Analog Devices Inc. HMC674LP3ETR
- Part No.:
- HMC674LP3ETR
- Manufacturer:
- Analog Devices Inc.
- Category:
- Comparators
- Package:
- 16-VFQFN Exposed Pad
- Datasheet:
-
HMC674LP3ETR.pdf
- Description:
- IC COMPARATOR 1 GEN PUR 16QFN
- Quantity:
- Payment:

- Shipping:

Inventory:4,836
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
HMC674LP3ETR from Analog Devices is a 9.3 GHz SiGe latched comparator with RSPECL outputs, 85 ps propagation delay, 60 ps minimum input pulse width, and resistor-programmable hysteresis-designed for 10 Gbps clock/data restoration and high-speed ATE trigger circuits.
For engineers reviewing the HMC674LP3ETR datasheet, HMC674LP3ETR pinout, HMC674LP3ETR application, or HMC674LP3ETR equivalent, key selection criteria include latch enable timing (tS = 45 ps, tH = −42 ps), RSPECL output drive into 50 Ω (VOL = 0.71 V, VOH = 1.09 V), and −40°C to +85°C operation in a 3 mm × 3 mm LFCSP package.
Technical Context
The HMC674LP3ETR integrates three functional blocks: a high-bandwidth SiGe input amplifier, a level-sensitive latch with differential LE/LE control, and RSPECL output buffers capable of driving 400 mV into 50 Ω terminated to VTT = VCCO − 2.0 V. It supports both transparent (track) and hold (latch) modes via LE/LE logic state.
Its 9.3 GHz equivalent input bandwidth, 0.2 ps rms random jitter, and 10 ps overdrive/slew rate dispersion enable precise edge detection in broadband digital receiver systems and pulse spectroscopy-where deterministic timing accuracy and minimal pulse distortion are critical.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Equivalent Input Bandwidth | 9.3 GHz typical - enables accurate digitization of sub-100 ps pulses without aliasing or rise-time degradation. |
| Propagation Delay | 85 ps typical - ensures sub-100 ps timing alignment between input transition and output assertion in high-speed sampling paths. |
| Input Pulse Width Min | 60 ps typical - supports direct interfacing with ultrafast laser diodes or GaAs-based signal sources. |
| Output Logic Family | RSPECL - delivers 440–980 mV p-p differential swing compatible with PECL-terminated 50 Ω systems at VCCO = 2.0 V. |
| Power Dissipation | 140 mW typical - enables integration into dense RF instrumentation without excessive thermal load on adjacent components. |
| Operating Temperature | −40°C to +85°C - validated for industrial-grade ATE and field-deployed test equipment environments. |
| Hysteresis Control | Resistor-programmable via HYS pin - allows precise noise immunity tuning (e.g., 1 mV hysteresis with RHYS ≈ 10 kΩ) without redesign. |
Pinout & Package
Package: 16-lead lead frame chip scale package (LFCSP), 3 mm × 3 mm body, 0.90 mm height, exposed pad requiring connection to VEE per JEDEC MO-220-VEED-4.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1 (VTP) | VP Input Termination Return | Return path for 50 Ω termination of noninverting input; must be connected to system ground or VTT reference. |
| 2 (INP) | Noninverting Analog Input | Differential input node accepting ±2 V range; 50 Ω impedance matched for RF signal integrity up to 9.3 GHz. |
| 3 (INN) | Inverting Analog Input | Differential input node with identical specs to INP; paired with INP for common-mode rejection >80 dB. |
| 4 (VTN) | VN Input Termination Return | Return path for 50 Ω termination of inverting input; decoupled from VTP to minimize crosstalk. |
| 5, 16 (VCCI) | Input Stage Positive Supply | 3.3 V ±3% supply for SiGe input amplifier; requires local 100 pF + 4.7 µF bypassing per datasheet layout guidelines. |
| 6 (LE) | Inverting Latch Enable | Active-low control input; low = track mode, high = latch mode; 8 kΩ input impedance, 20 ps min pulse width. |
| 7 (LE) | Noninverting Latch Enable | Complementary active-high latch control; used with Pin 6 to form differential latch enable interface. |
| 8 (NIC) | Not Internally Connected | No internal bond; connect to ground to reduce noise coupling into adjacent RF pins. |
| 9, 12 (VCCO) | Output Stage Positive Supply | 2.0 V supply for RSPECL drivers; independent of VCCI to optimize noise isolation between analog and digital sections. |
| 10 (Q) | Inverting Output | RSPECL-compliant output; low when INP > INN in track mode; held stable during latch mode. |
| 11 (Q) | Noninverting Output | Complementary RSPECL output; high when INP > INN in track mode; synchronized with Q under all conditions. |
| 13 (VEE) | Negative Supply (−3 V) | −3.0 V ±5% bias for SiGe core; exposed pad must be soldered directly to VEE plane for thermal and EMI performance. |
| 14 (HYS) | Hysteresis Control | Connect to VEE via external resistor to set hysteresis voltage; open = zero hysteresis; 10 kΩ ≈ 1 mV. |
| 15 (RTN) | ESD Protection Return | Internal ESD clamp return; connect to ground to ensure robust 1A HBM rating across all pins. |
| EPAD | Exposed Thermal Pad | Must be soldered to VEE plane with ≥6 thermal vias; reduces θJC to 23°C/W for reliable 140 mW operation. |
Key Features
| Feature | Design Value |
|---|---|
| SiGe Monolithic Process | Enables 9.3 GHz bandwidth and 0.2 ps rms jitter while maintaining DC-coupled input compatibility and −40°C to +85°C operation. |
| Dual-Mode Operation (Track/Latch) | Configurable via LE/LE pins: track mode provides real-time comparison; latch mode captures transient events with <10 ps timing uncertainty. |
| RSPECL Output Drivers | Deliver 440–980 mV p-p swing into 50 Ω loads terminated to VTT = VCCO − 2.0 V-eliminating need for external level shifters in PECL systems. |
| Programmable Hysteresis | External resistor on HYS pin sets hysteresis from 0 to >10 mV-enabling adaptive noise rejection in variable-signal-amplitude applications like pulse spectroscopy. |
| Low Propagation Delay Dispersion | 10 ps typical overdrive/slew rate dispersion ensures consistent timing across input amplitudes from 50 mV to 1 V-critical for multi-level signal discrimination. |
Applications
| Automatic Test Equipment (ATE) | High-Speed Digital Receiver Systems |
|---|---|
Use Scenario: Capturing nanosecond-scale timing margins in semiconductor wafer probe testing using pulsed laser stimuli. IC Role / Device Role / Timing Role: Latched comparator capturing edge transitions with 85 ps delay and 10 ps dispersion to validate setup/hold windows. Use Value: Enables sub-100 ps timing resolution without external retiming, reducing ATE channel count and calibration complexity. | Use Scenario: Recovering clock and data from degraded 10 Gbps optical or electrical serial links with intersymbol interference. IC Role / Device Role / Timing Role: Clock and data restoration (CDR) front-end comparator generating clean, jitter-filtered logic edges from analog waveforms. Use Value: 0.2 ps rms jitter and 9.3 GHz bandwidth preserve eye opening in high-loss channels, improving BER by >2 orders of magnitude. |
| Pulse Spectroscopy Instrumentation | High-Speed Trigger Circuits |
Use Scenario: Time-of-flight measurement in ultrafast laser-induced plasma diagnostics with picosecond temporal resolution. IC Role / Device Role / Timing Role: Precision pulse-width discriminator triggering acquisition on transient events with 60 ps minimum detectable width. Use Value: Resistor-programmable hysteresis rejects baseline noise while preserving true pulse edges-enabling single-shot capture of weak signals. | Use Scenario: Synchronizing multiple high-speed ADCs or DACs in phased-array radar systems using distributed clock edges. IC Role / Device Role / Timing Role: Low-skew, low-jitter trigger generator distributing deterministic timing events across parallel signal paths. Use Value: 10 ps skew between Q/Q outputs and 8 ps common-mode dispersion ensure <20 ps inter-channel timing error at 10 Gbps. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar ultrafast comparator applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| HMC674LC3C | Ceramic LCC package (E-16-1), θJC = 49°C/W, MSL3 rating vs. HMC674LP3ETR's plastic LFCSP (HCP-16-1), θJC = 23°C/W, MSL1. | Better thermal stability in high-reliability aerospace systems; less suitable for reflow-soldered high-volume production due to MSL3 moisture sensitivity. | Select HMC674LC3C for mission-critical RF test fixtures requiring long-term hermetic reliability; choose HMC674LP3ETR for cost-sensitive, high-throughput manufacturing. |
| ADCMP572BCPZ-R7 | Lower bandwidth (6 GHz), higher propagation delay (110 ps), no latch mode-only tracking comparator with LVDS outputs. | Suitable for general-purpose high-speed digitization but cannot replace HMC674LP3ETR in latch-based event capture or 10 Gbps CDR. | Use ADCMP572BCPZ-R7 only where latch functionality and sub-100 ps delay are not required; verify 6 GHz bandwidth suffices for target signal rise times. |
Compared with HMC674LC3C and ADCMP572BCPZ-R7, the HMC674LP3ETR uniquely combines 9.3 GHz bandwidth, latch mode, RSPECL outputs, and MSL1-compatible LFCSP packaging-making it the only option for production-grade, reflowable 10 Gbps trigger and CDR designs requiring <100 ps timing fidelity.
Availability
HMC674LP3ETR is available at Aetrix Electronics and suitable for automatic test equipment (ATE), high-speed digital receiver systems, and pulse spectroscopy instrumentation requiring stable component supply, RoHS compliance, and MSL1 handling capability.
Supply support for HMC674LP3ETR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Analog Devices is a global leader in high-performance analog, mixed-signal, and RF ICs, serving precision instrumentation, communications, and industrial markets since 1965.
The HMC674LP3ETR belongs to Analog Devices' Hittite Microwave legacy ultrafast comparator product line, engineered specifically for sub-100 ps timing-critical applications in ATE, broadband communications, and scientific instrumentation.
FAQ
What is the maximum operating frequency supported by the HMC674LP3ETR?
The HMC674LP3ETR supports 10 Gbps operation with a typical equivalent input bandwidth of 9.3 GHz. Its 60 ps minimum input pulse width and 85 ps propagation delay enable reliable signal discrimination at bit rates up to 10 Gbps in clock and data recovery applications. The device maintains this performance across its full −40°C to +85°C operating temperature range, as verified in the Rev. K datasheet.
Does the HMC674LP3ETR require external termination resistors on its inputs?
Yes, the HMC674LP3ETR requires 50 Ω series termination on both INP and INN inputs, with VTP and VTN connected to the appropriate return (ground or VTT). Figure 5 of the datasheet shows this configuration explicitly. Failure to terminate properly degrades bandwidth and increases reflection-induced jitter, directly impacting the 0.2 ps rms jitter specification of the HMC674LP3ETR.
How is latch mode enabled on the HMC674LP3ETR?
Latch mode is enabled by driving the LE pin high and LE pin low simultaneously-i.e., asserting the differential latch enable pair. In latch mode, the HMC674LP3ETR holds the output state corresponding to the input comparison result just before the LE/LE transition. Track mode occurs when LE is low and LE is high. Both modes are fully specified in Tables 2 and 6 of the HMC674LP3ETR datasheet.
Can the HMC674LP3ETR operate with different supply voltages for VCCI and VCCO?
Yes, the HMC674LP3ETR supports independent supplies: VCCI = 3.3 V ±3% for the input stage and VCCO = 1.8 V to 3.3 V for the RSPECL output stage. This separation minimizes noise coupling between analog and digital sections. The datasheet specifies VCCO = 2.0 V for optimal RSPECL output swing (440–980 mV p-p), confirming that HMC674LP3ETR operation is validated across this range.
What is the recommended PCB layout practice for the exposed thermal pad of the HMC674LP3ETR?
The exposed pad of the HMC674LP3ETR must be soldered directly to the VEE plane using ≥6 thermal vias (0.3 mm diameter, spaced ≤1 mm apart) to achieve the specified θJC of 23°C/W. Per Figures 17–18 and the "Pin Configurations" section, failure to connect the EPAD to VEE causes thermal runaway above 100 mW and violates the absolute maximum junction temperature rating of 125°C for the HMC674LP3ETR.
HMC674LP3ETR Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Analog Devices Inc.
- Package/Case:
- 16-VFQFN Exposed Pad
- Series:
- -
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Type:
- General Purpose
- Number of Elements:
- 1
- Output Type:
- PECL
- Voltage - Supply, Single/Dual (±):
- 3.3V
- :
- 5mV
- Voltage - Input Offset (Max):
- 15µA
- Current - Input Bias (Max):
- 45mA
- Current - Output (Typ):
- 9mA
- Current - Quiescent (Max):
- -
- CMRR, PSRR (Typ):
- 0.11ns
- Propagation Delay (Max):
- 1mV
- Hysteresis:
- -40°C ~ 85°C
- Operating Temperature:
- -
- Grade:
- -
- Qualification:
- Surface Mount
- :
- 16-QFN (3x3)
HMC674LP3ETR FAQ
1.How can I place an order for HMC674LP3ETR through Aetrix?
Please submit a Request for Quotation (RFQ) for HMC674LP3ETR on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for HMC674LP3ETR reliable?
The price and inventory of HMC674LP3ETR are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for HMC674LP3ETR is usually 5 days.
3.What payment methods are accepted for HMC674LP3ETR?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for HMC674LP3ETR transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for HMC674LP3ETR?
HMC674LP3ETR orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your HMC674LP3ETR order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for HMC674LP3ETR?
For technical support, including HMC674LP3ETR datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your HMC674LP3ETR requirements.
6.How does Aetrix verify that HMC674LP3ETR is sourced from the original manufacturer or authorized distributors?
All HMC674LP3ETR products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that HMC674LP3ETR meets industry standards.
7.What is the process for return or replacement of HMC674LP3ETR?
All HMC674LP3ETR units undergo pre-shipment inspection (PSI). If there is an issue with HMC674LP3ETR, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The HMC674LP3ETR part is unused and in its original packaging.
Return procedure for HMC674LP3ETR:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
HMC674LP3ETR Tags

-
LM2903DR
Texas Instruments
-
LM339DR
Texas Instruments

-
LM339PWR
Texas Instruments

-
LM393DT
STMicroelectronics

-
LM2901PWR
Texas Instruments

-
LM2903DT
STMicroelectronics

-
LM393DR
Texas Instruments
-
LM239DR
Texas Instruments

-
LM339APWR
Texas Instruments

-
LM2903P
Texas Instruments

-
LM393ADR
Texas Instruments

-
NCX2200GMAZ
NXP Semiconductors
Tech Hub
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…

