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Analog Devices Inc. HMC687LP4E
- Part No.:
- HMC687LP4E
- Manufacturer:
- Analog Devices Inc.
- Category:
- RF Mixers
- Package:
- 24-VFQFN Exposed Pad
- Datasheet:
-
HMC687LP4E.pdf
- Description:
- IC MMIC MIXER BICMOS 24-QFN
- Quantity:
- Payment:
- Shipping:
Inventory:4,537
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Product details
Overview
HMC687LP4E from Analog Devices (formerly Hittite Microwave) is a BiCMOS MMIC double-balanced mixer with integrated LO amplifier, designed for RF-to-IF downconversion and upconversion in 1.7–2.2 GHz systems. It delivers 8 dB typical conversion loss, +35 dBm input IP3, and +23 dBm input 1 dB compression at 0 dBm LO drive, operating from DC to 500 MHz IF bandwidth with 5 V supply.
For engineers reviewing the HMC687LP4E datasheet, HMC687LP4E pinout, HMC687LP4E application, or HMC687LP4E equivalent, key selection criteria include high-side LO optimization, adjustable G_BIAS and R9-based current tuning, 24-pin 4×4 mm QFN package compatibility, and isolation performance (LO–RF ≥30 dB, RF–IF ≥42 dB) in cellular infrastructure signal chains.
Technical Context
The HMC687LP4E implements a passive double-balanced mixer core with on-die LO buffer amplifier and integrated RF/IF baluns. Its architecture supports both high-side LO downconversion and upconversion, with differential IF ports (IFP/IFN) and single-ended 50 Ω matched RF/LO interfaces.
Supply current is adjustable via external resistor R9 (nominal 270 Ω) and G_BIAS voltage (0–5 V), enabling trade-offs between linearity (IP3) and conversion gain across temperature (−40°C to +85°C) and frequency. The device requires DC grounding of all ground pins and the exposed paddle per RF layout best practices.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| RF Frequency Range | 1.7–2.2 GHz - fully specified band for RF port operation in cellular/WiMAX base station transceivers |
| LO Frequency Range | 1.7–2.4 GHz - supports high-side LO injection with ≥30 dB LO–RF isolation at 2.1 GHz |
| IF Frequency Range | DC–500 MHz - enables direct-baseband and low-IF architectures without external DC blocking for DC-coupled IF |
| Conversion Loss | 8 dB typical - measured at TA = +25°C, IF = 200 MHz, LO = 0 dBm, defines signal path attenuation in receiver front-end design |
| Input IP3 | +35 dBm typical - determines third-order intermodulation handling in multi-carrier LTE/GSM environments |
| LO–RF Isolation | 30 dB typical - minimizes LO leakage into antenna path, reducing self-interference in FDD systems |
| Supply Current | 120 mA typical at Vcc = +5 V - configurable down to 70 mA via G_BIAS/R9 for power-constrained applications |
| Operating Temperature | −40°C to +85°C - qualified for outdoor macro/micro base station and repeater deployment |
Pinout & Package
Package: 24-lead 4×4 mm QFN with exposed thermal paddle; RoHS-compliant matte tin plating; MSL1 rating; max reflow 260°C.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1, 6, 7, 11–14, 18, 20, 23 | N/C | No internal connection; may be tied to RF ground without performance impact |
| 2, 5, 15, 17 | GND | RF/DC ground reference; must connect to PCB ground plane with multiple vias |
| 3 | RF | Single-ended 50 Ω RF input/output; internally DC-shortened via balun |
| 4 | TAP | RF balun center tap; short to ground with zero-ohm resistor adjacent to IC |
| 8, 10, 24 | Vcc1, Vcc2, Vcc3 | Independent 5 V supply inputs; require local 0.1 µF bypassing per pin |
| 9 | LO_BIAS | LO buffer current control; sets LO drive capability via external R9 (270 Ω nominal) |
| 16 | LO | Single-ended 50 Ω LO input; internally DC-shortened via balun |
| 19 | G_BIAS | Conversion gain/linearity bias control; 0–5 V adjustable, 15 kΩ internal pull-down |
| 21, 22 | IFN, IFP | Differential 50 Ω IF interface; supports DC-coupled or AC-coupled IF paths |
Key Features
| Feature | Design Value |
|---|---|
| Integrated LO amplifier | Eliminates external LO driver stage; accepts −3 to +3 dBm LO drive while delivering sufficient level to mixer core |
| Adjustable supply current | Configurable from 70 mA to 120 mA via G_BIAS voltage and R9 resistor, enabling dynamic power–performance trade-off |
| High-side LO optimization | Delivers best-in-class IP3 (+35 dBm) and isolation when LO > RF, matching common FDD cellular frequency plans |
| Dual-mode operation | Validated for both downconversion (RF→IF) and upconversion (IF→RF), supporting transceiver reuse in TDD/FDD designs |
| DC-coupled IF interface | Differential IFN/IFP ports support baseband I/Q processing without external DC blocking capacitors |
| Thermal management | Exposed paddle and 48.33 °C/W channel-to-ground thermal resistance enable stable operation at +85°C ambient |
Applications
| Cellular Base Station Receiver | WiMAX Transmitter |
|---|---|
Use Scenario: Downconverting 1.9 GHz LTE signals to 200 MHz IF in macrocell remote radio head (RRH). IC Role / Device Role / Timing Role: High-linearity double-balanced mixer with integrated LO amplifier serving as first IF stage after LNA and preselector filter. Use Value: +35 dBm IP3 prevents in-band IMD generation from adjacent carriers; 30 dB LO–RF isolation avoids desensitization from LO leakage. |
Use Scenario: Upconverting 100 MHz OFDM baseband to 2.3 GHz WiMAX band in small-cell femtocell transmitter. IC Role / Device Role / Timing Role: Final IF-to-RF upconverter with differential IF input and single-ended RF output before PA driver stage. Use Value: DC–500 MHz IF bandwidth accommodates wide-channel OFDM; 8 dB conversion loss maintains EVM budget under high PAPR. |
| GSM/CDMA Repeater Front-End | 4G/LTE Band Selection Module |
Use Scenario: Bidirectional signal translation in in-building repeater covering 1.7–2.2 GHz bands for GSM/CDMA overlay networks. IC Role / Device Role / Timing Role: Dual-path mixer (separate RX/TX paths) providing simultaneous receive downconversion and transmit upconversion. Use Value: Pin-compatible with HMC685LP4E allows shared PCB layout for high/low-side LO variants; 42 dB RF–IF isolation prevents TX–RX crosstalk. |
Use Scenario: Frequency-agile band selection in software-defined radio (SDR) platform supporting LTE Bands 3, 4, 7, and 25. IC Role / Device Role / Timing Role: Programmable mixer core with G_BIAS-adjusted linearity for adaptive interference rejection across bands. Use Value: Adjustable 70–120 mA supply current enables real-time power scaling during low-traffic periods without hardware change. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar mixer applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| HMC685LP4E | Same 24-pin QFN package and pinout; optimized for low-side LO (LO < RF), not high-side; 1.7–2.2 GHz RF range identical | Better suited for TDD systems where LO frequency falls below RF band; lower LO–IF isolation (25 dB typ.) than HMC687LP4E | Select HMC685LP4E when system architecture mandates low-side LO injection and board space reuse is critical |
| ADL5801ACPZ-R7 | Active double-balanced mixer; 0.4–2.7 GHz RF, 0.4–2.7 GHz LO; requires no external LO amp; 16-lead 4×4 mm LFCSP | Higher integration (no external LO driver needed), but higher conversion loss (9.5 dB) and lower IP3 (+28 dBm); not pin-compatible | Choose ADL5801ACPZ-R7 when minimizing BOM count outweighs need for maximum linearity in compact SDR designs |
Compared with HMC687LP4E, HMC685LP4E offers identical footprint and supply compatibility but targets opposite LO-side topology, while ADL5801ACPZ-R7 trades raw linearity for integration and broader frequency coverage-making HMC687LP4E optimal for high-dynamic-range FDD infrastructure where LO drive control and IP3 are primary constraints.
Availability
HMC687LP4E is available at Aetrix Electronics and suitable for cellular base station receivers, WiMAX transmitters, GSM/CDMA repeaters, and 4G/LTE band selection modules requiring stable component supply across extended temperature and high-reliability production cycles.
Supply support for HMC687LP4E includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Analog Devices acquired Hittite Microwave in 2014 and continues its legacy of high-performance RF and microwave components for communications infrastructure.
The HMC687LP4E belongs to Hittite's BiCMOS MMIC mixer product line, engineered specifically for high-linearity, high-isolation signal translation in 3G/4G/LTE base station and repeater applications.
FAQ
What is the recommended LO drive level for optimal performance of the HMC687LP4E?
The HMC687LP4E achieves best conversion loss (8 dB) and IP3 (+35 dBm) at 0 dBm LO drive. It operates over −3 to +3 dBm LO input; exceeding +3 dBm risks saturation of the internal LO amplifier, while below −3 dBm degrades conversion gain and increases noise figure. Always verify LO drive with calibrated source and monitor LO–RF isolation.
Can the HMC687LP4E be used for upconversion applications?
Yes, the HMC687LP4E supports both upconversion and downconversion. In upconversion mode, the IFN/IFP ports serve as differential inputs and RF as single-ended output. Performance data (e.g., IP3, conversion loss) is validated for both modes per datasheet Figures 10–12, with identical RF/LO frequency ranges and isolation specs.
How does G_BIAS voltage affect HMC687LP4E performance?
G_BIAS (Pin 19) adjusts conversion gain and linearity: at +2.5 V (nominal), HMC687LP4E delivers 8 dB conversion loss and +35 dBm IP3; lowering G_BIAS reduces gain and improves IP3, while raising it increases gain but degrades IP3. This enables real-time trade-off tuning in adaptive radio systems without hardware changes.
Is the HMC687LP4E pin-compatible with other Hittite mixers?
Yes, the HMC687LP4E is pin-for-pin compatible with the HMC685LP4E, differing only in internal LO-side optimization (high-side vs. low-side). Both share identical 24-pin 4×4 mm QFN packaging, supply pin assignments (Vcc1/2/3), and IF/RF/LO interface definitions-enabling drop-in replacement in existing layouts when changing LO architecture.
What is the role of the TAP pin (Pin 4) on the HMC687LP4E?
Pin 4 (TAP) is the center tap of the internal RF balun secondary winding. It must be shorted to RF ground using a zero-ohm resistor placed immediately adjacent to the IC. Failure to ground TAP degrades RF port return loss and conversion loss flatness across the 1.7–2.2 GHz band, as confirmed in datasheet Figure 5 (Return Loss).
Does the HMC687LP4E require external DC blocking capacitors on the IF ports?
No-IFN and IFP are fully DC-coupled and support baseband operation down to 0 Hz. External DC blocking is only required if the connected circuit (e.g., ADC driver or filter) cannot tolerate DC offset. When used in AC-coupled configurations, standard 100 nF 0402 capacitors are recommended per datasheet Application Circuit.
HMC687LP4E Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Analog Devices Inc.
- Series:
- -
- Package/Case:
- 24-VFQFN Exposed Pad
- Packaging:
- Strip
- Product Status:
- Obsolete
- RF Type:
- LTE, WiMax
- Frequency:
- 1.7GHz ~ 2.2GHz
- Number of Mixers:
- 1
- Gain:
- -
- Noise Figure:
- 8dB
- Secondary Attributes:
- Up/Down Converter
- Current - Supply:
- 120mA
- Voltage - Supply:
- 4.75V ~ 5.25V
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 24-QFN (4x4)
HMC687LP4E FAQ
1.How can I place an order for HMC687LP4E through Aetrix?
Please submit a Request for Quotation (RFQ) for HMC687LP4E on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for HMC687LP4E reliable?
The price and inventory of HMC687LP4E are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for HMC687LP4E is usually 5 days.
3.What payment methods are accepted for HMC687LP4E?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for HMC687LP4E transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for HMC687LP4E?
HMC687LP4E orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your HMC687LP4E order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for HMC687LP4E?
For technical support, including HMC687LP4E datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your HMC687LP4E requirements.
6.How does Aetrix verify that HMC687LP4E is sourced from the original manufacturer or authorized distributors?
All HMC687LP4E products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that HMC687LP4E meets industry standards.
7.What is the process for return or replacement of HMC687LP4E?
All HMC687LP4E units undergo pre-shipment inspection (PSI). If there is an issue with HMC687LP4E, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The HMC687LP4E part is unused and in its original packaging.
Return procedure for HMC687LP4E:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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