Analog Devices Inc. HMC722LC3C

Overview

HMC722LC3C from Analog Devices (formerly Hittite Microwave) is a high-speed differential logic gate IC supporting AND/NAND/OR/NOR functions in RF and serial data systems. It operates from a single -3.3 V supply, delivers 13 Gbps data rates and 13 GHz clock frequencies, features programmable output voltage swing (600–1100 mV_pp), and integrates on-chip 50 Ω input termination for AC/DC-coupled interfaces - used in broadband test instrumentation and NRZ-to-RZ conversion.

For engineers reviewing the HMC722LC3C datasheet, HMC722LC3C pinout, HMC722LC3C application, or HMC722LC3C equivalent, key selection criteria include its differential rise/fall times (19/18 ps), propagation delay (95 ps), VR-controlled output swing, -3.3 V single-supply operation, and 3×3 mm ceramic SMT package compatibility with high-frequency PCB layout practices.

Technical Context

The HMC722LC3C implements a fully differential ECL-compatible logic core with four configurable Boolean functions selected via external wiring. Its inputs are internally terminated to 50 Ω to ground, enabling direct connection to 50 Ω transmission lines without external resistors. The VR pin adjusts differential output amplitude across process/voltage/temperature by varying control voltage from –1.2 V to +0.4 V.

It supports both single-ended and differential operation, exhibits low random jitter (0.2 ps_rms) and deterministic jitter (2 ps_p-p at 13 GHz), and maintains >10 dB input/output return loss up to 13 GHz. Propagation delay is tightly controlled at 95 ps with <1 ps skew between channels under nominal conditions.

Key Specifications

Pinout & Package

Package: 16-lead ceramic 3×3 mm surface-mount package (9 mm² footprint), RoHS-compliant, alumina body with gold-plated leads and exposed Vee paddle requiring soldering to PCB ground plane.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-speed logic gate applications.

Compared with HMC722LC3C, HMC723LC3C offers functional subset and fixed output swing, while HMC855LP3E provides quad functionality at cost of larger size and dual-supply requirement - HMC722LC3C remains optimal for compact, single-supply, amplitude-tunable logic gates at 13 Gbps.

Availability

HMC722LC3C is available at Aetrix Electronics and suitable for RF ATE instrumentation, broadband test equipment, and serial data transmission systems requiring stable component supply, long-term lifecycle support, and traceable sourcing for production programs.

Supply support for HMC722LC3C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Analog Devices acquired Hittite Microwave in 2014 and continues to manufacture and support its high-frequency RF and microwave IC portfolio.

The HMC722LC3C belongs to Hittite's High Speed Digital Logic family, designed specifically for ECL-compatible, >10 Gbps signal routing, logic gating, and clock/data conditioning in test, measurement, and communications infrastructure.

FAQ

What logic functions does the HMC722LC3C support?

The HMC722LC3C supports four configurable logic functions - AND, NAND, OR, and NOR - selected via external pin strapping per the truth table in its datasheet. All functions operate at up to 13 Gbps with identical timing and jitter performance. The HMC722LC3C does not require internal configuration registers or digital control; logic mode is set statically by connecting inputs to defined voltage levels.

How is output voltage swing controlled on the HMC722LC3C?

Output differential voltage swing on the HMC722LC3C is controlled by the VR pin (Pin 14), which accepts a DC voltage from –1.2 V to +0.4 V to adjust swing from 600 mV_pp to 1100 mV_pp. This allows real-time optimization for channel loss compensation or receiver input range matching. The HMC722LC3C datasheet provides curves showing swing vs. VR voltage across temperature and supply conditions.

What is the recommended power supply configuration for the HMC722LC3C?

The HMC722LC3C requires a single -3.3 V supply (range: -3.6 V to -3.0 V) applied to Pin 15 (Vee) and all ground pins. The exposed base must be soldered directly to the -3.3 V ground plane. Decoupling capacitors - including 100 pF (RF) and 4.7 µF (bulk) - are required per the evaluation board schematic. The HMC722LC3C draws ~70 mA typical, resulting in ~230 mW power dissipation.

Can the HMC722LC3C accept single-ended inputs?

Yes, the HMC722LC3C accepts single-ended inputs by terminating the complementary input to ground or biasing it appropriately, though differential operation is preferred for noise immunity and jitter performance. Inputs are internally terminated to 50 Ω to ground, supporting both AC- and DC-coupled interfaces. The HMC722LC3C truth table and application circuit confirm valid single-ended use cases with appropriate common-mode setup.

What package type and mounting requirements apply to the HMC722LC3C?

The HMC722LC3C uses a 16-lead ceramic 3×3 mm SMT package with an exposed Vee paddle. All ground pins (1, 4, 5, 8, 9, 12, 13, 16) and the base must be soldered to a low-inductance RF ground plane using multiple thermal vias. Per the datasheet, package warp must not exceed 0.05 mm, and lead coplanarity must be maintained to ensure reliable reflow. The HMC722LC3C is RoHS-compliant and rated for -40°C to +85°C operation.