Analog Devices Inc. HMC560ALM3TR
- Part No.:
- HMC560ALM3TR
- Manufacturer:
- Analog Devices Inc.
- Category:
- RF Mixers
- Package:
- 6-TLGA Exposed Pad
- Datasheet:
-
HMC560ALM3TR.pdf
- Description:
- GAAS MMIC DBL-BAL MIX SMT, 24 -
- Quantity:
- Payment:

- Shipping:

Inventory:2,988
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Product details
Overview
HMC560ALM3TR from Analog Devices is a GaAs MMIC double-balanced mixer operating from 22 GHz to 38 GHz, supporting both upconversion and downconversion with no DC bias required. It delivers 10–11 dB typical conversion loss, >34 dB LO-to-RF isolation, and dc–18 GHz IF bandwidth-enabling high-frequency signal translation in millimeter-wave radios and test instrumentation.
For engineers reviewing the HMC560ALM3TR datasheet, HMC560ALM3TR pinout, HMC560ALM3TR application, or HMC560ALM3TR equivalent, this page provides verified RF performance data, terminal-level interface guidance, thermal and isolation behavior across temperature and LO drive, and validated alternatives for mmWave system design.
Technical Context
The HMC560ALM3TR implements a passive, double-balanced architecture using optimized on-die baluns to achieve high LO-to-RF and LO-to-IF suppression without external matching components. Its operation requires ≥9 dBm LO drive and supports upper- or lower-sideband selection in both upconverter and downconverter modes.
It operates over −40°C to +85°C with a CE-6-3 LGA_CAV package (5.08 mm × 5.08 mm), featuring an exposed ground pad for thermal and RF grounding. All ports-RF, LO, and IF-are impedance-matched to 50 Ω, with RF and LO ac-coupled and IF dc-coupled (max ±2 mA).
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Frequency Range | 22–38 GHz RF/LO; dc–18 GHz IF - enables full-band mmWave transceiver front-end coverage without reconfiguration. |
| Conversion Loss | 10 dB typ. (22–29 GHz), 11 dB typ. (29–38 GHz) - defines minimum gain budget impact in receiver chains. |
| LO-to-RF Isolation | 34 dB typ. (22–29 GHz), 38 dB typ. (29–38 GHz) - reduces LO leakage into antenna paths, easing filter requirements. |
| Input IP3 | 20 dBm typ. (22–29 GHz), 19.5 dBm typ. (29–38 GHz) - quantifies third-order intermodulation headroom in dense signal environments. |
| IF Bandwidth | dc to 18 GHz - supports wide instantaneous bandwidths for high-data-rate modulation schemes (e.g., QPSK, 64-QAM). |
| LO Drive Requirement | ≥9 dBm - ensures stable mixing with standard mmWave synthesizers; no external amplification needed. |
| Operating Temperature | −40°C to +85°C - qualified for outdoor wireless infrastructure and military-grade environmental deployment. |
Pinout & Package
The HMC560ALM3TR uses a 6-terminal Chip Array Small Outline No Lead Cavity (LGA_CAV) package, designated CE-6-3, with 5.08 mm × 5.08 mm body and 1.01 mm height. The exposed pad must be soldered to RF/dc ground for thermal dissipation and signal integrity.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1, 2, 3 | NIC (Not Internally Connected) | Electrically floating; may be grounded externally without affecting RF performance or biasing. |
| 4 | RF Port | 50 Ω ac-coupled input/output; primary RF path for up/downconversion; matched for minimal reflection. |
| 5 | IF Port | dc-coupled port handling dc–18 GHz signals; limited to ±2 mA current to prevent die malfunction. |
| 6 | LO Port | 50 Ω ac-coupled local oscillator input; accepts ≥9 dBm drive; critical for conversion efficiency and isolation. |
| Exposed Pad | GND | Mandatory RF and dc ground connection; essential for thermal management (θJC = 188°C/W) and return path integrity. |
Key Features
| Feature | Design Value |
|---|---|
| Passive double-balanced topology | Eliminates DC bias circuitry and external matching components-reducing BOM count and layout complexity in mmWave PCBs. |
| Optimized internal balun structures | Delivers ≥34 dB LO-to-RF isolation and ≥29 dB LO-to-IF isolation-minimizing spurious feedthrough and simplifying filtering. |
| Wide IF bandwidth (dc–18 GHz) | Supports baseband-to-Ka-band IF processing, enabling flexible heterodyne architectures and software-defined radio implementations. |
| RoHS-compliant CE-6-3 LGA_CAV package | Enables high-density RF integration with controlled impedance transitions and repeatable thermal performance in production assemblies. |
| Operation from −40°C to +85°C | Validated for uncontrolled environmental deployment in point-to-point radios and defense electronics without derating. |
Applications
| Point-to-Point Radios | Millimeter-Wave Test Equipment |
|---|---|
|
Use Scenario: High-capacity backhaul links operating at 24 GHz, 28 GHz, or 39 GHz carrier frequencies. IC Role / Device Role / Timing Role: Downconverter translating received RF to low-IF for digitization; also used as upconverter in transmit chain. Use Value: 10–11 dB conversion loss and >34 dB LO-to-RF isolation reduce cascaded noise figure and relax LO filtering requirements. |
Use Scenario: Vector network analyzer (VNA) and signal generator front-ends requiring broadband frequency translation. IC Role / Device Role / Timing Role: Core mixer element in harmonic mixing and wideband IF sampling architectures. Use Value: dc–18 GHz IF bandwidth enables direct digitization of wide instantaneous bandwidths without sub-harmonic stages. |
| Military Radar Sensors | V-SAT Terminals |
|
Use Scenario: Compact active electronically scanned array (AESA) radar modules with integrated T/R functionality. IC Role / Device Role / Timing Role: Low-phase-noise upconverter for transmit beamforming and downconverter for receive channel digitization. Use Value: Stable conversion loss across −40°C to +85°C ensures consistent dynamic range in field-deployed systems. |
Use Scenario: Ka-band satellite communication terminals requiring high linearity and low intermodulation distortion. IC Role / Device Role / Timing Role: Frequency translator in LNB (low-noise block downconverter) and BUC (block upconverter) subsystems. Use Value: 20 dBm input IP3 and 19.5 dBm IP3 across 29–38 GHz band support multi-carrier operation with minimal adjacent-channel interference. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar double-balanced mixer applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| HMC1048LC4B | Wider RF range (10–40 GHz); higher conversion loss (12.5 dB typ.); requires 13 dBm LO drive. | Better low-band coverage (10–22 GHz); less suitable for narrowband 28 GHz fixed wireless due to higher loss. | Select when system requires extended low-frequency operation below 22 GHz and can accommodate higher loss. |
| HMC774ALC3 | Higher IF bandwidth (dc–20 GHz); improved LO-to-IF isolation (35 dB min); same 22–38 GHz RF range. | Superior for ultra-wideband IF digitization; slightly larger CE-8-3 package increases board area. | Prefer for applications demanding >18 GHz IF bandwidth or tighter LO feedthrough control in sensitive receivers. |
Compared with HMC560ALM3TR, HMC1048LC4B extends low-end frequency coverage but sacrifices conversion efficiency, while HMC774ALC3 offers wider IF bandwidth and better isolation at the cost of larger footprint-making HMC560ALM3TR optimal for space-constrained, cost-sensitive Ka-band radios.
Availability
HMC560ALM3TR is available at Aetrix Electronics and suitable for point-to-point radios, millimeter-wave test equipment, and military radar sensors requiring stable component supply across extended temperature ranges and high-frequency performance consistency.
Supply support for HMC560ALM3TR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Analog Devices is a global leader in high-performance analog, mixed-signal, and RF ICs, serving communications, industrial, and defense markets with precision signal processing solutions.
The HMC560ALM3TR belongs to Analog Devices' Hittite Microwave MMIC product line, engineered specifically for millimeter-wave infrastructure and instrumentation where broadband linearity, isolation, and passive reliability are critical.
FAQ
What is the recommended LO drive level for optimal performance of the HMC560ALM3TR?
The HMC560ALM3TR operates reliably with LO drive levels ≥9 dBm, and datasheet characterization is performed at 13 dBm. At 13 dBm, it achieves 10–11 dB typical conversion loss and maximizes LO-to-RF isolation (34–38 dB). Lower LO power increases conversion loss and degrades IP3; exceeding 23 dBm risks permanent damage per absolute maximum ratings.
Does the HMC560ALM3TR require external biasing or matching components?
No. The HMC560ALM3TR is a fully passive double-balanced mixer with internal 50 Ω matching on RF and LO ports and no DC bias requirement. External components are unnecessary for basic operation. Only the IF port may need an external series capacitor if dc blocking is required-otherwise, it must remain dc-coupled with current limited to ±2 mA.
Can the HMC560ALM3TR be used for both upconversion and downconversion?
Yes. The HMC560ALM3TR supports bidirectional operation: as a downconverter (RF 22–38 GHz → IF dc–18 GHz) and as an upconverter (IF dc–18 GHz → RF 22–38 GHz). Performance metrics-including conversion loss, IP3, and isolation-are specified for both modes in the datasheet, with sideband selection determined by LO–RF spacing.
What is the thermal resistance and grounding requirement for the HMC560ALM3TR?
The HMC560ALM3TR has θJC = 188°C/W and requires its exposed pad to be soldered directly to a solid RF/dc ground plane. This connection is mandatory-not optional-for thermal dissipation (max channel temperature 150°C) and RF return path integrity. Inadequate grounding causes gain instability, increased noise figure, and potential die failure under sustained operation.
How does the HMC560ALM3TR perform across temperature and frequency bands?
Over −40°C to +85°C, HMC560ALM3TR maintains stable conversion loss (±0.5 dB variation), IP3 (±0.8 dB), and isolation (±2 dB) within each band. From 22–29 GHz, conversion loss is 10 dB typ.; from 29–38 GHz, it rises to 11 dB typ. Noise figure increases from 10.5 dB to 11.5 dB across the band, consistent with GaAs mixer physics.
HMC560ALM3TR Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Analog Devices Inc.
- Series:
- -
- Package/Case:
- 6-TLGA Exposed Pad
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- RF Type:
- VSAT
- Frequency:
- 22GHz ~ 38GHz
- Number of Mixers:
- 1
- Gain:
- -
- Noise Figure:
- 11.5dB
- Secondary Attributes:
- Up/Down Converter
- Current - Supply:
- -
- Voltage - Supply:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 6-LGA-CAV (5.08x5.08)
HMC560ALM3TR FAQ
1.How can I place an order for HMC560ALM3TR through Aetrix?
Please submit a Request for Quotation (RFQ) for HMC560ALM3TR on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for HMC560ALM3TR reliable?
The price and inventory of HMC560ALM3TR are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for HMC560ALM3TR is usually 5 days.
3.What payment methods are accepted for HMC560ALM3TR?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for HMC560ALM3TR transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for HMC560ALM3TR?
HMC560ALM3TR orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your HMC560ALM3TR order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for HMC560ALM3TR?
For technical support, including HMC560ALM3TR datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your HMC560ALM3TR requirements.
6.How does Aetrix verify that HMC560ALM3TR is sourced from the original manufacturer or authorized distributors?
All HMC560ALM3TR products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that HMC560ALM3TR meets industry standards.
7.What is the process for return or replacement of HMC560ALM3TR?
All HMC560ALM3TR units undergo pre-shipment inspection (PSI). If there is an issue with HMC560ALM3TR, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The HMC560ALM3TR part is unused and in its original packaging.
Return procedure for HMC560ALM3TR:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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