Analog Devices Inc. HMC558LC3BTR

Overview

HMC558LC3BTR from Analog Devices (formerly Hittite Microwave) is a GaAs MMIC passive double-balanced mixer operating from 5.5 to 14.0 GHz RF/LO and DC–6 GHz IF, delivering 7 dB typical conversion loss, 45 dB LO-to-RF isolation, and +24 dBm input IP3 - ideal for microwave up/downconversion in point-to-point radios and test equipment.

For engineers reviewing the HMC558LC3BTR datasheet, HMC558LC3BTR pinout, HMC558LC3BTR application, or HMC558LC3BTR equivalent, key selection criteria include its 12-lead 3×3 mm ceramic SMT package, no-external-components operation, LO drive compatibility down to +9 dBm, and RoHS-compliant leadless construction optimized for high-volume surface-mount assembly.

Technical Context

The HMC558LC3BTR implements a passive double-balanced topology using GaAs MESFET process technology, eliminating need for external biasing or matching networks. Its integrated balun structures enable high port-to-port isolation without discrete transformers or ferrites.

It operates as both upconverter and downconverter with DC-coupled LO, RF, and IF ports, supporting wideband IF output from DC to 6 GHz. Performance remains stable across −40°C to +85°C ambient, with thermal resistance of 307°C/W from channel to ground paddle.

Key Specifications

Pinout & Package

12-lead leadless ceramic package (3×3 mm, 9 mm²), alumina body with gold-over-nickel plating; bottom ground paddle and all ground leads must be soldered to PCB RF ground per layout guidelines.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar mixer applications.

Compared with HMC1048LC3B and QM11024, the HMC558LC3BTR delivers best-in-class conversion loss and IP3 within its 5.5–14 GHz band while maintaining minimal board area and zero external components - making it optimal for high-performance microwave radios and instrumentation.

Availability

HMC558LC3BTR is available at Aetrix Electronics and suitable for point-to-point radios, test equipment, military communications, and radar sensors requiring stable component supply, full traceability, and long-term lifecycle support.

Supply support for HMC558LC3BTR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Analog Devices acquired Hittite Microwave in 2014 and integrates its high-frequency RF/Microwave portfolio into precision analog and RF solutions for defense, communications, and instrumentation markets.

The HMC558LC3BTR belongs to Hittite's legacy GaAs MMIC mixer family, engineered specifically for broadband microwave transceivers demanding high isolation, wide IF bandwidth, and robust SMT manufacturability.

FAQ

What is the minimum LO drive level required for specified performance of the HMC558LC3BTR?

The HMC558LC3BTR achieves its datasheet-specified conversion loss and isolation with a minimum LO drive of +9 dBm. At +9 dBm, typical conversion loss is ≤8.5 dB and LO-to-RF isolation remains ≥35 dB. Operation below +9 dBm degrades conversion loss and increases distortion; therefore +9 dBm is the validated lower limit for guaranteed performance across temperature and frequency.

Can the HMC558LC3BTR be used for DC-coupled IF operation, and what are the current limits?

Yes, the HMC558LC3BTR supports true DC-coupled IF operation on Pin 5. However, the IF port must not source or sink more than ±2 mA DC current; exceeding this causes non-function or permanent damage. For AC-coupled applications, a series capacitor sized for the target IF bandwidth is recommended to avoid violating this limit.

Is the HMC558LC3BTR pin-compatible with other Hittite 3×3 mm mixer variants like HMC558LC4B?

No, the HMC558LC3BTR is not pin-compatible with HMC558LC4B. While both use 3×3 mm ceramic packages, HMC558LC4B has a different pin assignment (e.g., RF and LO swapped) and is rated for 6–18 GHz. Substituting without layout revision will result in functional failure; always verify pinout against the specific variant's datasheet.

What thermal management is required for continuous operation of the HMC558LC3BTR at maximum RF input power?

The HMC558LC3BTR has a thermal resistance of 307°C/W (channel-to-ground paddle). To maintain junction temperature below 150°C at max +25 dBm RF input, the PCB must provide low-thermal-resistance grounding: solder the exposed paddle and all GND pins (1,3,4,6,7,9) to a solid ground plane with ≥6 thermal vias (0.3 mm diameter, 0.8 mm pitch). Ambient must remain ≤+85°C.

Does the HMC558LC3BTR require external matching components for 50 Ω operation at RF, LO, and IF ports?

No, the HMC558LC3BTR is internally matched to 50 Ω at RF, LO, and IF ports across its full operating band. No external matching networks, DC blocks (except optional IF blocking cap), or bias tees are required. This simplifies layout, reduces insertion loss, and improves repeatability in high-volume manufacturing.