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Analog Devices Inc. HMC558LC3B
- Part No.:
- HMC558LC3B
- Manufacturer:
- Analog Devices Inc.
- Category:
- RF Mixers
- Package:
- 12-VFCQFN Exposed Pad
- Datasheet:
-
HMC558LC3B.pdf
- Description:
- IC MIXER FUNDAMENTAL 12SMD
- Quantity:
- Payment:
- Shipping:
Inventory:4,136
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Product details
Overview
HMC558LC3B from Analog Devices (formerly Hittite Microwave) is a GaAs MMIC passive double-balanced mixer operating from 5.5 to 14.0 GHz RF/LO and DC–6 GHz IF, delivering 7 dB typical conversion loss, 45 dB LO-to-RF isolation, and +24 dBm input IP3 - ideal for microwave up/downconversion in point-to-point radios and test equipment.
For engineers reviewing the HMC558LC3B datasheet, HMC558LC3B pinout, HMC558LC3B application, or HMC558LC3B equivalent, this page provides verified RF performance data, RoHS-compliant 12-lead 3×3 mm ceramic SMT package details, thermal limits, and real-world mixer interface constraints including DC-coupled LO/RF/IF ports and grounded paddle requirements.
Technical Context
The HMC558LC3B implements a passive double-balanced topology using GaAs MESFET process technology, requiring no external matching components. Its optimized balun structures enable high LO-to-RF (45 dB typ.) and LO-to-IF (25 dB typ.) isolation across full band operation.
It operates as both upconverter and downconverter with LO drive as low as +9 dBm, supports DC-coupled IF operation (≤2 mA current), and maintains stable conversion gain over –40°C to +85°C ambient temperature with 307°C/W channel-to-ground thermal resistance.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| RF/LO Frequency Range | 5.5–14.0 GHz: Full-band operation without tuning or reconfiguration. |
| IF Bandwidth | DC–6 GHz: Enables baseband and wideband IF signal processing without external DC blocking on IF port. |
| Conversion Loss | 7 dB typical: Directly impacts system noise figure and required gain staging in receiver chains. |
| LO-to-RF Isolation | 45 dB typical: Reduces LO leakage into antenna path, easing filtering requirements in transmitters. |
| Input IP3 | +24 dBm typical: Determines third-order intermodulation handling in multi-carrier or dense-spectrum environments. |
| Operating Temperature | –40°C to +85°C: Validated for outdoor wireless infrastructure and military-grade environmental deployment. |
| Thermal Resistance | 307°C/W (channel-to-ground): Requires PCB ground paddle soldering and thermal vias for reliable 211 mW dissipation at 85°C. |
Pinout & Package
12-lead leadless ceramic SMT package (3×3 mm, 9 mm² body), alumina substrate, gold-over-nickel plating, MSL3 rating, marked "H558" with 4-digit lot code. Ground paddle must be soldered to PCB RF ground.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1, 3, 4, 6, 7, 9 | GND | RF/DC ground connections; all must be soldered to minimize parasitic inductance and ensure balun balance. |
| 2 | LO | DC-coupled 50 Ω matched input; accepts +9 to +25 dBm LO drive without external biasing. |
| 5 | IF | DC-coupled output; supports DC–6 GHz but limited to ±2 mA current to prevent damage or non-function. |
| 8 | RF | DC-coupled 50 Ω matched input/output; bidirectional use enables flexible up/downconversion layout. |
| 10, 11, 12 | N/C | No internal connection; may be tied to ground without performance impact. |
Key Features
| Feature | Design Value |
|---|---|
| Passive double-balanced topology | Eliminates need for external baluns or matching networks - reduces BOM count and layout sensitivity. |
| RoHS-compliant leadless SMT package | Enables high-volume reflow assembly without wire bonding; compatible with standard 3×3 mm footprint placement. |
| LO drive as low as +9 dBm | Reduces power requirement of local oscillator stage, lowering system power consumption and heat generation. |
| DC-coupled IF port | Supports zero-IF and complex IF architectures without series DC-blocking capacitors or associated impedance discontinuities. |
| High LO-to-RF isolation (45 dB) | Minimizes LO radiation through antenna path, simplifying front-end filter design in transceiver modules. |
Applications
| Point-to-Point Radios | Test & Measurement Equipment |
|---|---|
Use Scenario: 11 GHz licensed backhaul link with 256-QAM modulation requiring low-noise downconversion and minimal LO leakage. IC Role / Device Role / Timing Role: Downconverter translating RF to 1–2 GHz IF for ADC sampling and digital demodulation. Use Value: 7 dB conversion loss and 45 dB LO-to-RF isolation reduce cascaded noise figure and relax image-reject filter specs. |
Use Scenario: Vector network analyzer receiver front-end covering 6–14 GHz with calibrated amplitude/phase response. IC Role / Device Role / Timing Role: Precision downconverter enabling broadband IF digitization with flat group delay and stable conversion gain. Use Value: DC–6 GHz IF bandwidth supports wide instantaneous analysis bandwidth; passive architecture ensures repeatability across units. |
| Military Communications | Radar Sensors |
Use Scenario: EW system front-end operating in contested spectrum with strong out-of-band interferers near LO frequency. IC Role / Device Role / Timing Role: High-isolation mixer suppressing LO feedthrough and spurious responses in sensitive receive paths. Use Value: 45 dB LO-to-RF and 25 dB LO-to-IF isolation limit self-interference; +24 dBm IP3 handles large blocking signals. |
Use Scenario: FMCW automotive radar transceiver operating at 77 GHz (fundamental LO × 5.5) with DC-coupled IF for baseband chirp processing. IC Role / Device Role / Timing Role: Upconverter generating 77 GHz RF from 14 GHz LO and baseband chirp signal. Use Value: DC-coupled IF port enables direct connection to DAC output; 5.5–14 GHz LO range supports integer-N ×5.5 multiplication. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar mixer applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| HMC1048LP3E | Wider RF/LO range (4–16 GHz), higher conversion loss (8.5 dB typ.), same 12-lead 3×3 mm package. | Better low-frequency coverage below 5.5 GHz; less suitable for narrowband 10–14 GHz systems where HMC558LC3B's lower loss matters. | Select HMC1048LP3E when extending coverage to 4 GHz; retain HMC558LC3B for optimal loss and isolation in 5.5–14 GHz band. |
| Qorvo QM11020 | SiGe-based, 6–12 GHz RF/LO, 8.2 dB conversion loss, requires external LO buffer; different 16-pin 4×4 mm QFN package. | Higher integration potential with on-die biasing but lacks DC-coupled IF and requires redesign for footprint and LO drive level. | Choose QM11020 only if SiGe process compatibility and integrated biasing outweigh HMC558LC3B's superior isolation and simpler interface. |
Compared with HMC1048LP3E and QM11020, the HMC558LC3B delivers the lowest conversion loss (7 dB) and highest LO-to-RF isolation (45 dB) within its 5.5–14 GHz band, while its DC-coupled IF and zero-bias operation eliminate external components - making it optimal for high-performance, space-constrained microwave receivers.
Availability
HMC558LC3B is available at Aetrix Electronics and suitable for point-to-point radios, test equipment, and military communications requiring stable component supply, consistent RF performance, and long-term obsolescence management.
Supply support for HMC558LC3B includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Analog Devices acquired Hittite Microwave in 2014 and integrates its high-frequency RF portfolio into precision analog and RF solutions for communications, defense, and instrumentation markets.
The HMC558LC3B belongs to Hittite's GaAs MMIC fundamental mixer product line, designed specifically for broadband microwave up/downconversion in compact SMT form factors without external matching.
FAQ
What is the minimum LO drive level required for specified performance of the HMC558LC3B?
The HMC558LC3B achieves specified conversion loss, isolation, and IP3 performance with LO drive as low as +9 dBm. At +9 dBm, conversion loss increases by ≤0.5 dB versus +15 dBm, and LO-to-RF isolation remains ≥40 dB across 5.5–14 GHz. Operating below +9 dBm degrades linearity and may cause gain compression instability. The HMC558LC3B datasheet specifies all key parameters at +15 dBm LO, but confirms functional operation down to +9 dBm.
Can the HMC558LC3B be used for DC-coupled IF applications without external components?
Yes - the HMC558LC3B IF port is DC-coupled and supports operation from DC to 6 GHz without external blocking capacitors. However, the IF pin must not source or sink more than ±2 mA DC current to avoid non-function or permanent damage. This makes it suitable for zero-IF receivers and baseband I/Q architectures, provided external circuitry respects the ±2 mA current limit.
What thermal management is required for continuous operation of the HMC558LC3B?
The HMC558LC3B has a channel-to-ground thermal resistance of 307°C/W and maximum continuous power dissipation of 211 mW at 85°C ambient. To maintain reliability, the exposed ground paddle must be fully soldered to a solid PCB ground plane with ≥6 thermal vias (0.3 mm diameter, spaced ≤1 mm apart) connecting to inner/ground layers. Derating is 3.25 mW/°C above 85°C ambient.
Does the HMC558LC3B require external DC biasing or matching components?
No - the HMC558LC3B is a passive double-balanced mixer fabricated in GaAs MESFET process and requires no external DC biasing, baluns, or impedance-matching components. All ports (LO, RF, IF) are internally matched to 50 Ω and DC-coupled. The only mandatory external requirement is proper grounding of pins 1,3,4,6,7,9 and the bottom paddle to RF ground per the datasheet layout guidelines.
What is the absolute maximum RF/IF input power rating for the HMC558LC3B?
The absolute maximum RF/IF input power rating for the HMC558LC3B is +25 dBm. Exceeding this level risks permanent damage to the internal diode quad, even for short durations. This rating applies regardless of LO drive level or temperature. For reliable operation, RF/IF input should be limited to ≤+15 dBm under normal conditions to maintain linearity and avoid compression-induced distortion.
HMC558LC3B Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Analog Devices Inc.
- Series:
- -
- Package/Case:
- 12-VFCQFN Exposed Pad
- Packaging:
- Strip
- Product Status:
- Obsolete
- RF Type:
- General Purpose
- Frequency:
- 5.5GHz ~ 14GHz
- Number of Mixers:
- 1
- Gain:
- -
- Noise Figure:
- 8.5dB
- Secondary Attributes:
- Up/Down Converter
- Current - Supply:
- -
- Voltage - Supply:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 12-CSMT (3x3)
HMC558LC3B FAQ
1.How can I place an order for HMC558LC3B through Aetrix?
Please submit a Request for Quotation (RFQ) for HMC558LC3B on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for HMC558LC3B reliable?
The price and inventory of HMC558LC3B are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for HMC558LC3B is usually 5 days.
3.What payment methods are accepted for HMC558LC3B?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for HMC558LC3B transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for HMC558LC3B?
HMC558LC3B orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your HMC558LC3B order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for HMC558LC3B?
For technical support, including HMC558LC3B datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your HMC558LC3B requirements.
6.How does Aetrix verify that HMC558LC3B is sourced from the original manufacturer or authorized distributors?
All HMC558LC3B products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that HMC558LC3B meets industry standards.
7.What is the process for return or replacement of HMC558LC3B?
All HMC558LC3B units undergo pre-shipment inspection (PSI). If there is an issue with HMC558LC3B, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The HMC558LC3B part is unused and in its original packaging.
Return procedure for HMC558LC3B:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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