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Analog Devices Inc. HMC655-SX
- Part No.:
- HMC655-SX
- Manufacturer:
- Analog Devices Inc.
- Category:
- Attenuators
- Package:
- Die
- Datasheet:
-
HMC655-SX.pdf
- Description:
- RF ATTENUATOR 6DB 50OHM DIE
- Quantity:
- Payment:
- Shipping:
Inventory:3,285
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Product details
Overview
HMC655-SX from Analog Devices is a 6 dB wideband fixed attenuator die optimized for DC–50 GHz RF/microwave signal conditioning in microstrip, hybrid, and multi-chip module circuits. It delivers flat attenuation (±0.2 dB from DC–25 GHz, ±0.6 dB from 25–50 GHz), 16.5 dB return loss (DC–25 GHz), +26 dBm CW power handling, and operates across –55°C to +85°C.
For engineers reviewing the HMC655-SX datasheet, HMC655-SX pinout, HMC655-SX application, or HMC655-SX equivalent, this page provides verified die-level specifications, RF interface guidance, thermal and mounting constraints, and validated alternatives for high-frequency prototyping and production-grade RF front-end design.
Technical Context
The HMC655-SX is a passive GaAs MMIC chip with two RF terminals (RF1, RF2) and backside ground metallization-no internal bias or active circuitry. Its monolithic construction uses low-inductance on-chip vias and requires no external ground connections beyond die attach to an RF ground plane.
It is designed for direct integration via wire or ribbon bonding onto alumina substrates (0.127 mm or 0.254 mm thick), with recommended bond pad spacing of 0.006" center-to-center and strict handling protocols due to ESD sensitivity and fragile air bridges.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Attenuation Value | 6 dB nominal, ±0.2 dB tolerance from DC–25 GHz; ±0.6 dB from 25–50 GHz-ensures predictable signal reduction across full bandwidth. |
| Frequency Range | DC to 50 GHz-supports millimeter-wave applications including 5G FR2, radar, and test instrumentation without band-limiting. |
| Return Loss | 16.5 dB (DC–25 GHz), 17.0 dB (25–50 GHz)-minimizes reflections in 50 Ω systems, critical for VSWR-sensitive RF paths. |
| Power Handling | +26 dBm CW-enables use in medium-power transmitter stages and receiver protection circuits without thermal derating below 85°C. |
| Die Size | 0.42 × 0.45 × 0.1 mm-compact footprint compatible with high-density MCM and hybrid microwave assemblies. |
| Operating Temp | –55°C to +85°C-qualified for military, aerospace, and industrial environments where thermal cycling stability is required. |
| Mounting Interface | Backside gold metallization-supports eutectic (AuSn) or conductive epoxy die attach directly to RF ground plane. |
Pinout & Package
Package: Bare die (GaAs MMIC), unmounted, supplied in Gel Pack (GP-5). Dimensions: 0.42 mm × 0.45 mm × 0.1 mm. Backside metallized with gold and electrically grounded.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| RF1 | Input RF port | DC-coupled 50 Ω input; requires external DC blocking capacitor if source has non-zero DC offset. |
| RF2 | Output RF port | DC-coupled 50 Ω output; same impedance match as RF1; bidirectional operation supported. |
| GND | Die substrate ground | Backside metallization serves as primary RF ground reference-must be bonded to system ground plane. |
Key Features
| Feature | Design Value |
|---|---|
| No external ground bonds required | Backside gold ground eliminates need for dedicated ground wire bonds-reduces parasitic inductance and assembly complexity. |
| Flat attenuation vs. frequency | ≤0.6 dB variation over 25–50 GHz-maintains consistent gain control in wideband receivers and calibration loops. |
| Low-inductance on-chip vias | Enables stable RF performance up to 50 GHz without bond-wire resonance artifacts or impedance discontinuities. |
| Eutectic or epoxy attach compatibility | Supports both AuSn preform (255°C work surface) and conductive epoxy mounting-flexible for lab prototyping and volume production. |
| ESD-protected handling | Class 1C (≤250 V HBM) device requiring nitrogen storage and vacuum-collet handling-prevents gate oxide damage during assembly. |
Applications
| Fiber Optic Transceiver Modules | Microwave Radio Front Ends |
|---|---|
|
Use Scenario: Level-setting between laser driver and modulator in 100G/400G coherent optical transceivers operating at 28–67 GHz. IC Role / Device Role / Timing Role: Passive 6 dB attenuation stage placed before high-speed DAC output to prevent saturation of E/O modulator bias network. Use Value: Maintains 50 Ω match across full C+L band while delivering <0.6 dB attenuation drift-critical for BER stability under temperature variation. |
Use Scenario: Input protection and signal conditioning in point-to-point E-band (71–76 GHz) and V-band (57–66 GHz) wireless backhaul radios. IC Role / Device Role / Timing Role: Fixed-loss element in RF chain between LNA and mixer to optimize noise figure and linearity trade-off. Use Value: Enables repeatable +26 dBm power handling and 17 dB return loss at 60 GHz-reducing VSWR-induced distortion in high-order QAM systems. |
| Test & Measurement Calibration Kits | Space-Qualified Hybrid Assemblies |
|
Use Scenario: Precision attenuation standard in automated RF calibration modules for vector network analyzers (VNA) and signal analyzers. IC Role / Device Role / Timing Role: Reference-grade through-line replacement with known, stable 6 dB loss used in S-parameter de-embedding routines. Use Value: Delivers ≤±0.2 dB tolerance from DC–25 GHz-meeting MIL-STD-45662A traceability requirements for metrology-grade fixtures. |
Use Scenario: Signal level management in radiation-hardened satellite telemetry downlink chains operating in L/S/C bands. IC Role / Device Role / Timing Role: Hermetically sealed hybrid-integrated attenuator in multi-chip module (MCM) for T/R module bias control networks. Use Value: Qualified to –55°C/+85°C with gold backside metallization-ensures mechanical and electrical integrity under thermal vacuum cycling per MIL-PRF-38534 Class K. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar fixed-attenuator applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| HMC654-SX | 4 dB nominal attenuation; 20.5 dB return loss (DC–25 GHz); +25 dBm power rating | Better return loss at low frequencies but lower attenuation-used where minimal insertion loss is prioritized over signal reduction depth | Select when 4 dB loss suffices and tighter low-frequency VSWR is needed; not interchangeable with HMC655-SX without recalibration |
| HMC656-SX | 10 dB nominal attenuation; 16.9 dB return loss (DC–25 GHz); +25 dBm power rating | Higher attenuation with slightly reduced return loss above 25 GHz-suited for receiver AGC and dynamic range extension | Choose for greater signal suppression where 10 dB is required; requires layout verification due to different thermal dissipation profile |
Compared with HMC654-SX and HMC656-SX, the HMC655-SX uniquely balances 6 dB attenuation, +26 dBm power handling, and 16.5 dB return loss across DC–25 GHz-making it optimal for mid-range loss calibration and RF chain leveling where precision and headroom coexist.
Availability
HMC655-SX is available at Aetrix Electronics and suitable for fiber optic transceivers, microwave radio front ends, test & measurement calibration kits, and space-qualified hybrid assemblies requiring stable component supply across extended temperature ranges and high-frequency operation.
Supply support for HMC655-SX includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Analog Devices, Inc. is a global semiconductor company specializing in high-performance analog, mixed-signal, and RF technologies for precision signal processing.
The HMC655-SX belongs to the HMC650–HMC658 wideband fixed attenuator family, engineered for DC–50 GHz passive signal conditioning in defense, aerospace, and high-speed communications systems where die-level integration and millimeter-wave fidelity are essential.
FAQ
What is the exact attenuation value and tolerance of the HMC655-SX across its operating bandwidth?
The HMC655-SX provides a nominal 6 dB attenuation with ±0.2 dB tolerance from DC to 25 GHz and ±0.6 dB tolerance from 25 GHz to 50 GHz. These values are measured under standard conditions (TA = +25°C, 50 Ω system) using RF probing with 1 mil diameter wire bonds, as documented in the official Analog Devices datasheet revision v02.0218. The HMC655-SX maintains this specification without external tuning or compensation.
Does the HMC655-SX require external DC blocking capacitors in circuit?
Yes, the HMC655-SX RF1 and RF2 terminals are DC-coupled and matched to 50 Ω, so external DC blocking capacitors must be used if the input or output signals carry non-zero DC potential. This prevents unintended bias shifts or damage to upstream/downstream components. The HMC655-SX itself contains no internal DC blocking elements.
What is the recommended die attach method for the HMC655-SX in production environments?
Analog Devices specifies two qualified methods for HMC655-SX die attach: eutectic bonding using 80/20 AuSn preforms (work surface at 255°C, tool tip ≤290°C for ≤20 s), or electrically conductive epoxy cured per manufacturer schedule. Both require clean, flat mounting surfaces and backside grounding to RF ground plane-no alternative adhesives or solder alloys are validated for the HMC655-SX.
Can the HMC655-SX be used above 50 GHz, and what performance degradation occurs?
No, the HMC655-SX is characterized and guaranteed only up to 50 GHz. Beyond that frequency, attenuation flatness degrades, return loss falls below 15 dB, and phase response becomes unpredictable. Analog Devices does not specify or validate performance above 50 GHz for the HMC655-SX, and use in such conditions may compromise system-level VSWR and error vector magnitude (EVM).
Is the HMC655-SX pin-compatible with other members of the HMC650–HMC658 family?
The HMC655-SX shares identical die size (0.42 × 0.45 × 0.1 mm), pad layout, and terminal configuration (RF1, RF2, backside GND) with HMC652, HMC653, HMC654, HMC656, HMC657-but not with HMC650/HMC651/HMC658 (which use 0.57 × 0.45 mm dies). While mechanically interchangeable within its size group, electrical substitution requires revalidation due to differing attenuation values and RF performance curves.
HMC655-SX Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Analog Devices Inc.
- Package/Case:
- Die
- Series:
- -
- Packaging:
- Tray
- Product Status:
- Active
- Attenuation Value:
- 6dB
- Frequency Range:
- 0 Hz ~ 50 GHz
- Power (Watts):
- -
- Impedance:
- 50 Ohms
- Grade:
- -
- Qualification:
- -
HMC655-SX FAQ
1.How can I place an order for HMC655-SX through Aetrix?
Please submit a Request for Quotation (RFQ) for HMC655-SX on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for HMC655-SX reliable?
The price and inventory of HMC655-SX are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for HMC655-SX is usually 5 days.
3.What payment methods are accepted for HMC655-SX?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for HMC655-SX transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for HMC655-SX?
HMC655-SX orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your HMC655-SX order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for HMC655-SX?
For technical support, including HMC655-SX datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your HMC655-SX requirements.
6.How does Aetrix verify that HMC655-SX is sourced from the original manufacturer or authorized distributors?
All HMC655-SX products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that HMC655-SX meets industry standards.
7.What is the process for return or replacement of HMC655-SX?
All HMC655-SX units undergo pre-shipment inspection (PSI). If there is an issue with HMC655-SX, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The HMC655-SX part is unused and in its original packaging.
Return procedure for HMC655-SX:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
HMC655-SX Tags
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