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Analog Devices Inc. HMC560LM3

Part No.:
HMC560LM3
Manufacturer:
Analog Devices Inc.
Category:
RF Mixers
Package:
6-TQFN Exposed Pad
Datasheet:
AetrixHMC560LM3.pdf
Description:
IC MMIC IQ MIXER 24-40GHZ 6SMD
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:2,986

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Product details

Overview

HMC560LM3 from Hittite Microwave Corporation is a GaAs MMIC passive double-balanced mixer operating from 24–40 GHz RF/LO and DC–17 GHz IF, with +21 dBm input IP3, 35 dB LO/RF isolation, and no DC bias required. It serves as a broadband downconverter or upconverter in millimeter-wave radio front-ends without external components.

For engineers reviewing the HMC560LM3 datasheet, HMC560LM3 pinout, HMC560LM3 application, or HMC560LM3 equivalent, key selection criteria include its 24–40 GHz fundamental mixing range, passive topology eliminating bias networks, leadless LM3 SMT package compatibility with surface-mount manufacturing, and verified performance at +13 dBm LO drive.

Technical Context

The HMC560LM3 employs an on-chip balun-based double-balanced topology fabricated in GaAs MESFET process, enabling high port-to-port isolations (LO/RF ≥35 dB typ., LO/IF ≥30 dB typ.) and wide IF bandwidth extending to DC. Its passive architecture eliminates DC power requirements and simplifies integration into compact RF modules.

It operates as both upconverter and downconverter with consistent conversion loss (10–14 dB) and noise figure (10–14 dB SSB) across 24–40 GHz, supported by measured spurious output data showing dominant m=1,n=0 and m=0,n=1 products below –5 dBc. Thermal resistance is 188 °C/W (channel to package bottom), with absolute max LO drive of +23 dBm.

Key Specifications

Parameter Value and Actual Design Meaning
RF/LO Frequency Range24–40 GHz - supports Ka-band radar, point-to-point radios, and satellite comms without band-specific redesign.
IF BandwidthDC–17 GHz - enables baseband and wideband IF processing including pulse radar and high-data-rate modulation.
Conversion Loss10–14 dB - defines signal attenuation through mixer; impacts receiver sensitivity and transmitter output power budget.
Input IP3+21 dBm typ. - determines third-order intermodulation distortion floor; critical for multi-carrier and dense-spectrum operation.
LO/RF Isolation35 dB typ. - minimizes LO leakage into antenna path, reducing self-interference and easing filter design.
PackageLM3 leadless chip carrier, 25 mm² - RoHS-compliant SMT package with soldered base ground; requires controlled reflow per Hittite spec.
DC BiasNone required - eliminates bias network complexity, PCB area, and potential instability sources in mmWave layouts.

Pinout & Package

Package: LM3 leadless chip carrier (25 mm²), non-hermetic epoxy-sealed, gold-over-nickel plating, designed for microstrip-to-CPWG transitions and GSG probe testing. All grounds must be soldered to PCB RF ground per outline drawing.

Pin/Terminal Circuit Role Design Meaning
1, 2, 3No ConnectMay be grounded or left floating; no electrical function - used for mechanical stability and thermal conduction.
4RF PortDC-coupled 50 Ω interface, 24–40 GHz; direct connection to antenna or PA/LNA without external matching.
5IF PortDC-coupled; supports DC–17 GHz; current-limited to ±2 mA - requires external DC blocking cap unless DC-coupled IF chain is used.
6LO PortDC-coupled 50 Ω interface, 24–40 GHz; accepts +13 dBm typical drive; max +23 dBm absolute rating.
GND (package base)RF Ground ReferenceMust be fully soldered to PCB ground plane; forms return path for all ports and controls parasitic inductance at mmWave.

Key Features

Feature Design Value
Passive double-balanced topologyEliminates DC bias circuitry and reduces even-order distortion; enables symmetric layout and predictable LO/RF/IF isolation.
On-chip balunsProvide >35 dB LO/RF isolation and >30 dB LO/IF isolation without external transformers or lumped components.
Wide IF bandwidth (DC–17 GHz)Supports zero-IF architectures, pulsed radar, and high-speed digital IF sampling without external IF amplification stages.
Leadless LM3 SMT packageEnables repeatable, wirebond-free assembly; compatible with standard reflow profiles (peak ≤235°C for ≤15 s).
No external components requiredReduces BOM count, layout area, and parasitic uncertainty - simplifies qualification and improves yield in mmWave production.

Applications

Test Equipment & Sensors Point-to-Point Radios

Use Scenario: Broadband vector network analyzer (VNA) receiver front-end requiring coherent IF sampling from 24–40 GHz.

IC Role / Device Role / Timing Role: Downconverter translating RF signals to DC–17 GHz IF for digitization and real-time analysis.

Use Value: Eliminates need for multiple narrowband mixers; single HMC560LM3 covers full Ka-band sweep with stable conversion loss and low noise figure.

Use Scenario: High-capacity 5G backhaul link operating at 28 GHz or 39 GHz with 1 GHz channel bandwidth.

IC Role / Device Role / Timing Role: Upconverter in transmit path and downconverter in receive path for full-duplex FDD operation.

Use Value: Passive architecture ensures LO leakage remains below –35 dBc, easing filtering requirements and improving spectral efficiency.

Military & Space Radios Point-to-Multi-Point Radios

Use Scenario: EW system front-end needing rapid frequency agility across Ka-band with minimal calibration overhead.

IC Role / Device Role / Timing Role: Fundamental mixer enabling direct RF-to-IF translation without image-reject filters or LO harmonics.

Use Value: Wide 24–40 GHz RF/LO range and DC–17 GHz IF support allow instantaneous bandwidth capture without retuning.

Use Scenario: Fixed wireless access base station serving multiple subscribers using OFDM across 26–40 GHz licensed bands.

IC Role / Device Role / Timing Role: Downconverter in multi-channel receiver array, interfacing with ADCs sampling at ≥34 GSPS.

Use Value: DC-coupled IF port enables baseband I/Q sampling; high IP3 (+21 dBm) maintains linearity under multi-user interference.

Equivalent & Alternatives

The following parts are listed as comparable options for similar passive mmWave mixer applications.

Alternative Part Technical Difference Application Difference Selection Advice
HMC1048LP3EWider RF/LO range (18–44 GHz), higher conversion loss (12–16 dB), same LM3 package.Better suited for X/Ka-band overlap applications; lower IP3 (+19 dBm) limits dynamic range in dense-spectrum environments.Select when broader frequency coverage outweighs need for lowest conversion loss or highest linearity.
HMC774ALC3Narrower RF/LO range (22–38 GHz), lower LO drive requirement (+10 dBm), same DC–17 GHz IF.Optimized for low-power LO subsystems; reduced LO drive eases synthesizer design but sacrifices some high-end Ka-band margin.Select when LO power budget is constrained and operation below 38 GHz dominates system requirements.

Compared with HMC560LM3, HMC1048LP3E trades linearity and loss for wider bandwidth, while HMC774ALC3 reduces LO drive demand at the cost of upper-frequency reach - both require identical LM3 footprint but differ in RF performance trade-offs critical for Ka-band system partitioning.

Availability

HMC560LM3 is available at Aetrix Electronics and suitable for test equipment, point-to-point radios, and military communications systems requiring stable component supply across extended temperature ranges (–55°C to +85°C) and high-reliability mmWave performance.

Supply support for HMC560LM3 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Hittite Microwave Corporation (now part of Analog Devices) specialized in high-frequency RFICs and MMICs for microwave and millimeter-wave applications, with expertise in GaAs and GaN processes.

The HMC560LM3 belongs to Hittite's LM3-series passive mixer family, designed specifically for surface-mount integration in Ka-band communication, radar, and instrumentation systems where wirebond-free reliability and broadband performance are essential.

FAQ

What is the recommended LO drive level for optimal performance of the HMC560LM3?

The HMC560LM3 achieves best conversion loss and isolation at +13 dBm LO drive, as specified in all typical performance data. Operating below +11 dBm increases conversion loss; exceeding +15 dBm risks compression and degrades IP3. The absolute maximum LO drive is +23 dBm, but sustained operation above +15 dBm is not recommended for reliability. All HMC560LM3 characterization assumes +13 dBm LO drive unless otherwise noted.

Does the HMC560LM3 require DC bias or external matching components?

No, the HMC560LM3 is a fully passive double-balanced mixer requiring no DC bias voltage or current. It also needs no external matching components - all ports (RF, LO, IF) are internally matched to 50 Ω across their rated bandwidths. This eliminates bias networks, decoupling capacitors, and impedance-matching stubs, simplifying layout and improving repeatability in mmWave designs using the HMC560LM3.

What is the maximum allowable IF current for the HMC560LM3 IF port?

The HMC560LM3 IF port must not source or sink more than ±2 mA of DC current. Exceeding this limit may cause non-function or permanent damage. For DC-coupled IF paths, ensure downstream circuitry presents minimal DC load; for AC-coupled operation, use a series capacitor sized to pass the required IF bandwidth (DC–17 GHz) while blocking DC current - this constraint applies strictly to the HMC560LM3 IF terminal.

Can the HMC560LM3 be used for both upconversion and downconversion?

Yes, the HMC560LM3 functions bidirectionally as both an upconverter and downconverter. Its passive double-balanced topology and symmetric port design enable full reuse of the same device in transmit and receive chains. Performance data (conversion loss, isolation, IP3) is validated for both modes, with all specifications in the datasheet derived from downconverter measurements unless explicitly labeled "Upconverter Performance" - confirming HMC560LM3 suitability for full-duplex Ka-band systems.

What PCB grounding requirements apply to the HMC560LM3 LM3 package?

The entire base of the HMC560LM3 LM3 package must be soldered to a solid, low-inductance PCB RF ground plane. Per Hittite's outline drawing, all ground contacts (including the package base and pins 1–3) require full-surface solder attachment - not just perimeter soldering. Inadequate grounding causes degraded isolation, increased conversion loss, and unstable performance above 30 GHz. The HMC560LM3 evaluation board uses CPWG transitions and dense ground vias to meet this requirement.

HMC560LM3 Specifications

Product attributes
Attribute value
Manufacturer:
Analog Devices Inc.
Series:
-
Package/Case:
6-TQFN Exposed Pad
Packaging:
Bulk
Product Status:
Obsolete
RF Type:
General Purpose
Frequency:
24GHz ~ 40GHz
Number of Mixers:
1
Gain:
-
Noise Figure:
11dB
Secondary Attributes:
-
Current - Supply:
-
Voltage - Supply:
-
Mounting Type:
Surface Mount
Supplier Device Package:
6-SMT (5.08x5.08)

HMC560LM3 FAQ

1.How can I place an order for HMC560LM3 through Aetrix?

Please submit a Request for Quotation (RFQ) for HMC560LM3 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for HMC560LM3 reliable?

The price and inventory of HMC560LM3 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for HMC560LM3 is usually 5 days.

3.What payment methods are accepted for HMC560LM3?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for HMC560LM3 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for HMC560LM3?

HMC560LM3 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your HMC560LM3 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for HMC560LM3?

For technical support, including HMC560LM3 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your HMC560LM3 requirements.

6.How does Aetrix verify that HMC560LM3 is sourced from the original manufacturer or authorized distributors?

All HMC560LM3 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that HMC560LM3 meets industry standards.

7.What is the process for return or replacement of HMC560LM3?

All HMC560LM3 units undergo pre-shipment inspection (PSI). If there is an issue with HMC560LM3, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The HMC560LM3 part is unused and in its original packaging.

Return procedure for HMC560LM3:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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