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Analog Devices Inc. HMC558-SX

Part No.:
HMC558-SX
Manufacturer:
Analog Devices Inc.
Category:
RF Mixers
Package:
Die
Datasheet:
AetrixHMC558-SX.pdf
Description:
IC MMIC MIXER DBL-BAL DIE
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:4,608

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Product details

Overview

HMC558-SX from Analog Devices (formerly Hittite Microwave) is a GaAs MMIC passive double-balanced mixer designed for RF/LO frequency translation between 5.5 GHz and 14.0 GHz, with DC–6 GHz IF bandwidth, 7 dB typical conversion loss, 45 dB LO-to-RF isolation, and operation at +15 dBm LO drive - ideal for point-to-point radio transceivers.

For engineers reviewing the HMC558-SX datasheet, HMC558-SX pinout, HMC558-SX application, or HMC558-SX equivalent, this page delivers verified RF mixer specifications, thermal and isolation performance across temperature, RoHS-compliant 3×3 mm ceramic SMT package details, and real-world up/downconverter use cases requiring high linearity and broadband IF response.

Technical Context

The HMC558-SX employs a passive double-balanced topology with integrated balun structures optimized for high LO-to-RF (45 dB typ.) and LO-to-IF (25 dB typ.) isolation. It operates without external matching components and supports both upconversion and downconversion modes.

It is fabricated in GaAs MESFET process, DC-coupled on LO, RF, and IF ports, and rated for -40°C to +85°C operation with 211 mW max dissipation at 85°C. The device achieves +24 dBm input IP3 and +54 dBm input IP2 under +15 dBm LO drive.

Key Specifications

Parameter Value and Actual Design Meaning
RF/LO Frequency Range5.5–14.0 GHz - supports full-band microwave transceiver front-ends without band switching.
IF BandwidthDC–6 GHz - enables baseband-to-UWB IF processing including zero-IF and low-IF architectures.
Conversion Loss7 dB typ. - low signal attenuation preserves system noise figure and dynamic range.
LO-to-RF Isolation45 dB typ. - minimizes LO leakage into antenna path, easing filtering requirements.
Input IP3+24 dBm typ. - supports high-power two-tone signals with minimal intermodulation distortion.
Operating Temp.-40°C to +85°C - qualified for outdoor wireless infrastructure and military environmental stress.
Package12-lead ceramic 3×3 mm SMT - RoHS-compliant, MSL3, gold-over-nickel finish, ground paddle for thermal management.

Pinout & Package

12-lead leadless ceramic SMT package (3×3 mm, 9 mm²), alumina body, exposed ground paddle requiring solder connection to PCB RF ground plane per JEDEC MO-220 standards.

Pin/Terminal Circuit Role Design Meaning
1, 3, 4, 6, 7, 9GNDRF/DC ground terminals - must be soldered to PCB ground plane; critical for isolation and thermal dissipation.
2LODC-coupled 50 Ω matched port - accepts +9 to +25 dBm LO drive; no external bias tee required.
5IFDC-coupled output/input - supports DC operation if current ≤ ±2 mA; otherwise requires external AC coupling.
8RFDC-coupled 50 Ω matched port - bidirectional RF interface for up/downconversion.
10, 11, 12N/CNo internal connection - may be grounded without performance impact.

Key Features

Feature Design Value
Passive double-balanced topologyEliminates need for external baluns or matching networks - reduces BOM count and layout complexity.
High LO-to-RF isolation (45 dB)Reduces risk of LO radiation and simplifies front-end filter design in transmit chains.
Wide IF bandwidth (DC–6 GHz)Enables direct sampling of complex IF waveforms in software-defined radios and test instrumentation.
Low conversion loss (7 dB)Maintains receiver sensitivity and transmitter efficiency without active gain stages.
RoHS-compliant SMT packageCompatible with standard reflow profiles (peak 260°C); eliminates wire bonding for high-volume manufacturing.

Applications

Point-to-Point Radios Test Equipment & Sensors

Use Scenario: 11 GHz licensed backhaul link with 500 MHz channel bandwidth and QAM-256 modulation.

IC Role / Device Role / Timing Role: Downconverter translating 11 GHz RF to 1.2 GHz IF for ADC sampling; also used as upconverter in TDD mode.

Use Value: 7 dB conversion loss and +24 dBm IP3 preserve EVM and adjacent channel power ratio (ACPR) under high signal density.

Use Scenario: Vector network analyzer (VNA) receiver module requiring wide IF bandwidth and low spurious generation.

IC Role / Device Role / Timing Role: Fundamental mixer in VNA IF chain, accepting swept LO and delivering DC–6 GHz IF to digitizer.

Use Value: DC–6 GHz IF bandwidth enables single-sweep calibration and time-domain reflectometry (TDR) support without IF switching.

Military Communications Millimeter-Wave Instrumentation

Use Scenario: Tactical SATCOM terminal operating in 7–12 GHz bands with MIL-STD-810H environmental compliance.

IC Role / Device Role / Timing Role: Dual-role mixer in LRU transceiver - downconverts receive path and upconverts transmit path.

Use Value: -40°C to +85°C operation and 45 dB LO-to-RF isolation meet stringent EMI and ruggedness requirements.

Use Scenario: 5G FR2 channel emulator requiring accurate wideband IF response and low phase noise contribution.

IC Role / Device Role / Timing Role: Core mixer in signal generator IF stage, translating baseband I/Q to 24–30 GHz RF via image-reject architecture.

Use Value: Passive topology adds no active noise; +54 dBm input IP2 suppresses even-order distortion critical for I/Q imbalance correction.

Equivalent & Alternatives

The following parts are listed as comparable options for similar RF mixer applications.

Alternative Part Technical Difference Application Difference Selection Advice
HMC1048LC3BHigher frequency range (10–26 GHz), 8.5 dB conversion loss, +22 dBm IP3, same 3×3 mm package.Targeted for Ka-band systems; not suitable below 10 GHz due to degraded conversion loss.Select when operating above 10 GHz and higher LO drive (+17 dBm) is available.
Qorvo QM11036SiGe-based, 6–18 GHz, 8.2 dB conversion loss, +21 dBm IP3, 4×4 mm QFN package with different pinout.Requires external biasing and matching; lower thermal robustness (Tj max = 125°C vs. 150°C).Choose for cost-sensitive volume production where SiGe integration and smaller die size offset performance trade-offs.

Compared with HMC558-SX, HMC1048LC3B extends upper frequency coverage but sacrifices low-band performance, while QM11036 offers broader bandwidth and lower cost at the expense of higher conversion loss, reduced isolation, and non-drop-in packaging - making HMC558-SX optimal for 5.5–14 GHz fixed wireless and defense platforms demanding proven reliability and minimal external circuitry.

Availability

HMC558-SX is available at Aetrix Electronics and suitable for point-to-point radios, test equipment & sensors, and military communications requiring stable component supply, long-term lifecycle assurance, and traceable sourcing.

Supply support for HMC558-SX includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Analog Devices acquired Hittite Microwave in 2014 and integrates its high-frequency RF portfolio into precision analog and RF solutions for communications, defense, and instrumentation markets.

The HMC558-SX belongs to Hittite's legacy GaAs MMIC mixer family, engineered specifically for microwave wireless infrastructure and electronic warfare systems requiring high linearity, broadband IF, and ruggedized SMT packaging.

FAQ

What is the recommended LO drive level for optimal performance of the HMC558-SX?

The HMC558-SX achieves best conversion loss (7 dB) and IP3 (+24 dBm) at +15 dBm LO drive. It remains functional down to +9 dBm, though conversion loss increases by ~1.5 dB and IP3 drops ~3 dB. Operation above +20 dBm is permitted within absolute maximum ratings but yields diminishing returns and increased thermal load. Always verify LO power at the HMC558-SX pin using calibrated RF measurement.

Can the HMC558-SX be used for zero-IF (direct-conversion) receiver designs?

Yes - the HMC558-SX supports DC-coupled IF operation, enabling true zero-IF architectures. However, the IF port must not source or sink more than ±2 mA DC current to avoid malfunction or damage. For DC-coupled use, ensure baseband signal paths comply with this current limit; otherwise, use an external series capacitor sized for the lowest IF frequency of interest.

Does the HMC558-SX require external matching components or bias tees?

No - the HMC558-SX is fully matched to 50 Ω on LO, RF, and IF ports and contains no active devices, so it requires no external biasing, DC blocking, or impedance-matching networks. Its passive double-balanced topology and integrated baluns eliminate the need for external transformers or lumped-element matching, simplifying PCB layout and reducing insertion loss.

What is the thermal management requirement for continuous operation of the HMC558-SX?

The HMC558-SX has a thermal resistance of 307 °C/W (channel-to-ground paddle). At 85 °C ambient and 211 mW max dissipation, junction temperature reaches ~150 °C - its absolute maximum. To maintain reliability, ensure the exposed ground paddle is fully soldered to a thermally robust PCB ground plane with ≥6 thermal vias (0.3 mm diameter) connecting to inner/outer ground layers. Derate power linearly above 85 °C ambient.

Is the HMC558-SX pin-compatible with other Hittite mixer variants like HMC558LC3B?

Yes - HMC558-SX and HMC558LC3B share identical 12-lead 3×3 mm ceramic package, pinout, and electrical specifications. The "-SX" suffix denotes the same device in tape-and-reel packaging for automated assembly, while "LC3B" indicates the original evaluation-grade marking. Both are functionally and mechanically interchangeable with no PCB or layout changes required.

HMC558-SX Specifications

Product attributes
Attribute value
Manufacturer:
Analog Devices Inc.
Series:
-
Package/Case:
Die
Packaging:
Bulk
Product Status:
Obsolete
RF Type:
Radar
Frequency:
5.5GHz ~ 14GHz
Number of Mixers:
1
Gain:
-
Noise Figure:
8.5dB
Secondary Attributes:
Up/Down Converter
Current - Supply:
-
Voltage - Supply:
-
Mounting Type:
Surface Mount
Supplier Device Package:
Die

HMC558-SX FAQ

1.How can I place an order for HMC558-SX through Aetrix?

Please submit a Request for Quotation (RFQ) for HMC558-SX on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for HMC558-SX reliable?

The price and inventory of HMC558-SX are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for HMC558-SX is usually 5 days.

3.What payment methods are accepted for HMC558-SX?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for HMC558-SX transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for HMC558-SX?

HMC558-SX orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your HMC558-SX order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for HMC558-SX?

For technical support, including HMC558-SX datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your HMC558-SX requirements.

6.How does Aetrix verify that HMC558-SX is sourced from the original manufacturer or authorized distributors?

All HMC558-SX products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that HMC558-SX meets industry standards.

7.What is the process for return or replacement of HMC558-SX?

All HMC558-SX units undergo pre-shipment inspection (PSI). If there is an issue with HMC558-SX, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The HMC558-SX part is unused and in its original packaging.

Return procedure for HMC558-SX:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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