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Analog Devices Inc. HMC560ALM3
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- Part No.:
- HMC560ALM3
- Manufacturer:
- Analog Devices Inc.
- Category:
- RF Mixers
- Package:
- 6-TLGA Exposed Pad
- Datasheet:
-
HMC560ALM3.pdf
- Description:
- GAAS MMIC DBL-BAL MIX SMT, 24 -
- Quantity:
- Payment:
- Shipping:
Inventory:2,970
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Product details
Overview
HMC560ALM3 from Analog Devices is a GaAs MMIC double-balanced mixer designed for RF-to-IF downconversion and IF-to-RF upconversion across 22–38 GHz, with 10–11 dB typical conversion loss, dc–18 GHz IF bandwidth, and no DC bias required. It serves as a core signal translation component in millimeter-wave transceivers for point-to-point radio links.
For engineers reviewing the HMC560ALM3 datasheet, HMC560ALM3 pinout, HMC560ALM3 application, or HMC560ALM3 equivalent, this page delivers verified RF mixer specifications, thermal and isolation performance across frequency bands, package interface details, and validated alternatives for high-frequency wireless system design.
Technical Context
The HMC560ALM3 employs passive double-balanced topology with integrated balun structures to achieve high LO-to-RF (34–38 dB) and LO-to-IF (29–31 dB) isolation across its full 22–38 GHz operating band. Its operation requires ≥9 dBm LO drive and supports both upper- and lower-sideband configurations without external matching components.
It delivers broadband IF response from dc to 18 GHz with ac-coupled RF/LO ports (50 Ω matched) and a dc-coupled IF port rated for ≤2 mA source/sink current. Thermal resistance is specified at θJC = 188 °C/W in the CE-6-3 LGA_CAV package.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| RF Frequency Range | 22–38 GHz: Full operational band for downconversion/upconversion with validated performance in two sub-bands (22–29 GHz and 29–38 GHz). |
| IF Bandwidth | dc to 18 GHz: Enables baseband-to-millimeter-wave translation without IF filtering constraints in wideband systems. |
| Conversion Loss | 10 dB typ (22–29 GHz), 11 dB typ (29–38 GHz): Defines signal attenuation during mixing; impacts receiver noise figure and transmitter output power budget. |
| LO Drive Level | ≥9 dBm: Minimum required local oscillator power to achieve specified linearity and conversion efficiency. |
| Input IP3 | 20 dBm typ (22–29 GHz), 19.5 dBm typ (29–38 GHz): Indicates third-order intermodulation resilience in dense RF environments like multi-carrier radios. |
| LO–RF Isolation | 34–38 dB typ: Suppresses LO leakage into antenna path-critical for transmit/receive duplexing and spectral purity. |
| Operating Temp | −40°C to +85°C: Specifies ambient range for reliable operation in outdoor wireless infrastructure and military platforms. |
Pinout & Package
The HMC560ALM3 is housed in a 5.08 mm × 5.08 mm × 1.01 mm CE-6-3 LGA_CAV (chip array small-outline no-lead cavity) package with an exposed ground pad. The die is mounted face-up; RF, LO, and IF terminals are accessed via top-side solder pads. The exposed pad must be soldered to RF/dc ground for thermal and electrical integrity.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1, 2, 3 (NIC) | Not Internally Connected | Optional RF/dc ground connections; no electrical function but may improve grounding or mechanical stability. |
| 4 (RF) | Radio Frequency Input/Output | AC-coupled, 50 Ω matched port for RF signal path; used as input in downconversion, output in upconversion. |
| 5 (LO) | Local Oscillator Input | AC-coupled, 50 Ω matched port accepting ≥9 dBm LO drive; internal balun enables high isolation. |
| 6 (IF) | Intermediate Frequency Input/Output | DC-coupled port supporting dc–18 GHz; must not exceed ±2 mA current to prevent malfunction or die failure. |
| Exposed Pad (GND) | Ground Reference & Thermal Path | Required connection to system ground plane for RF return, thermal dissipation (θJC = 188 °C/W), and EMI control. |
Key Features
| Feature | Design Value |
|---|---|
| Passive double-balanced architecture | Eliminates DC bias circuitry and enables symmetric rejection of even-order harmonics and LO feedthrough. |
| Optimized on-die balun structures | Delivers >34 dB LO-to-RF and >29 dB LO-to-IF isolation-reducing need for external filtering in compact front-ends. |
| Wide IF bandwidth (dc–18 GHz) | Supports direct-conversion receivers and ultra-wideband modulation schemes including OFDM and QAM up to 16 GHz signal bandwidth. |
| No external matching required | Enables drop-in integration into RF PCB layouts with minimal footprint impact and eliminates tuning complexity. |
| Robust thermal design (θJC = 188 °C/W) | Allows continuous operation at PDISS = 344 mW (TA = 85°C) with proper PCB copper pour and via stitching under exposed pad. |
Applications
| Point-to-Point Radios | Test Equipment & Sensors |
|---|---|
|
Use Scenario: High-capacity backhaul links operating in E-band (60–90 GHz) or V-band (57–71 GHz) using frequency translation from IF to mmWave. IC Role / Device Role / Timing Role: Downconverter translating 28 GHz RF to 2–6 GHz IF for digitization; or upconverter translating DAC-generated IF to 38 GHz for antenna transmission. Use Value: 10–11 dB conversion loss and >34 dB LO–RF isolation minimize cascaded noise figure and spurious emissions in licensed-spectrum infrastructure. |
Use Scenario: Vector network analyzer (VNA) receiver front-end requiring broadband IF response and low phase noise mixing. IC Role / Device Role / Timing Role: Core downconversion element translating swept RF signals (22–38 GHz) to fixed IF for ADC sampling and digital signal processing. Use Value: dc–18 GHz IF bandwidth enables real-time capture of wide instantaneous bandwidths without IF stage reconfiguration. |
| Military Radar & EW Systems | VSAT & Point-to-Multipoint Radios |
|
Use Scenario: Electronic warfare receivers performing rapid frequency-hopping detection across 22–38 GHz with minimal latency. IC Role / Device Role / Timing Role: Fast-switching downconverter enabling agile channel selection; operates over −40°C to +85°C without recalibration. Use Value: 20 dBm input IP3 and stable conversion loss vs. temperature ensure consistent dynamic range in jamming and SIGINT applications. |
Use Scenario: Satellite terminal uplinks transmitting Ku/Ka-band signals using IF-based modulation and mmWave upconversion. IC Role / Device Role / Timing Role: Upconverter translating QPSK/QAM-modulated IF (dc–18 GHz) to 29–38 GHz for parabolic antenna feed. Use Value: Passive operation and no external bias simplify radiation-hardened PCB layout while maintaining EIRP compliance. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar double-balanced mixer applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| HMC1048LP4E | Wider RF range (10–40 GHz), higher conversion loss (12.5 dB typ), larger 4×4 mm QFN package. | Better suited for sub-22 GHz extension; less optimal for E-band where HMC560ALM3's lower loss and smaller footprint matter. | Select HMC1048LP4E only if coverage below 22 GHz is required; otherwise HMC560ALM3 offers superior loss and size for 22–38 GHz. |
| HMC774ALC3 | Narrower RF band (24–34 GHz), lower conversion loss (8.5 dB typ), same CE-6-3 package but higher LO drive (15 dBm). | Optimized for fixed 28 GHz 5G FR2 systems; lacks HMC560ALM3's 22–29 GHz and 29–38 GHz dual-band validation. | Choose HMC774ALC3 for 28 GHz 5G base station IF-to-RF upconversion where lowest loss is critical; retain HMC560ALM3 for wider tunability. |
Compared with HMC1048LP4E and HMC774ALC3, the HMC560ALM3 uniquely balances broad 22–38 GHz coverage, low conversion loss, compact CE-6-3 packaging, and proven dual-band performance-making it the preferred choice for scalable mmWave radio architectures requiring flexibility and size efficiency.
Availability
HMC560ALM3 is available at Aetrix Electronics and suitable for point-to-point radios, military radar receivers, and test equipment requiring stable component supply across extended temperature ranges and high-frequency performance consistency.
Supply support for HMC560ALM3 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Analog Devices is a global leader in high-performance analog, mixed-signal, and RF ICs, serving communications, defense, instrumentation, and industrial markets with precision signal processing solutions.
The HMC560ALM3 belongs to Analog Devices' Hittite Microwave MMIC product line, engineered specifically for millimeter-wave infrastructure and defense applications demanding broadband, low-loss, and thermally robust passive mixers.
FAQ
What is the minimum LO drive level required for HMC560ALM3 to meet datasheet specifications?
The HMC560ALM3 requires a minimum LO drive level of 9 dBm to achieve specified conversion loss, isolation, and linearity. At 13 dBm LO drive (the condition used for most datasheet measurements), the device delivers 10 dB typical conversion loss (22–29 GHz) and 20 dBm input IP3. Operating below 9 dBm degrades conversion efficiency and increases distortion.
Can HMC560ALM3 be used for both upconversion and downconversion?
Yes, the HMC560ALM3 is a bidirectional double-balanced mixer fully characterized for both upconversion (IF → RF) and downconversion (RF → IF) across 22–38 GHz. Its passive architecture and symmetric port design allow flexible signal routing-verified in datasheet Tables 1–2 and Figures 31–47.
Is DC blocking required on the IF port of HMC560ALM3?
DC blocking is optional on the IF port of HMC560ALM3. The port is dc-coupled and supports operation from dc to 18 GHz. If dc operation is not needed, a series capacitor can be added externally; however, if dc is required, the port must not source or sink more than ±2 mA to avoid die malfunction or failure.
What is the thermal resistance (θJC) of HMC560ALM3, and how does it affect PCB layout?
The HMC560ALM3 has a junction-to-case thermal resistance (θJC) of 188 °C/W. This value assumes proper soldering of the exposed pad to a thermally robust PCB ground plane with multiple thermal vias. Inadequate thermal relief reduces effective heat dissipation and risks exceeding the 150°C channel temperature limit under 344 mW dissipation.
Does HMC560ALM3 require external matching components for RF, LO, or IF ports?
No, the HMC560ALM3 requires no external matching components. Its RF and LO ports are internally ac-coupled and 50 Ω matched; the IF port is dc-coupled and compatible with standard 50 Ω IF chains. The datasheet explicitly states "no external component or matching circuitry" is needed for nominal operation.
HMC560ALM3 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Analog Devices Inc.
- Series:
- -
- Package/Case:
- 6-TLGA Exposed Pad
- Packaging:
- Strip
- Product Status:
- Active
- RF Type:
- VSAT
- Frequency:
- 22GHz ~ 38GHz
- Number of Mixers:
- 1
- Gain:
- -
- Noise Figure:
- 11.5dB
- Secondary Attributes:
- Up/Down Converter
- Current - Supply:
- -
- Voltage - Supply:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 6-LGA-CAV (5.08x5.08)
HMC560ALM3 FAQ
1.How can I place an order for HMC560ALM3 through Aetrix?
Please submit a Request for Quotation (RFQ) for HMC560ALM3 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for HMC560ALM3 reliable?
The price and inventory of HMC560ALM3 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for HMC560ALM3 is usually 5 days.
3.What payment methods are accepted for HMC560ALM3?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for HMC560ALM3 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for HMC560ALM3?
HMC560ALM3 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your HMC560ALM3 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for HMC560ALM3?
For technical support, including HMC560ALM3 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your HMC560ALM3 requirements.
6.How does Aetrix verify that HMC560ALM3 is sourced from the original manufacturer or authorized distributors?
All HMC560ALM3 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that HMC560ALM3 meets industry standards.
7.What is the process for return or replacement of HMC560ALM3?
All HMC560ALM3 units undergo pre-shipment inspection (PSI). If there is an issue with HMC560ALM3, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The HMC560ALM3 part is unused and in its original packaging.
Return procedure for HMC560ALM3:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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