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Analog Devices Inc. HMC641LC4TR

Part No.:
HMC641LC4TR
Manufacturer:
Analog Devices Inc.
Category:
RF Switches
Package:
24-TFQFN Exposed Pad
Datasheet:
AetrixHMC641LC4TR.pdf
Description:
IC RF SWITCH SP4T 20GHZ 24QFN
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:3,428

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Product details

Overview

HMC641LC4 from Analog Devices (formerly Hittite Microwave) is a GaAs pHEMT SP4T non-reflective MMIC switch in a 4×4 mm ceramic SMT package, operating from DC to 20 GHz. It delivers 2.1 dB insertion loss and 42 dB isolation at 12 GHz, features on-chip 50 Ω terminations for isolated ports, and integrates a binary 2:4 decoder to reduce control lines from four to two. It is used in microwave radio front-ends requiring broadband signal routing with fast TTL/CMOS-compatible switching.

For engineers reviewing the HMC641LC4 datasheet, HMC641LC4 pinout, HMC641LC4 application, or HMC641LC4 equivalent, key selection criteria include its -5 Vdc supply requirement, 0/–5 V logic interface, 15 ns rise/fall time, 88 ns switching delay, and non-reflective architecture enabling stable impedance during state transitions in high-frequency test and SATCOM systems.

Technical Context

The HMC641LC4 implements a monolithic GaAs pHEMT-based SP4T architecture with integrated on-die 50 Ω terminations on all off-state RF ports, eliminating external termination components. Its internal 2:4 binary decoder accepts two TTL/CMOS-compatible control inputs (CTLA, CTLB) to select one of four RF paths (RF1–RF4) from the common RFC port.

It operates with a single –5 Vdc bias (Vss) and draws only 1.7 mA typical supply current. The switch maintains DC-coupled 50 Ω RF ports (RFC, RF1–RF4), requiring external DC blocking capacitors when RF line DC potential differs from ground, and mandates grounding of all 24 package leads and the exposed paddle per RF design best practices.

Key Specifications

ParameterValue and Actual Design Meaning
Frequency RangeDC to 20 GHz - supports full-bandwidth operation from baseband through K-band without reconfiguration.
Insertion Loss2.1 dB @ 12 GHz - ensures minimal signal attenuation in active path, critical for low-noise receiver front-ends.
Isolation42 dB @ 12 GHz - prevents crosstalk between selected and unselected RF paths in multi-channel systems.
Switching SpeedtRISE/tFALL = 15 ns - enables rapid channel hopping in frequency-agile instrumentation and radar T/R modules.
Control Interface0/–5 V logic with integrated 2:4 decoder - reduces FPGA/GPIO pin count and simplifies digital control sequencing.
Supply Current1.7 mA typical @ –5 V - lowers power budget vs. pin-diode alternatives, suitable for thermally constrained modules.
TerminationOn-chip 50 Ω terminations - eliminates need for external resistors, saving board space and improving high-frequency match stability.

Pinout & Package

Package: 24-lead 4×4 mm ceramic surface-mount package with alumina body, gold-over-nickel plating, MSL3 rating, and exposed ground paddle requiring soldering to PCB RF ground.

Pin/TerminalCircuit RoleDesign Meaning
RFC, RF1–RF4 (Pins 3,8,11,20,23)DC-coupled 50 Ω RF portsEnable bidirectional signal routing; require external DC blocking if DC bias ≠ 0 V.
Vss (Pin 14)Negative supply rail–5 Vdc ±10% bias input; powers internal pHEMTs and decoder logic.
CTLA, CTLB (Pins 16,15)Binary control inputsAccept 0/–5 V logic to select RFC→RF1 through RFC→RF4 per truth table.
GND (Pins 2,4,7,9,10,12,17,19,21,22,24 + paddle)RF/DC ground referenceAll must be soldered to low-inductance ground plane to maintain 50 Ω integrity and thermal dissipation.
N/C (Pins 1,5,6,13,18)No-connect terminalsInternally open; externally grounded per measurement setup to minimize parasitic coupling.

Key Features

FeatureDesign Value
Non-reflective architectureMaintains 50 Ω impedance across all ports during switching, preventing signal reflections that degrade VSWR in sensitive RF chains.
Integrated 2:4 decoderReduces required control signals from four to two, simplifying interface with microcontrollers and reducing PCB trace count.
On-die 50 Ω terminationsEliminates need for external termination resistors, improving high-frequency performance and reducing component count.
Low DC power consumption1.7 mA typical supply current enables use in power-sensitive portable and battery-backed test equipment.
TTL/CMOS-compatible controlSupports direct interfacing with standard logic families without level-shifting circuitry.

Applications

Telecom InfrastructureMicrowave Radio & VSAT

Use Scenario: Signal path selection in 5G massive MIMO active antenna units with dynamic beamforming.

IC Role / Device Role / Timing Role: SP4T RF switch routing transmit/receive signals between transceiver ICs and antenna arrays.

Use Value: 42 dB isolation at 3.5 GHz prevents inter-channel interference; non-reflective design preserves EVM under rapid switching.

Use Scenario: Frequency-agile up/down-converter switching in point-to-point backhaul radios.

IC Role / Device Role / Timing Role: High-isolation RF path selector enabling dual-band operation (e.g., 6 GHz + 11 GHz) from shared LO and IF sections.

Use Value: 2.1 dB insertion loss minimizes noise figure degradation; 15 ns switching supports adaptive modulation schemes.

SATCOM TerminalsTest Instrumentation

Use Scenario: Antenna port multiplexing in mobile satellite communication terminals with multiple orbital bands.

IC Role / Device Role / Timing Role: Broadband SP4T switch selecting between L-, S-, C-, and Ku-band receive paths in phased array front-ends.

Use Value: DC–20 GHz bandwidth covers all major SATCOM bands; on-chip terminations ensure consistent return loss across bands.

Use Scenario: Automated RF path configuration in vector network analyzer (VNA) calibration and switching matrices.

IC Role / Device Role / Timing Role: Precision signal routing element in multi-port test fixtures requiring repeatable amplitude/phase response.

Use Value: 88 ns tON/tOFF enables sub-microsecond path reconfiguration; low IL variation (<0.3 dB) over temperature ensures measurement stability.

Equivalent & Alternatives

The following parts are listed as comparable options for similar SP4T RF switch applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
HMC641LP4ESame die, 24-lead QFN package with exposed paddle; identical electrical specs but different land pattern and thermal profile.Requires revised PCB layout due to QFN footprint and different thermal via requirements.Select for higher thermal conductivity needs where enhanced heat sinking is prioritized over compact 4×4 mm footprint.
Qorvo QM11036DC–22 GHz GaAs pHEMT SP4T; 2.3 dB IL @ 12 GHz, 40 dB isolation @ 12 GHz, requires +5 V/–5 V dual supplies.Needs dual-rail biasing and level-shifting for 0/–5 V control compatibility; higher supply complexity.Select when extended upper-frequency margin (to 22 GHz) is required and dual-supply infrastructure exists.

Compared with HMC641LP4E and QM11036, the HMC641LC4 offers identical RF performance in a standardized 4×4 mm ceramic SMT package with single –5 V bias, making it optimal for space-constrained microwave modules where layout reuse and thermal management simplicity are critical.

Availability

HMC641LC4 is available at Aetrix Electronics and suitable for telecom infrastructure, microwave radio & VSAT, and test instrumentation requiring stable component supply, long-term obsolescence mitigation, and traceable sourcing for RF front-end designs.

Supply support for HMC641LC4 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Analog Devices acquired Hittite Microwave in 2014 and integrates its high-frequency RF/Microwave portfolio into precision analog and RF solutions for communications, defense, and instrumentation markets.

The HMC641LC4 belongs to Hittite's legacy GaAs MMIC SPnT switch product line, designed specifically for broadband, high-isolation, low-loss signal routing in microwave and millimeter-wave systems where non-reflective behavior and minimal control complexity are essential.

FAQ

What is the recommended DC blocking configuration for HMC641LC4 RF ports?

Each RF port (RFC, RF1–RF4) is DC-coupled and matched to 50 Ω, so external DC blocking capacitors are required if the connected RF line has non-zero DC potential. Use high-Q, low-ESL 0402 or 0201 capacitors rated for >20 GHz operation; typical values range from 100 pF to 1000 pF depending on low-frequency cutoff requirements. The HMC641LC4 evaluation board (126511) uses 1000 pF capacitors.

Does HMC641LC4 require external termination resistors?

No, the HMC641LC4 does not require external termination resistors. It integrates on-chip 50 Ω terminations for all off-state RF ports (e.g., when RFC connects to RF1, RF2–RF4 are internally terminated). This non-reflective architecture eliminates discrete terminations, improves high-frequency match stability, and reduces bill-of-materials count in microwave assemblies.

What is the absolute maximum input power rating for HMC641LC4?

The absolute maximum input power for HMC641LC4 is +24 dBm, as specified in the Absolute Maximum Ratings table. Exceeding this level risks permanent damage. For linear operation, the 1 dB compression point is +20 dBm at 0.25–20 GHz, and the input third-order intercept point is +39 dBm under two-tone +14 dBm conditions in the same band.

Can HMC641LC4 be controlled directly by 3.3 V CMOS logic?

No, HMC641LC4 cannot be driven directly by 3.3 V CMOS logic. Its control inputs (CTLA, CTLB) require 0 V (low) and –5 V (high) levels, with valid voltage ranges of –2.5 V to 0 V (low) and –5 V to –3.8 V (high). A level-shifting circuit or dedicated –5 V driver is required to interface with standard 3.3 V or 5 V logic families.

What thermal management guidelines apply to HMC641LC4?

HMC641LC4 requires robust thermal management: the exposed ground paddle and all 11 ground pins (2,4,7,9,10,12,17,19,21,22,24) must be soldered to a low-thermal-resistance PCB ground plane with ≥6 thermal vias (0.3 mm diameter) connecting to inner/outer ground layers. Thermal resistance from channel to die bottom is 199 °C/W (insertion path); mounting to an external heatsink is recommended for continuous >+70 °C ambient operation.

HMC641LC4TR Specifications

Product attributes
Attribute value
Manufacturer:
Analog Devices Inc.
Series:
-
Package/Case:
24-TFQFN Exposed Pad
Packaging:
Tape & Reel (TR)
Product Status:
Obsolete
RF Type:
General Purpose
Topology:
Absorptive
Circuit:
SP4T
Frequency Range:
0Hz ~ 20GHz
Isolation:
40dB
Insertion Loss:
2.3dB
Test Frequency:
20GHz
P1dB:
22dBm
IIP3:
38dBm
Features:
-
Impedance:
50Ohm
Voltage - Supply:
-
Operating Temperature:
-40°C ~ 85°C
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
24-QFN (4x4)

HMC641LC4TR FAQ

1.How can I place an order for HMC641LC4TR through Aetrix?

Please submit a Request for Quotation (RFQ) for HMC641LC4TR on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for HMC641LC4TR reliable?

The price and inventory of HMC641LC4TR are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for HMC641LC4TR is usually 5 days.

3.What payment methods are accepted for HMC641LC4TR?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for HMC641LC4TR transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for HMC641LC4TR?

HMC641LC4TR orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your HMC641LC4TR order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for HMC641LC4TR?

For technical support, including HMC641LC4TR datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your HMC641LC4TR requirements.

6.How does Aetrix verify that HMC641LC4TR is sourced from the original manufacturer or authorized distributors?

All HMC641LC4TR products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that HMC641LC4TR meets industry standards.

7.What is the process for return or replacement of HMC641LC4TR?

All HMC641LC4TR units undergo pre-shipment inspection (PSI). If there is an issue with HMC641LC4TR, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The HMC641LC4TR part is unused and in its original packaging.

Return procedure for HMC641LC4TR:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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