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Analog Devices Inc. HMC652
- Part No.:
- HMC652
- Manufacturer:
- Analog Devices Inc.
- Category:
- Attenuators
- Package:
- Die
- Datasheet:
-
HMC652.pdf
- Description:
- RF ATTENUATOR 2DB 50OHM DIE
- Quantity:
- Payment:
- Shipping:
Inventory:1,401
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Product details
Overview
HMC652 from Analog Devices is a 2 dB wideband fixed attenuator die designed for RF signal conditioning in DC–50 GHz microstrip, hybrid, and multi-chip module circuits. It delivers ±0.2 dB attenuation tolerance (DC–25 GHz), 22.0 dB return loss (DC–25 GHz), +27 dBm CW RF input power handling, and operates across –55°C to +85°C. It is used in fiber-optic transceiver front-ends to control signal levels before high-speed modulators.
For engineers reviewing the HMC652 datasheet, HMC652 pinout, HMC652 application, or HMC652 equivalent, this page provides verified die-level specifications, RF interface design guidance, temperature-stable attenuation behavior, and validated alternatives for millimeter-wave prototyping and production.
Technical Context
The HMC652 is a passive GaAs MMIC chip with two RF terminals (RF1, RF2) and backside ground metallization - no internal active circuitry or bias required. Its monolithic construction uses low-inductance on-chip vias and 50 Ω matched transmission line topology to achieve flat attenuation and excellent VSWR across DC–50 GHz.
It requires no external ground connections beyond die bottom attachment to RF ground plane and supports direct wire bonding (1 mil Au) or ribbon bonding (3 × 0.5 mil). Performance data is specified with die mounted to plate and probed via two 1 mil wire bonds per RF port.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Attenuation Value | 2 dB nominal, ±0.2 dB tolerance from DC to 25 GHz - enables precise signal level setting without recalibration in broadband receiver chains. |
| Frequency Range | DC to 50 GHz - supports full Ka-band, Q-band, and V-band operation in test equipment and satellite comms. |
| Return Loss | 22.0 dB (DC–25 GHz), 15.3 dB (25–50 GHz) - ensures minimal reflection-induced ripple in high-frequency matching networks. |
| Power Handling | +27 dBm CW RF input - accommodates high-power driver stages before limiting amplifiers or mixers. |
| Die Size | 0.42 × 0.45 × 0.1 mm - compact footprint compatible with tight-pitch MCM and thin-film alumina substrates. |
| Operating Temp | –55°C to +85°C - qualified for military, aerospace, and industrial environments without derating. |
Pinout & Package
Package: Bare die (GaAs MMIC), gold-metallized top bond pads and backside ground plane. Die size: 0.42 × 0.45 × 0.1 mm. Requires eutectic (AuSn) or conductive epoxy die attach to RF ground plane.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1 (RF1) | Input RF port | DC-coupled 50 Ω terminal; requires external DC blocking capacitor if driven by non-zero DC bias. |
| 2 (RF2) | Output RF port | DC-coupled 50 Ω terminal; maintains impedance match into downstream mixer or detector stage. |
| GND (backside) | RF ground reference | Must be bonded directly to system ground plane; no separate ground pin - critical for return path integrity above 20 GHz. |
Key Features
| Feature | Design Value |
|---|---|
| No external ground connections needed | Backside metallization serves as sole RF ground return - eliminates parasitic inductance from ground pins and simplifies layout. |
| Flat attenuation vs. frequency | ±0.2 dB variation over DC–25 GHz - preserves amplitude fidelity in wideband modulation schemes like OFDM and QAM. |
| Low-inductance on-chip vias | Enables stable performance up to 50 GHz without bond-wire resonance artifacts or impedance discontinuities. |
| Eutectic or epoxy die attach compatible | Supports both AuSn soldering (255°C work surface) and conductive epoxy curing - flexible for hybrid assembly processes. |
Applications
| Fiber-Optic Transmitter Front-End | Microwave Radio IF Chain Calibration |
|---|---|
|
Use Scenario: Attenuating laser driver output to prevent saturation of Mach-Zehnder modulator bias point. IC Role / Device Role / Timing Role: Passive signal-level conditioner placed between RF driver amplifier and optical modulator input. Use Value: Maintains 2 dB precision across C-band (4–8 GHz) and L-band (1–2 GHz), ensuring consistent extinction ratio without recalibration. |
Use Scenario: Calibrating gain flatness in 10–20 GHz microwave radio IF sections prior to ADC sampling. IC Role / Device Role / Timing Role: Fixed-loss reference element inserted between filter bank and variable-gain amplifier stages. Use Value: Provides repeatable 2 dB insertion loss with <0.05 dB tempco over –40°C to +70°C, enabling traceable system-level gain calibration. |
| Millimeter-Wave Test Fixture | Space-Qualified Hybrid Assembly |
|
Use Scenario: Embedding in wafer-probe-compatible test fixtures to emulate cable/connector loss in 30–50 GHz VNA measurements. IC Role / Device Role / Timing Role: On-die loss standard integrated into alumina substrate test carriers with 50 Ω microstrip transitions. Use Value: Delivers 22.0 dB return loss below 25 GHz, minimizing fixture mismatch error and improving measurement uncertainty to ±0.03 dB. |
Use Scenario: Signal conditioning in radiation-hardened satellite telemetry downlink modules operating at 26.5–40 GHz. IC Role / Device Role / Timing Role: Hermetically sealed attenuator die embedded in ceramic MCM with gold-tin eutectic attach. Use Value: Qualified to –55°C/+85°C with 27 dBm power handling - sustains link margin under thermal cycling and vacuum exposure. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar fixed-attenuator applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| HMC653 | 3 dB nominal attenuation, ±0.2 dB tolerance (DC–25 GHz), 23.0 dB return loss (DC–25 GHz) | Used where higher loss is needed for dynamic range compression in receiver AGC loops | Select HMC653 when 3 dB step improves SNR headroom versus HMC652's 2 dB in cascaded gain blocks. |
| HMC654 | 4 dB nominal attenuation, ±0.2 dB tolerance (DC–25 GHz), 20.5 dB return loss (DC–25 GHz) | Suitable for transmitter output leveling where tighter VSWR is less critical than loss depth | Choose HMC654 when 4 dB attenuation better matches DAC output swing to PA input range in broadband synthesizers. |
Compared with HMC652, HMC653 offers 1 dB more attenuation with improved return loss but identical die size and thermal specs; HMC654 trades 2 dB extra loss for slightly lower return loss, making it preferable in high-isolation transmit paths where VSWR is secondary to loss depth.
Availability
HMC652 is available at Aetrix Electronics and suitable for fiber-optic transceivers, microwave radio IF calibration, and millimeter-wave test fixtures requiring stable component supply across extended temperature ranges and high-frequency performance.
Supply support for HMC652 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Analog Devices, Inc. is a global semiconductor company specializing in high-performance analog, mixed-signal, and RF technologies for precision signal processing.
The HMC652 belongs to the HMC650–HMC658 wideband fixed attenuator family, engineered for DC–50 GHz microstrip and hybrid circuit integration where flat attenuation and minimal VSWR are critical.
FAQ
What is the exact attenuation value and tolerance of the HMC652 across its operating bandwidth?
The HMC652 provides a nominal 2 dB attenuation with ±0.2 dB tolerance from DC to 25 GHz, and ±0.6 dB tolerance from 25 GHz to 50 GHz. These values are measured with the die mounted to a plate and probed using two 1 mil diameter wire bonds per RF port, per Analog Devices' v02.0218 datasheet revision.
Does the HMC652 require external DC blocking capacitors in circuit?
Yes - both RF1 and RF2 terminals of the HMC652 are DC-coupled and matched to 50 Ω, so external DC blocking capacitors must be used if the input or output signals carry non-zero DC potential. This prevents unintended bias shifts in upstream or downstream active devices such as LNAs or mixers.
What is the recommended die attach method for the HMC652 in high-frequency applications?
Analog Devices recommends either AuSn eutectic die attach (80/20 preform, 255°C work surface) or electrically conductive epoxy. The backside gold metallization must make low-inductance contact with the RF ground plane - critical for maintaining return loss above 20 GHz. Thermal exposure must not exceed 320°C for more than 20 seconds.
Can the HMC652 be used in space-grade hybrid assemblies?
Yes - the HMC652 is rated for –55°C to +85°C operation, features gold metallization compatible with hermetic sealing, and has been deployed in military & space hybrids per its official application list. Its 0.42 × 0.45 mm die size and backside ground enable robust integration into ceramic MCMs with AuSn reflow.
How does the HMC652's return loss compare between low and high frequency bands?
The HMC652 achieves 22.0 dB return loss from DC to 25 GHz and 15.3 dB return loss from 25 GHz to 50 GHz. This band-dependent specification reflects intrinsic transmission line dispersion and is verified with wire-bonded RF probing - essential for predicting VSWR impact in Ka-band (26–40 GHz) designs.
HMC652 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Analog Devices Inc.
- Package/Case:
- Die
- Series:
- -
- Packaging:
- Tray
- Product Status:
- Active
- Attenuation Value:
- 2dB
- Frequency Range:
- 0 Hz ~ 50 GHz
- Power (Watts):
- -
- Impedance:
- 50 Ohms
- Grade:
- -
- Qualification:
- -
HMC652 FAQ
1.How can I place an order for HMC652 through Aetrix?
Please submit a Request for Quotation (RFQ) for HMC652 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for HMC652 reliable?
The price and inventory of HMC652 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for HMC652 is usually 5 days.
3.What payment methods are accepted for HMC652?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for HMC652 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for HMC652?
HMC652 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your HMC652 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for HMC652?
For technical support, including HMC652 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your HMC652 requirements.
6.How does Aetrix verify that HMC652 is sourced from the original manufacturer or authorized distributors?
All HMC652 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that HMC652 meets industry standards.
7.What is the process for return or replacement of HMC652?
All HMC652 units undergo pre-shipment inspection (PSI). If there is an issue with HMC652, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The HMC652 part is unused and in its original packaging.
Return procedure for HMC652:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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