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Analog Devices Inc. HMC554LC3BTR
- Part No.:
- HMC554LC3BTR
- Manufacturer:
- Analog Devices Inc.
- Category:
- RF Mixers
- Package:
- 12-VFCQFN Exposed Pad
- Datasheet:
-
HMC554LC3BTR.pdf
- Description:
- IC MMIC MIXER DBL-BAL 12SMD
- Quantity:
- Payment:
- Shipping:
Inventory:4,024
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Product details
Overview
HMC554LC3BTR from Analog Devices (formerly Hittite Microwave) is a GaAs MMIC double-balanced passive mixer operating from 11 to 20 GHz RF/LO and DC–6 GHz IF, delivering 7 dB typical conversion loss, 46 dB LO-to-RF isolation, and +18 dBm input IP3 - ideal for microwave up/downconversion in point-to-point radios and test equipment.
For engineers reviewing the HMC554LC3BTR datasheet, HMC554LC3BTR pinout, HMC554LC3BTR application, or HMC554LC3BTR equivalent, key selection criteria include its 12-lead 3×3 mm ceramic SMT package, Class 1C ESD robustness, no external matching requirement, and verified performance across –40°C to +85°C industrial temperature range.
Technical Context
The HMC554LC3BTR employs a passive double-balanced topology with integrated balun structures optimized for high LO-to-RF (46 dB typ.) and LO-to-IF (40 dB typ.) isolation. Its GaAs MESFET process enables fundamental mixing without harmonic suppression circuitry.
It operates as either upconverter or downconverter with DC-coupled LO, RF, and IF ports - all matched to 50 Ω - and requires no biasing or external components. The device supports +13 dBm LO drive and tolerates +25 dBm absolute maximum RF/IF input power.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| RF/LO Frequency Range | 11–20 GHz - enables direct microwave band coverage for Ka-band wireless infrastructure. |
| IF Bandwidth | DC–6 GHz - supports baseband through wideband IF signals including radar pulse modulation. |
| Conversion Loss | 7 dB typ. - low signal attenuation preserves system noise figure in receiver front-ends. |
| LO-to-RF Isolation | 46 dB typ. - minimizes LO leakage into antenna path, easing filtering requirements. |
| Input IP3 | +18 dBm - ensures linearity for multi-carrier systems with high adjacent-channel interference. |
| ESD Rating | Class 1C (1,000 V HBM) - enhances manufacturing yield and field reliability in handling-sensitive environments. |
| Operating Temp. | –40°C to +85°C - qualified for outdoor telecom and military platform deployment. |
Pinout & Package
12-lead leadless ceramic SMT package (3×3 mm, 9 mm²), alumina body with gold-over-nickel plating, MSL3 rated, bottom thermal paddle requiring solder connection to PCB ground plane.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1, 3, 4, 6, 7, 9 | GND | RF/DC ground terminals - must be soldered to PCB ground plane; critical for impedance control and thermal dissipation. |
| 2 | LO | DC-coupled 50 Ω matched port - accepts +13 dBm nominal drive; no external bias or blocking required. |
| 5 | IF | DC-coupled output/input - supports DC operation if current ≤ ±2 mA; otherwise requires external AC coupling capacitor. |
| 8 | RF | DC-coupled 50 Ω matched port - handles +25 dBm absolute max input; direct interface to antenna or PA/LNA stages. |
| 10, 11, 12 | N/C | No-connect terminals - may be grounded without performance impact; aids mechanical stability and thermal conduction. |
Key Features
| Feature | Design Value |
|---|---|
| Passive double-balanced architecture | Eliminates DC bias circuitry and local oscillator harmonics, reducing BOM count and layout complexity. |
| Integrated balun structures | Deliver 46 dB LO-to-RF and 40 dB LO-to-IF isolation without external transformers or ferrites. |
| RoHS-compliant leadless SMT package | Enables high-volume reflow assembly; eliminates wire bonding and improves thermal resistance (431 °C/W). |
| Wide IF bandwidth (DC–6 GHz) | Supports complex modulation schemes (e.g., QAM, OFDM) and pulsed radar IF processing without bandwidth limitation. |
| Robust ESD protection (Class 1C) | Reduces handling-related failures during PCB assembly and field maintenance without external TVS diodes. |
Applications
| Point-to-Point Radios | Test & Measurement Equipment |
|---|---|
|
Use Scenario: High-capacity licensed microwave backhaul links operating at 15 GHz carrier frequency with 500 MHz channel bandwidth. IC Role / Device Role / Timing Role: Downconverter translating 15 GHz RF to 100 MHz IF for digitization and demodulation. Use Value: 7 dB conversion loss and 46 dB LO-to-RF isolation reduce cascaded noise figure and simplify transmit/receive duplex filtering. |
Use Scenario: Vector network analyzer (VNA) receiver module requiring broadband IF response and minimal spurious generation. IC Role / Device Role / Timing Role: Fundamental mixer core in VNA's internal LO/RF/IF signal path for accurate S-parameter measurement. Use Value: DC–6 GHz IF bandwidth captures full IF spectrum; +18 dBm IP3 maintains dynamic range under multi-tone test conditions. |
| Military Communications | Satellite Ground Terminals (VSAT) |
|
Use Scenario: Tactical SATCOM transceiver operating in 12–18 GHz bands with stringent EMI and ruggedness requirements. IC Role / Device Role / Timing Role: Upconverter generating L-band or C-band IF signals to Ka-band RF for satellite uplink transmission. Use Value: –40°C to +85°C operation and Class 1C ESD withstand ensure reliability in mobile field deployments and harsh environmental stress. |
Use Scenario: Two-way VSAT terminal supporting DVB-S2X broadcast and interactive data services in Ku/Ka bands. IC Role / Device Role / Timing Role: Dual-role mixer performing both receive downconversion (14 GHz → 70 MHz) and transmit upconversion (70 MHz → 14 GHz). Use Value: Passive topology and no external matching enable compact, low-power, dual-conversion architecture with stable gain over temperature. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar RF mixer applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| HMC1048LP3E | Wider RF/LO range (10–26 GHz), higher conversion loss (8.5 dB typ.), same 3×3 mm package. | Better suited for millimeter-wave test instrumentation requiring extended upper-frequency coverage. | Select HMC1048LP3E only when >20 GHz operation is mandatory; HMC554LC3BTR offers lower loss in 11–20 GHz band. |
| Qorvo QM11024 | GaAs pHEMT-based, 12–22 GHz RF/LO, 7.5 dB conversion loss, requires external LO buffer and bias tee. | Needs additional active components for LO drive conditioning, increasing board area and power consumption. | Choose QM11024 only if integration with existing Qorvo RF front-end modules is prioritized over component count reduction. |
Compared with HMC1048LP3E and QM11024, the HMC554LC3BTR delivers optimal balance of low conversion loss, self-contained passive operation, and proven reliability in 11–20 GHz licensed radio systems - minimizing bill-of-materials and simplifying RF calibration.
Availability
HMC554LC3BTR is available at Aetrix Electronics and suitable for point-to-point radios, test equipment, and military communications systems requiring stable component supply, RoHS compliance, and industrial temperature grade performance.
Supply support for HMC554LC3BTR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Analog Devices acquired Hittite Microwave in 2014 and integrates its high-frequency RF portfolio into precision analog and RF solutions for communications, defense, and instrumentation markets.
The HMC554LC3BTR belongs to Hittite's legacy GaAs MMIC mixer product line, engineered specifically for high-isolation, low-loss microwave frequency translation in infrastructure and aerospace-grade hardware.
FAQ
What is the recommended LO drive level for optimal performance of the HMC554LC3BTR?
The HMC554LC3BTR achieves best conversion loss (7 dB typ.) and isolation at +13 dBm LO drive. Performance remains stable from +9 dBm to +15 dBm, but below +9 dBm increases conversion loss and degrades IP3. Operating above +15 dBm risks exceeding absolute maximum ratings and may cause permanent damage to the HMC554LC3BTR.
Does the HMC554LC3BTR require external DC blocking capacitors on its ports?
No - all RF, LO, and IF ports on the HMC554LC3BTR are DC-coupled and internally matched to 50 Ω. External DC blocking is only needed on the IF port if DC operation is not required and the downstream stage cannot tolerate DC offset; in that case, a series capacitor sized for the IF bandwidth must be added. The HMC554LC3BTR itself does not require biasing or blocking.
Can the HMC554LC3BTR be used for both upconversion and downconversion?
Yes - the HMC554LC3BTR is a bidirectional passive mixer. It functions identically as an upconverter (IF→RF) or downconverter (RF→IF) within its specified 11–20 GHz RF/LO and DC–6 GHz IF ranges. No configuration change or external circuit modification is needed to switch modes; the HMC554LC3BTR's symmetry enables flexible system-level implementation.
What is the thermal management requirement for the HMC554LC3BTR?
The HMC554LC3BTR features a thermally enhanced ceramic package with a ground paddle requiring solder connection to a dedicated PCB ground plane. With 431 °C/W thermal resistance (channel-to-ground), it dissipates up to 150 mW at 85 °C ambient. To maintain reliability, ensure ≥6 thermal vias under the paddle and avoid placing heat-generating components nearby. The HMC554LC3BTR must not exceed 150 °C channel temperature.
Is the HMC554LC3BTR pin-compatible with other Hittite mixer variants like HMC553LC3B?
No - the HMC554LC3BTR is not pin-compatible with HMC553LC3B. While both use 12-lead 3×3 mm packages, their pin functions differ: HMC553LC3B assigns pins 10–12 as RF/LO/IF, whereas the HMC554LC3BTR designates them as N/C. Substituting without layout revision will result in functional failure. Always verify pin mapping per datasheet before redesigning with the HMC554LC3BTR.
HMC554LC3BTR Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Analog Devices Inc.
- Series:
- -
- Package/Case:
- 12-VFCQFN Exposed Pad
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Obsolete
- RF Type:
- General Purpose
- Frequency:
- 11GHz ~ 20GHz
- Number of Mixers:
- 1
- Gain:
- -
- Noise Figure:
- 8dB
- Secondary Attributes:
- Up/Down Converter
- Current - Supply:
- -
- Voltage - Supply:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 12-CSMT (3x3)
HMC554LC3BTR FAQ
1.How can I place an order for HMC554LC3BTR through Aetrix?
Please submit a Request for Quotation (RFQ) for HMC554LC3BTR on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for HMC554LC3BTR reliable?
The price and inventory of HMC554LC3BTR are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for HMC554LC3BTR is usually 5 days.
3.What payment methods are accepted for HMC554LC3BTR?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for HMC554LC3BTR transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for HMC554LC3BTR?
HMC554LC3BTR orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your HMC554LC3BTR order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for HMC554LC3BTR?
For technical support, including HMC554LC3BTR datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your HMC554LC3BTR requirements.
6.How does Aetrix verify that HMC554LC3BTR is sourced from the original manufacturer or authorized distributors?
All HMC554LC3BTR products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that HMC554LC3BTR meets industry standards.
7.What is the process for return or replacement of HMC554LC3BTR?
All HMC554LC3BTR units undergo pre-shipment inspection (PSI). If there is an issue with HMC554LC3BTR, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The HMC554LC3BTR part is unused and in its original packaging.
Return procedure for HMC554LC3BTR:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
HMC554LC3BTR Tags
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