Analog Devices Inc. HMC663LC3TR-R5
- Part No.:
- HMC663LC3TR-R5
- Manufacturer:
- Analog Devices Inc.
- Category:
- RF Mixers
- Package:
- 16-VFCQFN Exposed Pad
- Datasheet:
-
HMC663LC3TR-R5.pdf
- Description:
- IC MIXER GP DBL-BAL IP3 16SMD
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
HMC663LC3TR-R5 from Analog Devices (formerly Hittite Microwave) is a GaAs MMIC double-balanced passive mixer operating from 6–12 GHz RF, 6–14 GHz LO, and DC–4 GHz IF, delivering 8 dB typical conversion loss, 30 dBm input IP3, and 40 dB LO-to-RF isolation - ideal for high-linearity up/downconversion in microwave radios and test equipment.
For engineers reviewing the HMC663LC3TR-R5 datasheet, HMC663LC3TR-R5 pinout, HMC663LC3TR-R5 application, or HMC663LC3TR-R5 equivalent, this device requires no DC bias, supports high-side or low-side LO injection, operates with +17 to +23 dBm LO drive, and integrates optimized balun structures for robust port isolation in compact 3×3 mm ceramic SMT packaging.
Technical Context
The HMC663LC3TR-R5 implements a passive double-balanced topology using GaAs MESFET process technology, enabling true broadband operation without external matching components or DC bias circuitry. Its symmetrical balun architecture delivers simultaneous high LO-to-RF (40 dB typ) and LO-to-IF (42 dB typ) isolation across the full 6–12 GHz RF band.
It supports both upconverter and downconverter configurations with fixed IF bandwidth (DC–4 GHz), wide LO range (6–14 GHz), and stable performance over −40°C to +85°C. Conversion loss remains ≤12 dB across temperature and frequency, while input P1dB reaches 20 dBm at +25°C - confirming suitability for medium-power microwave signal chains.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| RF Frequency Range | 6–12 GHz - covers X-band radar, point-to-point backhaul, and satellite uplink bands. |
| LO Frequency Range | 6–14 GHz - enables flexible high-side/low-side injection for harmonic suppression and image rejection. |
| IF Bandwidth | DC–4 GHz - supports baseband I/Q modulation, wideband IF sampling, and DC-coupled receiver architectures. |
| Conversion Loss | 8 dB typ (max 12 dB) - defines signal path attenuation; lower values reduce system noise figure impact. |
| Input IP3 | 30 dBm - determines two-tone intermodulation distortion floor; critical for dense-spectrum multi-carrier systems. |
| LO-to-RF Isolation | 40 dB typ - minimizes LO leakage into antenna or RF front-end, easing filtering requirements. |
| Operating Temp | −40°C to +85°C - validated for outdoor wireless infrastructure and military-grade environmental operation. |
Pinout & Package
Package: 16-lead leadless ceramic SMT package (3×3 mm, 9 mm² body), alumina substrate, gold-over-nickel plating, MSL3 rated, with exposed ground paddle requiring soldering to PCB RF ground plane.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1, 4, 5, 8–13, 16 | N/C | No internal connection; must remain unconnected per design - floating pins may degrade RF performance. |
| 2 | LO | AC-coupled 50 Ω matched input; accepts +17 to +23 dBm LO drive without external bias or matching. |
| 3, 6, 15 | GND | RF/DC ground terminals; must be soldered directly to PCB ground plane alongside exposed paddle. |
| 7 | IF | DC-coupled output; supports DC–4 GHz IF; current-limited to ±2 mA to prevent damage in DC-coupled use. |
| 14 | RF | AC-coupled 50 Ω matched input/output; used as RF port in downconversion or upconversion mode. |
Key Features
| Feature | Design Value |
|---|---|
| No DC bias required | Eliminates bias network complexity, reduces BOM count, and improves reliability in high-frequency signal paths. |
| Passive double-balanced topology | Suppresses even-order harmonics and LO/RF feedthrough, simplifying post-mixer filtering in sensitive receivers. |
| High LO-to-RF/IF isolation | Reduces need for external LO suppression filters, lowering system insertion loss and board space in transceivers. |
| Wide IF bandwidth (DC–4 GHz) | Enables direct sampling of complex modulated waveforms and supports zero-IF and low-IF receiver architectures. |
| RoHS-compliant ceramic SMT package | Supports automated reflow assembly at 260°C peak; compatible with high-volume manufacturing and thermal cycling reliability. |
Applications
| Point-to-Point Radios | Test & Measurement Equipment |
|---|---|
Use Scenario: 11 GHz licensed backhaul link with 256-QAM modulation and 40 MHz channel bandwidth. IC Role / Device Role / Timing Role: Downconverter translating RF to 700 MHz IF for digitization and demodulation. Use Value: 8 dB conversion loss and 30 dBm IP3 maintain EVM < 3% under adjacent-channel interference, meeting FCC spectral mask requirements. |
Use Scenario: Vector signal analyzer front-end supporting 6–12 GHz swept measurements with <1 kHz RBW. IC Role / Device Role / Timing Role: High-isolation mixer in first downconversion stage to minimize LO leakage-induced measurement artifacts. Use Value: 40 dB LO-to-RF isolation prevents LO self-mixing, enabling accurate −120 dBm signal detection without calibration drift. |
| Military Communications | Satellite Uplink Transmitters |
Use Scenario: MANPACK radio operating in contested spectrum with jamming signals within 10 MHz of desired channel. IC Role / Device Role / Timing Role: Upconverter generating 7.25–7.75 GHz transmit signal from 250 MHz IF with high-side LO injection. Use Value: 55 dBm input IP2 suppresses second-order intermodulation from strong jammers, preserving dynamic range in EW environments. |
Use Scenario: Ka-band gateway uplink transmitter converting 1.2 GHz IF to 29.5–30.0 GHz RF using harmonic mixing. IC Role / Device Role / Timing Role: First-stage mixer accepting +21 dBm LO at 14.75 GHz to generate 29.5 GHz output via 2×LO+IF. Use Value: Stable 12 dB max conversion loss and +85°C operation ensure consistent gain flatness across thermal cycling in LEO ground stations. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar passive double-balanced mixer applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| HMC1048LP3E | Wider RF range (4–16 GHz), higher conversion loss (9.5 dB typ), same 3×3 mm package. | Better suited for wideband test equipment covering C through Ku bands; less optimal for narrow X-band radios where HMC663LC3TR-R5's lower loss matters. | Select HMC1048LP3E when broader frequency coverage outweighs 1.5 dB conversion loss penalty. |
| QPC1006 | Higher IP3 (33 dBm), wider IF (DC–6 GHz), but requires +24 dBm LO drive and larger 4×4 mm QFN package. | Preferred for high-dynamic-range 5G FR2 base station receivers needing >30 dBm IP3 and extended IF bandwidth beyond 4 GHz. | Choose QPC1006 only if system LO power budget allows +24 dBm and PCB layout accommodates larger footprint. |
Compared with HMC1048LP3E and QPC1006, the HMC663LC3TR-R5 offers the best balance of low conversion loss (8 dB), moderate LO drive (+17 dBm min), and compact 3×3 mm footprint - making it optimal for size-constrained, power-efficient X-band radios where linearity and thermal stability are prioritized over ultra-wideband coverage.
Availability
HMC663LC3TR-R5 is available at Aetrix Electronics and suitable for point-to-point radios, military communications systems, and test equipment requiring stable component supply, long-term lifecycle support, and RoHS-compliant ceramic SMT packaging.
Supply support for HMC663LC3TR-R5 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Analog Devices acquired Hittite Microwave in 2014 and maintains its high-frequency RF portfolio, specializing in microwave ICs for defense, communications, and instrumentation markets.
The HMC663LC3TR-R5 belongs to Hittite's legacy GaAs MMIC mixer product line, engineered specifically for high-linearity, bias-free operation in X-band wireless infrastructure and electronic warfare systems.
FAQ
What is the minimum LO drive level required for specified performance of the HMC663LC3TR-R5?
The HMC663LC3TR-R5 achieves its datasheet-specified conversion loss, isolation, and IP3 performance with a minimum LO drive of +17 dBm. At +17 dBm, conversion loss remains ≤12 dB and LO-to-RF isolation stays ≥29 dB across 6–12 GHz. Lower LO power degrades conversion efficiency and increases noise figure, so +17 dBm is the validated operational floor for full specification compliance.
Can the HMC663LC3TR-R5 be used in zero-IF (direct-conversion) receiver architectures?
Yes, the HMC663LC3TR-R5 supports zero-IF operation because its IF port is DC-coupled and rated for DC–4 GHz bandwidth. However, the IF output must not source or sink more than ±2 mA DC current - exceeding this limit risks non-function or permanent damage. For true DC-coupled use, ensure downstream circuitry presents high impedance or includes current-limiting protection.
Is the HMC663LC3TR-R5 pin-compatible with other Hittite mixer variants like HMC662LC3 or HMC664LC3?
No, the HMC663LC3TR-R5 is not pin-compatible with HMC662LC3 or HMC664LC3. While all three share the same 3×3 mm ceramic package outline, their pin functions differ: HMC662LC3 uses pin 7 as RF and pin 14 as IF, whereas HMC663LC3TR-R5 assigns pin 7 as IF and pin 14 as RF. PCB layout must be redesigned to match the HMC663LC3TR-R5 pinout.
What is the thermal resistance and maximum power dissipation of the HMC663LC3TR-R5?
The HMC663LC3TR-R5 has a channel-to-ground paddle thermal resistance of 60°C/W. At 85°C case temperature, its continuous power dissipation is 1.08 W, derating linearly by 17 mW/°C above 85°C. This allows safe operation up to 150°C channel temperature - critical for conduction-cooled RF modules in sealed enclosures.
Does the HMC663LC3TR-R5 require external matching components for 50 Ω operation?
No, the HMC663LC3TR-R5 does not require external matching components. Its LO and RF ports are internally AC-coupled and 50 Ω matched, and the IF port is DC-coupled with 50 Ω characteristic impedance. The device is designed for direct integration into 50 Ω microstrip layouts - only proper grounding of all GND pins and the exposed paddle is required for optimal RF performance.
HMC663LC3TR-R5 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Analog Devices Inc.
- Series:
- -
- Package/Case:
- 16-VFCQFN Exposed Pad
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Obsolete
- RF Type:
- General Purpose
- Frequency:
- 6GHz ~ 12GHz
- Number of Mixers:
- 1
- Gain:
- -
- Noise Figure:
- 10dB
- Secondary Attributes:
- Up/Down Converter
- Current - Supply:
- -
- Voltage - Supply:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 16-CSMT (3x3)
HMC663LC3TR-R5 FAQ
1.How can I place an order for HMC663LC3TR-R5 through Aetrix?
Please submit a Request for Quotation (RFQ) for HMC663LC3TR-R5 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for HMC663LC3TR-R5 reliable?
The price and inventory of HMC663LC3TR-R5 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for HMC663LC3TR-R5 is usually 5 days.
3.What payment methods are accepted for HMC663LC3TR-R5?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for HMC663LC3TR-R5 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for HMC663LC3TR-R5?
HMC663LC3TR-R5 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your HMC663LC3TR-R5 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for HMC663LC3TR-R5?
For technical support, including HMC663LC3TR-R5 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your HMC663LC3TR-R5 requirements.
6.How does Aetrix verify that HMC663LC3TR-R5 is sourced from the original manufacturer or authorized distributors?
All HMC663LC3TR-R5 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that HMC663LC3TR-R5 meets industry standards.
7.What is the process for return or replacement of HMC663LC3TR-R5?
All HMC663LC3TR-R5 units undergo pre-shipment inspection (PSI). If there is an issue with HMC663LC3TR-R5, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The HMC663LC3TR-R5 part is unused and in its original packaging.
Return procedure for HMC663LC3TR-R5:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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