Analog Devices Inc. HMC558ALC3BTR-R5

Overview

HMC558ALC3BTR-R5 from Analog Devices is a GaAs MMIC fundamental double-balanced mixer operating from 5.5 GHz to 14 GHz, delivering 7.5 dB typical conversion loss at 5.5–10 GHz, 45 dB typical LO-to-RF isolation, and dc-to-6 GHz IF bandwidth - used in microwave up/downconversion for point-to-point radios and instrumentation.

For engineers reviewing the HMC558ALC3BTR-R5 datasheet, HMC558ALC3BTR-R5 pinout, HMC558ALC3BTR-R5 application, or HMC558ALC3BTR-R5 equivalent, key selection criteria include RF/LO frequency range (5.5–14 GHz), passive topology requiring no external matching, 12-lead ceramic LCC package, and operation with as low as 9 dBm LO drive.

Technical Context

The HMC558ALC3BTR-R5 implements a passive double-balanced topology using GaAs MESFET process, enabling operation without external biasing or matching components. Its optimized balun structures deliver high LO-to-RF and LO-to-IF isolation across full band.

It supports both upconversion and downconversion modes with fixed IF port DC coupling and ac-coupled RF/LO ports matched to 50 Ω. Performance is specified at 15 dBm LO drive, but functional down to 9 dBm, enabling flexible system-level LO power budgeting.

Key Specifications

Pinout & Package

The HMC558ALC3BTR-R5 uses a 12-terminal ceramic leadless chip carrier (E-12-4) with an exposed thermal pad requiring low-impedance connection to ground plane. Dimensions: 3.05 mm × 3.05 mm × 0.8 mm, alumina substrate, gold-over-nickel finish, MSL3 rating.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar mixer applications.

Compared with HMC1048LC3BTR-R5 and QPC1006, the HMC558ALC3BTR-R5 offers lowest design overhead - no bias circuitry, no external matching, and best-in-class LO isolation - making it optimal for compact, low-power, high-isolation receive and transmit front-ends.

Availability

HMC558ALC3BTR-R5 is available at Aetrix Electronics and suitable for point-to-point radios, automated test equipment, and military communications requiring stable component supply, RoHS compliance, and high-frequency repeatability.

Supply support for HMC558ALC3BTR-R5 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Analog Devices is a global leader in high-performance analog, mixed-signal, and RF ICs, serving precision instrumentation, communications, and defense markets since 1965.

The HMC558ALC3BTR-R5 belongs to Analog Devices' Hittite Microwave MMIC product line, designed specifically for broadband microwave signal conditioning in demanding wireless infrastructure and test systems.

FAQ

What is the minimum LO drive level required for proper operation of the HMC558ALC3BTR-R5?

The HMC558ALC3BTR-R5 operates reliably with as low as 9 dBm LO drive across its full 5.5–14 GHz range. While specifications are characterized at 15 dBm, the device maintains usable conversion loss and isolation down to 9 dBm, enabling integration with lower-power synthesizers or attenuated LO sources without performance degradation.

Can the HMC558ALC3BTR-R5 be used for both upconversion and downconversion?

Yes, the HMC558ALC3BTR-R5 is a bidirectional fundamental mixer capable of both upconversion and downconversion. Its symmetric double-balanced architecture supports either mode without hardware modification - RF and LO ports are interchangeable depending on signal flow direction, while IF remains the common port.

Is external DC bias required to operate the HMC558ALC3BTR-R5?

No, the HMC558ALC3BTR-R5 is a passive GaAs MMIC mixer and requires no external DC bias. All ports are internally terminated or coupled; only RF, LO, and IF AC signals need to be applied. This eliminates bias networks, reduces component count, and improves reliability in high-frequency layouts.

What is the thermal resistance (θJC) of the HMC558ALC3BTR-R5 package?

The HMC558ALC3BTR-R5 has a junction-to-case thermal resistance (θJC) of 180°C/W, measured per JEDEC JESD51-2 with a PCB containing a 3×3 array of 0.3 mm vias under the exposed pad. Effective thermal management requires direct connection of the EPAD to a low-impedance ground plane with adequate via density.

Does the HMC558ALC3BTR-R5 support DC-coupled IF operation?

Yes, the IF port of the HMC558ALC3BTR-R5 is DC-coupled and can pass signals from dc to 6 GHz. However, the device must not source or sink more than ±3 mA through the IF pin to prevent malfunction or damage - external current limiting or AC coupling is required if IF current exceeds this limit.