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Analog Devices Inc. HMC556-SX
- Part No.:
- HMC556-SX
- Manufacturer:
- Analog Devices Inc.
- Category:
- RF Mixers
- Package:
- Die
- Datasheet:
-
HMC556-SX.pdf
- Description:
- IC MMIC MIXER DBL-BAL DIE 1=2PCS
- Quantity:
- Payment:
- Shipping:
Inventory:2,233
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Product details
Overview
HMC556-SX from Analog Devices (formerly Hittite Microwave) is a GaAs MMIC I/Q mixer designed for image-reject downconversion or single-sideband upconversion in 36–41 GHz microwave systems. It delivers 13 dB typical conversion loss, 14 dB typical image rejection, and +23 dBm input IP3, operating with +17 dBm LO drive and no DC bias. It serves as a compact, passive alternative to hybrid-style IRMs in point-to-point radio links.
For engineers reviewing the HMC556-SX datasheet, HMC556-SX pinout, HMC556-SX application, or HMC556-SX equivalent, this page provides verified RF performance data, die-level mounting guidance, IF/RF/LO port roles, and validated alternatives for millimeter-wave transceiver design.
Technical Context
The HMC556-SX integrates two double-balanced mixer cells and an on-die 90° hybrid in a GaAs MESFET process, enabling intrinsic quadrature signal processing without external hybrids. Its passive topology eliminates DC bias requirements and supports DC–3.5 GHz IF bandwidth.
Performance is characterized in a 50 Ω test fixture with 1-mil × 12-mil bond wires; RF/LO ports are AC-coupled and impedance-matched from 36–41 GHz, while IF1/IF2 ports are DC-coupled with ±3 mA current limit per port. Thermal resistance is 111.6 °C/W (channel to die bottom).
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| RF/LO Frequency Range | 36–41 GHz - Full-band operation without tuning; supports E-band fixed wireless and satellite uplinks. |
| IF Bandwidth | DC–3.5 GHz - Enables baseband I/Q demodulation and wideband SSB upconversion without external IF filtering. |
| Conversion Loss (IRM) | 13 dB typ - Predictable signal path attenuation when used as image-reject mixer; impacts system NF budget directly. |
| Image Rejection | 14 dB typ - Suppresses unwanted sideband by >10× voltage ratio; sufficient for moderate-accuracy microwave radios. |
| Input IP3 | +23 dBm - High linearity enables handling of multi-carrier signals in congested E-band environments. |
| LO–RF Isolation | 34 dB typ - Reduces LO leakage into antenna path; eases filter requirements in full-duplex transceivers. |
| Die Size | 1.49 × 1.12 × 0.1 mm - Ultra-compact chip-scale form factor requiring precise wire-bond assembly and thermal management. |
Pinout & Package
HMC556-SX is supplied as a bare die in Waffle Pack (WP-3) packaging. The 1.49 × 1.12 mm GaAs die features six bond pads: RF, LO, IF1, IF2, GND (backside), and two alternate IF pads (Pads 5 & 6). Backside metallization is gold and must be connected to RF/DC ground.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| Pad 1 | RF Input | AC-coupled, 50 Ω matched input port for 36–41 GHz RF signal; requires low-inductance bond wire ≤12 mils. |
| Pad 4 | LO Input | AC-coupled, 50 Ω matched port accepting +17 dBm LO drive; critical for quadrature phase accuracy. |
| Pad 2 (or Pad 5) | IF2 Output | DC-coupled I/Q output; max ±3 mA DC current; external series capacitor required if DC blocking needed. |
| Pad 3 (or Pad 6) | IF1 Output | DC-coupled I/Q output, orthogonal to IF2; amplitude/phase balance directly impacts image rejection. |
| Backside | GND | Primary RF/DC ground reference; must be eutectically or conductively bonded to ground plane for thermal and RF integrity. |
Key Features
| Feature | Design Value |
|---|---|
| No DC bias required | Passive GaAs MESFET architecture eliminates bias circuitry, reducing BOM count and layout complexity in high-frequency modules. |
| Integrated 90° hybrid | On-die quadrature generation enables true I/Q mixing without external hybrid couplers-reducing insertion loss and board area. |
| Redundant IF ports | Pads 2/5 and 3/6 provide layout flexibility: IF outputs placed on opposing die edges simplify differential routing in tight RF layouts. |
| High-temperature operation | Rated for -55°C to +85°C ambient; channel temperature limited to 150°C-supports conduction-cooled military and base station applications. |
| ESD robustness | Class 1A HBM rating (≤250 V); mandates strict handling protocols but ensures survivability in automated assembly lines. |
Applications
| Point-to-Point Microwave Radio | Satellite Communication Uplink |
|---|---|
|
Use Scenario: E-band (60–90 GHz carrier with 36–41 GHz IF-staging) fixed wireless backhaul using SSB upconversion. IC Role / Device Role / Timing Role: I/Q upconverter generating clean upper sideband with minimal LO feedthrough and image content. Use Value: +23 dBm IP3 and 34 dB LO–RF isolation reduce adjacent-channel interference and relax post-mixer filtering requirements. |
Use Scenario: Ka-band satellite telemetry uplink where size, weight, and power (SWaP) constrain hybrid assembly use. IC Role / Device Role / Timing Role: Image-reject downconverter extracting baseband I/Q from 39 GHz downlink signals. Use Value: 14 dB image rejection and DC–3.5 GHz IF bandwidth support direct sampling ADC interfaces without analog IF translation. |
| Military Radar Front-End | Millimeter-Wave Test Equipment |
|
Use Scenario: Compact seeker radar transceiver operating at 38 GHz with real-time Doppler processing. IC Role / Device Role / Timing Role: Dual-mode mixer supporting both IRM downconversion and SSB upconversion in TDD configuration. Use Value: Passive operation and -55°C to +85°C rating ensure reliability in uncontrolled environmental deployments. |
Use Scenario: Vector signal analyzer front-end requiring calibrated I/Q response across 36–41 GHz for modulation error analysis. IC Role / Device Role / Timing Role: Reference-grade IRM providing stable amplitude/phase balance (0.5 dB / 9°) for measurement repeatability. Use Value: 0.5 dB amplitude balance and 9° phase balance minimize I/Q skew-induced EVM degradation in wideband modulations. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar I/Q mixer applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| HMC1048LP4CE | Wider RF range (24–44 GHz), higher conversion loss (15 dB typ), requires +20 dBm LO drive. | Better low-band coverage but lower efficiency above 40 GHz; less suitable for E-band-only designs. | Choose HMC1048LP4CE only if dual-band (Ku/E-band) operation is required and LO power headroom exists. |
| Qorvo QPM1002 | Integrated PA + I/Q mixer; 37–40 GHz band; +21 dBm POUT; requires DC bias and digital control interface. | System-in-package solution with active gain; trades off simplicity and bias complexity for integration density. | Choose QPM1002 when transmit chain gain and footprint reduction outweigh need for passive, bias-free operation. |
Compared with HMC556-SX, HMC1048LP4CE extends frequency coverage at the cost of LO drive and conversion loss, while QPM1002 replaces passive mixing with an active transceiver stage-requiring bias and control but eliminating external driver stages.
Availability
HMC556-SX is available at Aetrix Electronics and suitable for microwave radio, satellite communication uplinks, and military radar front-ends requiring stable component supply across extended temperature ranges and high-frequency performance consistency.
Supply support for HMC556-SX includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Analog Devices, Inc. is a global semiconductor leader specializing in high-performance analog, mixed-signal, and RF technologies for communications, defense, and instrumentation markets.
The HMC556-SX belongs to Analog Devices' legacy Hittite Microwave MMIC product line, engineered specifically for millimeter-wave transceiver signal chains demanding passive, high-linearity, chip-scale I/Q mixing in E-band systems.
FAQ
What is the recommended LO drive level for optimal performance of the HMC556-SX?
The HMC556-SX achieves best image rejection and conversion loss at +17 dBm LO drive, as confirmed in all electrical specifications tables and RF performance plots. Operating below +15 dBm degrades image rejection by ≥3 dB; exceeding +19 dBm risks compression and increased spurious outputs. Always verify LO power at the pad using calibrated RF probes due to bond wire losses.
Does the HMC556-SX require DC bias or external power supplies?
No, the HMC556-SX is a fully passive GaAs MMIC mixer and requires no DC bias or external power. Its operation relies solely on RF, LO, and IF signal energy. This eliminates bias network design, reduces thermal load, and simplifies integration into high-frequency modules where DC feedthrough could compromise isolation.
How are the IF1 and IF2 ports configured on the HMC556-SX die?
The HMC556-SX provides two primary IF output ports: Pad 2 (IF2) and Pad 3 (IF1), with redundant alternatives at Pads 5 and 6. All IF ports are DC-coupled and rated for ≤±3 mA DC current. For DC-coupled baseband operation, connect directly; for AC-coupled IF, add a series capacitor sized for the lowest IF frequency of interest.
What is the absolute maximum RF input power rating for the HMC556-SX?
The absolute maximum RF input power for the HMC556-SX is +19 dBm, as specified in the Absolute Maximum Ratings table. Exceeding this level-even briefly-risks permanent damage to the GaAs MESFET mixer cells. System-level design must include input limiting or attenuators if transient overdrive is possible.
Can the HMC556-SX be used for both upconversion and downconversion?
Yes, the HMC556-SX is functionally bidirectional: it operates as an image-reject downconverter (RF→IF) or single-sideband upconverter (IF→RF), depending on signal routing. The functional diagram and application notes explicitly confirm both modes, with performance data provided for each under defined LO/RF/IF port assignments.
HMC556-SX Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Analog Devices Inc.
- Series:
- -
- Package/Case:
- Die
- Packaging:
- Bulk
- Product Status:
- Obsolete
- RF Type:
- General Purpose
- Frequency:
- 36GHz ~ 41GHz
- Number of Mixers:
- 2
- Gain:
- -
- Noise Figure:
- -
- Secondary Attributes:
- Up Converter
- Current - Supply:
- -
- Voltage - Supply:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- Die
HMC556-SX FAQ
1.How can I place an order for HMC556-SX through Aetrix?
Please submit a Request for Quotation (RFQ) for HMC556-SX on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for HMC556-SX reliable?
The price and inventory of HMC556-SX are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for HMC556-SX is usually 5 days.
3.What payment methods are accepted for HMC556-SX?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for HMC556-SX transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for HMC556-SX?
HMC556-SX orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your HMC556-SX order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for HMC556-SX?
For technical support, including HMC556-SX datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your HMC556-SX requirements.
6.How does Aetrix verify that HMC556-SX is sourced from the original manufacturer or authorized distributors?
All HMC556-SX products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that HMC556-SX meets industry standards.
7.What is the process for return or replacement of HMC556-SX?
All HMC556-SX units undergo pre-shipment inspection (PSI). If there is an issue with HMC556-SX, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The HMC556-SX part is unused and in its original packaging.
Return procedure for HMC556-SX:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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