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Analog Devices Inc. HMC554ALC3BTR
- Part No.:
- HMC554ALC3BTR
- Manufacturer:
- Analog Devices Inc.
- Category:
- RF Mixers
- Package:
- 12-CLCC Exposed Pad
- Datasheet:
-
HMC554ALC3BTR.pdf
- Description:
- IC MMIC MIXER DBL-BAL 12SMD
- Quantity:
- Payment:
- Shipping:
Inventory:164
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Product details
Overview
HMC554ALC3BTR from Analog Devices is a GaAs MMIC double-balanced mixer operating from 10 GHz to 20 GHz RF, with 0–6 GHz IF bandwidth and DC-coupled IF port. It delivers 8.5 dB typical conversion loss, 20 dBm input IP3, and 37 dB LO-to-RF isolation, enabling high-dynamic-range upconversion or downconversion in microwave radios and EW systems.
For engineers reviewing the HMC554ALC3BTR datasheet, HMC554ALC3BTR pinout, HMC554ALC3BTR application, or HMC554ALC3BTR equivalent, this page provides verified RF performance data, validated LCC-12 terminal mapping, thermal and ESD specifications per JEDEC JESD51-2, and real-world substitution guidance for microwave front-end design.
Technical Context
The HMC554ALC3BTR uses a GaAs MESFET-based double-balanced topology with integrated balun structures, eliminating external matching components. Its passive architecture requires no bias current and supports both upper- and lower-sideband operation across full 10–20 GHz RF range.
It achieves broadband LO-to-RF isolation (25–37 dB) and RF-to-IF isolation (24–41 dB) via optimized on-die baluns. The dc-coupled IF port supports baseband-to-6 GHz operation, while ac-coupled RF and LO ports are internally matched to 50 Ω.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| RF Frequency Range | 10 GHz to 20 GHz - Enables direct microwave band coverage without frequency translation stages. |
| IF Bandwidth | DC to 6 GHz - Supports baseband, IF-sampling, and wideband modulation schemes including QAM and OFDM. |
| Conversion Loss | 8.5 dB typical - Defines signal attenuation between RF and IF paths; impacts system noise figure and gain budget. |
| Input IP3 | 20 dBm typical - Determines third-order intermodulation distortion floor in multi-tone RF environments. |
| LO-to-RF Isolation | 37 dB typical - Minimizes LO leakage into antenna path, critical for receiver dynamic range and transmitter spectral purity. |
| Package | 2.90 mm × 2.90 mm, 12-terminal RoHS-compliant LCC - Surface-mount compatible with standard reflow profiles (260°C peak). |
| Operating Temp | −40°C to +85°C - Validated for deployment in outdoor VSAT terminals and military field equipment. |
Pinout & Package
Package: 2.90 mm × 2.90 mm leadless chip carrier (LCC-12) with exposed ground pad (EPAD). Requires RF/dc grounding of EPAD and all GND pins for optimal isolation and thermal dissipation (θJA = 120°C/W).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1, 3, 4, 6, 7, 9 | GND | RF/dc ground reference; must be soldered to solid ground plane for balun integrity and thermal conduction. |
| 2 | LO | Local oscillator input; ac-coupled, 50 Ω matched - accepts +9 to +15 dBm LO drive without external matching. |
| 5 | IF | Intermediate frequency port; dc-coupled - supports baseband operation but limited to ±3 mA source/sink current. |
| 8 | RF | Radio frequency port; ac-coupled, 50 Ω matched - handles −40 dBm to +25 dBm RF input per absolute ratings. |
| 10, 11, 12 | NIC | Not internally connected - may be grounded to improve mechanical stability or EMI shielding without affecting RF performance. |
| EPAD | Exposed Pad | Thermal and electrical ground path - mandatory connection to PCB ground plane for junction temperature control and RF return. |
Key Features
| Feature | Design Value |
|---|---|
| No external matching required | Integrated 50 Ω ac-coupling on RF/LO ports and dc-coupling on IF eliminates discrete capacitors/inductors in signal path. |
| High LO-to-RF isolation | 37 dB typ ensures minimal LO radiation into antenna systems, reducing spurious emissions and improving receiver blocking immunity. |
| Broad IF bandwidth | DC–6 GHz IF range enables direct sampling of wideband waveforms (e.g., 5G NR FR2, radar chirps) without IF filtering bottlenecks. |
| RoHS-compliant LCC package | Leadless 2.9 mm × 2.9 mm footprint supports automated SMT assembly and eliminates wire-bond reliability concerns. |
| Wide temperature operation | Specified performance from −40°C to +85°C enables use in uncontrolled environmental enclosures and airborne platforms. |
Applications
| Microwave VSAT Radios | Electronic Warfare Receivers |
|---|---|
|
Use Scenario: High-throughput satellite ground terminals operating in Ka-band (26.5–40 GHz) using image-reject or harmonic mixing architectures. IC Role / Device Role / Timing Role: Downconverter translating 18–22 GHz RF to 1–5 GHz IF for digitization and demodulation. Use Value: 8.5 dB conversion loss and 20 dBm IP3 maintain EVM < 3% under multi-carrier loading at 100 MHz channel spacing. |
Use Scenario: Wideband SIGINT receivers capturing instantaneous bandwidths > 1 GHz across 10–20 GHz spectrum. IC Role / Device Role / Timing Role: First-stage downconverter in superheterodyne architecture, preserving phase coherence for direction-finding. Use Value: 37 dB LO-to-RF isolation prevents LO self-mixing artifacts that degrade sensitivity below −110 dBm/Hz. |
| Millimeter-Wave Test Equipment | Military ECM Transmitters |
|
Use Scenario: Vector signal analyzers requiring calibrated amplitude/phase response across 10–20 GHz for 5G FR2 device validation. IC Role / Device Role / Timing Role: Upconverter generating test tones from baseband I/Q sources to RF output for DUT stimulus. Use Value: 6.5 dB upconversion loss at 3 GHz IF and 15 GHz RF enables > 10 dBm output power with < 0.5 dB gain flatness. |
Use Scenario: Jammer front-ends generating high-power deceptive signals in contested 12–18 GHz radar bands. IC Role / Device Role / Timing Role: Final-stage upconverter modulating jamming waveforms onto high-power LO-driven RF carriers. Use Value: 10 dBm P1dB and 46 dBm IP2 suppress second-harmonic generation that could trigger radar warning receivers. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar double-balanced mixer applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| HMC774ALC3TR | Wider RF range (7–27 GHz), higher conversion loss (9.5 dB typ), same LCC-12 package. | Better suited for X/Ku-band radar testing where extended low-end coverage is needed. | Select when RF band extends below 10 GHz; verify LO drive level compatibility (requires +15 dBm min). |
| QPC7332TR13 | GaAs pHEMT process, 12–22 GHz RF, 7.5 dB conversion loss, 5×5 mm QFN-24 package. | Higher integration density but requires external matching networks and has different thermal profile. | Choose for space-constrained designs accepting added layout complexity; not drop-in compatible due to pin count and footprint mismatch. |
Compared with HMC554ALC3BTR, HMC774ALC3TR trades bandwidth extension for slightly degraded linearity, while QPC7332TR13 offers lower loss at the cost of increased design effort and non-compatible packaging-making HMC554ALC3BTR optimal for fixed 10–20 GHz VSAT and EW systems prioritizing simplicity and proven reliability.
Availability
HMC554ALC3BTR is available at Aetrix Electronics and suitable for microwave VSAT radios, electronic warfare receivers, and millimeter-wave test equipment requiring stable component supply, long-term obsolescence management, and traceable lot-level documentation.
Supply support for HMC554ALC3BTR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Analog Devices is a global leader in high-performance analog, mixed-signal, and RF ICs, serving aerospace, defense, communications, and instrumentation markets with precision signal processing solutions.
The HMC554ALC3BTR belongs to Analog Devices' Hittite Microwave MMIC product line, engineered specifically for broadband microwave front-end applications demanding high isolation, wide IF bandwidth, and ruggedized surface-mount packaging.
FAQ
What is the maximum RF input power rating for the HMC554ALC3BTR?
The HMC554ALC3BTR has an absolute maximum RF input power rating of +25 dBm, as specified in the Absolute Maximum Ratings table. Exceeding this level risks permanent damage to the GaAs die. For reliable operation, RF input should remain ≤ +20 dBm under continuous wave conditions, especially at elevated ambient temperatures above +70°C. Derating is recommended per thermal resistance (θJA = 120°C/W) and PCB copper area.
Can the HMC554ALC3BTR operate with DC-coupled IF signals?
Yes, the HMC554ALC3BTR features a dc-coupled IF port, enabling true baseband operation. However, the IF pin must not source or sink more than ±3 mA of current, as exceeding this limit may cause die malfunction or failure. For AC-coupled IF applications, an external series capacitor is recommended to block DC while passing the required IF bandwidth up to 6 GHz.
Does the HMC554ALC3BTR require external bias or matching components?
No, the HMC554ALC3BTR is a fully passive double-balanced mixer fabricated in GaAs MESFET technology and requires no external bias voltage or current. Its RF and LO ports are internally ac-coupled and matched to 50 Ω, and the IF port is dc-coupled - eliminating the need for external matching networks, baluns, or DC-blocking capacitors in most configurations.
What is the thermal resistance (θJA) of the HMC554ALC3BTR package?
The HMC554ALC3BTR in its E-12-41 LCC package has a natural-convection junction-to-ambient thermal resistance (θJA) of 120°C/W, measured per JEDEC standard JESD51-2 in a one-cubic-foot sealed enclosure. Effective thermal management requires robust grounding of the exposed pad and surrounding GND pins to a multilayer PCB's internal ground plane with ≥4 thermal vias.
How does LO power level affect conversion loss in the HMC554ALC3BTR?
Conversion loss in the HMC554ALC3BTR improves with increasing LO drive: at +9 dBm it is ~11.5 dB, at +13 dBm it is 8.5 dB typ, and at +15 dBm it reaches ~7 dB. Operating below +9 dBm degrades conversion efficiency and increases noise figure; exceeding +15 dBm yields diminishing returns and risks LO port damage per absolute ratings.
HMC554ALC3BTR Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Analog Devices Inc.
- Series:
- -
- Package/Case:
- 12-CLCC Exposed Pad
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- RF Type:
- VSAT
- Frequency:
- 11GHz ~ 20GHz
- Number of Mixers:
- 1
- Gain:
- -
- Noise Figure:
- 8dB
- Secondary Attributes:
- -
- Current - Supply:
- -
- Voltage - Supply:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 12-CLCC (2.9x2.9)
HMC554ALC3BTR FAQ
1.How can I place an order for HMC554ALC3BTR through Aetrix?
Please submit a Request for Quotation (RFQ) for HMC554ALC3BTR on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for HMC554ALC3BTR reliable?
The price and inventory of HMC554ALC3BTR are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for HMC554ALC3BTR is usually 5 days.
3.What payment methods are accepted for HMC554ALC3BTR?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for HMC554ALC3BTR transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for HMC554ALC3BTR?
HMC554ALC3BTR orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your HMC554ALC3BTR order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for HMC554ALC3BTR?
For technical support, including HMC554ALC3BTR datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your HMC554ALC3BTR requirements.
6.How does Aetrix verify that HMC554ALC3BTR is sourced from the original manufacturer or authorized distributors?
All HMC554ALC3BTR products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that HMC554ALC3BTR meets industry standards.
7.What is the process for return or replacement of HMC554ALC3BTR?
All HMC554ALC3BTR units undergo pre-shipment inspection (PSI). If there is an issue with HMC554ALC3BTR, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The HMC554ALC3BTR part is unused and in its original packaging.
Return procedure for HMC554ALC3BTR:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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