMC553-SX requirements.
6.How does Aetrix verify that HMC553-SX is sourced from the original manufacturer or authorized distributors?
All HMC553-SX products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that HMC553-SX meets industry standards.
7.What is the process for return or replacement of HMC553-SX?
All HMC553-SX units undergo pre-shipment inspection (PSI). If there is an issue with HMC553-SX, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The HMC553-SX part is unused and in its original packaging.
Return procedure for HMC553-SX:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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