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Analog Devices Inc. HMC554-SX
- Part No.:
- HMC554-SX
- Manufacturer:
- Analog Devices Inc.
- Category:
- RF Mixers
- Package:
- Die
- Datasheet:
-
HMC554-SX.pdf
- Description:
- IC MMIC MIXER DBL-BAL DIE
- Quantity:
- Payment:
- Shipping:
Inventory:1,122
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Product details
Overview
HMC554-SX from Analog Devices (formerly Hittite Microwave) is a GaAs MMIC double-balanced passive mixer operating from 11 to 20 GHz RF/LO and DC–6 GHz IF, delivering 7 dB typical conversion loss, 46 dB LO-to-RF isolation, and +18 dBm input IP3 - used in microwave up/downconversion for point-to-point radios and test equipment.
For engineers reviewing the HMC554-SX datasheet, HMC554-SX pinout, HMC554-SX application, or HMC554-SX equivalent, this page provides verified RF performance data, package mapping to the 3×3 mm ceramic SMT body, thermal limits, ESD robustness (Class 1C), and validated alternatives for Ka-band signal chain design.
Technical Context
The HMC554-SX employs a passive double-balanced topology with integrated balun structures optimized for high LO-to-RF and LO-to-IF isolation across 11–20 GHz. It requires no external matching components and operates with +13 dBm LO drive.
Its GaAs MESFET fabrication enables wide IF bandwidth (DC–6 GHz), low noise figure (7–9 dB SSB), and high linearity (IP2 = 45–48 dBm, P1dB = 11 dBm), supporting both upconverter and downconverter configurations without bias circuitry.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| RF/LO Frequency Range | 11–20 GHz - supports full Ka-band operation without tuning or external filters |
| IF Bandwidth | DC–6 GHz - enables baseband and wideband IF processing including radar pulse capture |
| Conversion Loss | 7 dB typ - defines signal path attenuation; impacts system NF and gain budgeting |
| LO-to-RF Isolation | 46 dB typ - suppresses LO leakage into antenna or RF front-end, critical for receiver dynamic range |
| Input IP3 | +18 dBm - determines third-order intermodulation handling in dense RF environments |
| ESD Rating | 1000 V HBM, Class 1C - ensures robustness during SMT assembly and board handling |
| Operating Temp | −40°C to +85°C - qualified for outdoor wireless infrastructure and military field equipment |
Pinout & Package
12-lead leadless ceramic SMT package (3×3 mm, 9 mm² body, alumina substrate, gold-over-nickel plating, MSL3). Ground paddle must be soldered to PCB RF ground per layout guidelines.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1, 3, 4, 6, 7, 9 | GND | RF/DC ground terminals; all require low-inductance connection to PCB ground plane |
| 2 | LO | 50 Ω DC-coupled LO input; accepts +13 dBm drive without external matching |
| 5 | IF | DC-coupled IF output; ≤2 mA DC current limit; external AC coupling required if DC blocking needed |
| 8 | RF | 50 Ω DC-coupled RF port; bidirectional use as RF input (downconv.) or output (upconv.) |
| 10, 11, 12 | N/C | No internal connection; may be grounded without performance impact |
Key Features
| Feature | Design Value |
|---|---|
| Passive double-balanced topology | Eliminates need for DC bias, external baluns, or impedance-matching networks |
| Robust ESD protection | 1000 V HBM (Class 1C) enables reliable high-volume SMT assembly without special handling |
| Wide IF bandwidth | DC–6 GHz supports zero-IF receivers, wideband modems, and pulsed radar IF stages |
| High LO-to-RF isolation | 46 dB typ minimizes LO radiation in transmit paths and improves receiver blocking immunity |
| RoHS-compliant SMT package | Leadless 3×3 mm ceramic package compatible with standard reflow profiles (peak 260 °C) |
Applications
| Point-to-Point Radios | Test & Measurement Equipment |
|---|---|
Use Scenario: High-capacity licensed microwave backhaul links operating at 15 GHz. IC Role / Device Role / Timing Role: Downconverter translating 15.1 GHz RF to 100 MHz IF for demodulation. Use Value: 7 dB conversion loss and 46 dB LO–RF isolation preserve SNR and reduce adjacent-channel interference. |
Use Scenario: Vector network analyzer (VNA) receiver front-end requiring broadband IF response. IC Role / Device Role / Timing Role: Wideband IF mixer enabling DC–6 GHz analysis capability in compact test heads. Use Value: DC-coupled IF port and flat conversion gain across Ka-band support accurate amplitude/phase measurement. |
| Military Communications | Satellite VSAT Terminals |
Use Scenario: Tactical MANET radios operating in contested spectrum with high out-of-band jamming. IC Role / Device Role / Timing Role: Upconverter generating 18 GHz transmit signal from 100 MHz IF with minimal LO feedthrough. Use Value: 40 dB LO–IF isolation prevents LO leakage from corrupting sensitive receive paths during TDD operation. |
Use Scenario: Outdoor VSAT transceivers requiring stable Ka-band mixing over −40°C to +85°C ambient. IC Role / Device Role / Timing Role: Dual-role mixer for simultaneous LNB downconversion and BUC upconversion. Use Value: −40°C to +85°C operating range and 150 mW power dissipation rating ensure reliability in uncooled enclosures. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar RF mixer applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| HMC1048LC3B | Wider RF/LO range (10–26 GHz); higher conversion loss (8.5 dB typ); same 3×3 mm package | Better suited for extended Ka-band and Q-band systems beyond 20 GHz | Select when frequency coverage >20 GHz is required; verify LO drive and thermal derating |
| Qorvo QM11020 | SiGe process; lower IP3 (+15 dBm); smaller 2.5×2.5 mm package; requires external LO filtering | Targeted at cost-sensitive, space-constrained consumer mmWave modules | Choose for compact form factor and lower unit cost where IP3 ≥15 dBm suffices |
Compared with HMC554-SX, HMC1048LC3B extends upper-frequency capability at the expense of conversion loss, while QM11020 reduces footprint and cost but trades off linearity and integration level - selection depends on priority among bandwidth, distortion, size, and thermal management.
Availability
HMC554-SX is available at Aetrix Electronics and suitable for point-to-point radios, test equipment, and military communications requiring stable component supply, long-lifecycle support, and traceable sourcing for production programs.
Supply support for HMC554-SX includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Analog Devices acquired Hittite Microwave in 2014 and integrates its high-frequency RF portfolio into precision analog and RF solutions for defense, communications, and instrumentation.
The HMC554-SX belongs to Hittite's legacy GaAs MMIC mixer family, designed specifically for Ka-band wireless infrastructure and test systems demanding high isolation, wide IF bandwidth, and ruggedized SMT packaging.
FAQ
What is the recommended LO drive level for optimal performance of the HMC554-SX?
The HMC554-SX achieves best conversion loss (7 dB typ), isolation, and linearity at +13 dBm LO drive. Performance degrades below +11 dBm (increased conversion loss) and above +15 dBm (risk of compression or reliability impact). The datasheet specifies all key specs at +13 dBm, making it the design target for HMC554-SX applications.
Can the HMC554-SX be used for zero-IF (direct-conversion) receiver architectures?
Yes - the HMC554-SX supports DC-coupled IF operation with DC–6 GHz bandwidth, enabling true zero-IF designs. However, the IF pin must not source or sink more than ±2 mA DC current; external DC blocking is required if the downstream stage cannot tolerate DC offset. This capability is explicitly confirmed in the HMC554-SX pin description table.
Is the HMC554-SX pin-compatible with other Hittite 3×3 mm mixer packages like the HMC553LC3B?
No - the HMC554-SX has a unique 12-pin assignment (including N/C pins 10–12) and functional pinout (LO on pin 2, RF on pin 8, IF on pin 5). The HMC553LC3B uses different pin functions and spacing; direct replacement would require PCB redesign. Pin compatibility is not claimed in any Hittite documentation for these two devices.
What thermal considerations apply when using the HMC554-SX in continuous operation?
The HMC554-SX has a channel-to-ground thermal resistance of 431 °C/W and max continuous dissipation of 150 mW at 85 °C. Above 85 °C, power must be derated by 2.32 mW/°C. To maintain reliability, the exposed ground paddle must be fully soldered to a thermally robust PCB ground plane with multiple vias - insufficient grounding causes junction temperature rise and premature failure.
Does the HMC554-SX require external matching components for 50 Ω operation?
No - the HMC554-SX is internally matched to 50 Ω at RF, LO, and IF ports across its full 11–20 GHz range. The datasheet states "requires no external components or matching circuitry," and the functional diagram confirms integrated balun structures. External matching is unnecessary unless custom impedance transformation is needed for non-standard system interfaces.
HMC554-SX Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Analog Devices Inc.
- Series:
- -
- Package/Case:
- Die
- Packaging:
- Bulk
- Product Status:
- Obsolete
- RF Type:
- Radar
- Frequency:
- 11GHz ~ 20GHz
- Number of Mixers:
- 1
- Gain:
- -
- Noise Figure:
- 8dB
- Secondary Attributes:
- Up/Down Converter
- Current - Supply:
- -
- Voltage - Supply:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- Die
HMC554-SX FAQ
1.How can I place an order for HMC554-SX through Aetrix?
Please submit a Request for Quotation (RFQ) for HMC554-SX on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for HMC554-SX reliable?
The price and inventory of HMC554-SX are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for HMC554-SX is usually 5 days.
3.What payment methods are accepted for HMC554-SX?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for HMC554-SX transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for HMC554-SX?
HMC554-SX orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your HMC554-SX order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for HMC554-SX?
For technical support, including HMC554-SX datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your HMC554-SX requirements.
6.How does Aetrix verify that HMC554-SX is sourced from the original manufacturer or authorized distributors?
All HMC554-SX products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that HMC554-SX meets industry standards.
7.What is the process for return or replacement of HMC554-SX?
All HMC554-SX units undergo pre-shipment inspection (PSI). If there is an issue with HMC554-SX, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The HMC554-SX part is unused and in its original packaging.
Return procedure for HMC554-SX:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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