Analog Devices Inc. HMC773A-SX
- Part No.:
- HMC773A-SX
- Manufacturer:
- Analog Devices Inc.
- Category:
- RF Mixers
- Package:
- Die
- Datasheet:
-
HMC773A-SX.pdf
- Description:
- FUNDAMENTAL MIXER SMT, 6 - 26 GH
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
HMC773A-SX from Analog Devices is a GaAs MMIC double-balanced fundamental mixer operating from 6 GHz to 26 GHz as both upconverter and downconverter, with 10 dB typical conversion loss, 21 dBm input IP3, and dc–10 GHz IF bandwidth. It requires no DC bias or external matching components and is used in millimeter-wave point-to-point radios and military test equipment.
For engineers reviewing the HMC773A-SX datasheet, HMC773A-SX pinout, HMC773A-SX application, or HMC773A-SX equivalent, key selection criteria include RF/LO frequency coverage (6–26 GHz), passive operation (no bias required), LO drive sensitivity (≥13 dBm), isolation performance (LO–RF ≥39 dB), and surface-mount die-level packaging for high-frequency PCB integration.
Technical Context
The HMC773A-SX implements a double-balanced topology using optimized on-die balun structures to achieve high LO-to-RF (39 dB typ) and LO-to-IF (33 dB typ) suppression. Its passive design eliminates DC biasing requirements and enables operation across two RF bands: 6–16 GHz and 16–26 GHz, with corresponding LO ranges.
It supports both upper and lower sideband downconversion and upconversion, with IF bandwidth spanning dc to 10 GHz. Performance is specified at TA = 25°C with 13 dBm LO drive, and thermal operation is validated from −55°C to +85°C with channel temperature limits up to 175°C.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Frequency Range | RF/LO: 6–26 GHz; IF: dc–10 GHz - enables full K-band and Ka-band signal translation without band switching. |
| Conversion Loss | 10 dB (typ) - defines RF-to-IF power attenuation; impacts system noise figure and gain budget in receiver chains. |
| Input IP3 | 21 dBm (typ) - indicates strong linearity for handling high-power interferers in dense RF environments. |
| LO–RF Isolation | 39 dB (typ) - minimizes LO leakage into antenna paths, reducing spurious emissions and self-jamming risk. |
| P1dB | 12 dBm (typ) - sets maximum usable input power before compression; critical for dynamic range planning. |
| Package Size | 1.290 mm × 0.880 mm × 0.102 mm - ultra-compact die format requiring wire-bond assembly onto alumina substrates. |
Pinout & Package
The HMC773A-SX is supplied as a bare die in C-6-12 package (θJC = 225°C/W), intended for eutectic or conductive epoxy mounting directly to RF ground planes, with 50 Ω microstrip routing on 0.127 mm alumina substrates.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1, 3, 5, Die Bottom | GND | RF/dc ground reference; all must be bonded to low-inductance ground plane for balun integrity and isolation. |
| 2 | LO | 50 Ω dc-coupled local oscillator input; accepts ≥13 dBm drive; internal AC coupling eliminates external blocking cap. |
| 4 | RF | 50 Ω dc-coupled radio frequency port; matched for direct microstrip connection; no external tuning needed. |
| 6 | IF | dc-coupled intermediate frequency output; supports dc–10 GHz; external series capacitor required if dc blocking is needed. |
Key Features
| Feature | Design Value |
|---|---|
| Double-balanced architecture | Enables high LO–RF and LO–IF isolation (>39 dB / >33 dB) without external baluns or transformers. |
| No DC bias required | Reduces system complexity and power supply overhead; eliminates bias network parasitics at mmWave frequencies. |
| Wide IF bandwidth (dc–10 GHz) | Supports baseband through Q-band IF processing, enabling flexible receiver architectures and wide instantaneous bandwidth. |
| High input linearity (IP3 = 21 dBm) | Permits operation in spectrally crowded environments such as military comms and radar EW systems. |
| Millimeter-wave optimized layout | Dedicated 0.102 mm thin GaAs die with gold ribbon bonding compatibility for <30 GHz signal integrity. |
Applications
| Point-to-Point Radios | Test & Measurement Equipment |
|---|---|
|
Use Scenario: High-capacity backhaul links operating in 18–24 GHz licensed bands. IC Role / Device Role / Timing Role: Downconverter translating received 23 GHz RF signals to 1–3 GHz IF for digitization and demodulation. Use Value: 10 dB conversion loss and 39 dB LO–RF isolation maintain link budget margin and suppress adjacent-channel interference. |
Use Scenario: Vector network analyzer (VNA) front-end modules requiring broadband signal translation. IC Role / Device Role / Timing Role: Fundamental mixer in VNA receiver path, supporting swept LO from 6–26 GHz with fixed IF. Use Value: dc–10 GHz IF bandwidth enables real-time spectrum analysis and fast sweep rates without IF switching. |
| Military Radar Receivers | Voice/Data VSAT Terminals |
|
Use Scenario: Pulse-Doppler radar IF subsystems needing wide instantaneous bandwidth and high dynamic range. IC Role / Device Role / Timing Role: Upconverter translating baseband I/Q waveforms to 10–16 GHz RF for transmit beamforming. Use Value: 21 dBm IP3 and 12 dBm P1dB support high-fidelity pulse transmission with minimal distortion. |
Use Scenario: Ku-band VSAT terminals (12.2–12.7 GHz receive, 14.0–14.5 GHz transmit) in remote connectivity systems. IC Role / Device Role / Timing Role: Dual-role mixer performing LNB downconversion (12.5 GHz → 950 MHz) and BUC upconversion (950 MHz → 14.25 GHz). Use Value: Single-component solution reduces bill-of-materials and improves phase coherence between Rx/Tx paths. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar mixer applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| HMC773ALC3B | Same die, packaged in leadless ceramic SMT (LC3B) format; includes solderable terminations and standardized footprint. | Eliminates wire bonding; suited for automated PCB assembly where die-level integration is impractical. | Select HMC773ALC3B when production volume, reflow compatibility, or reduced assembly complexity outweigh raw mmWave performance trade-offs. |
| HMC1048LP3E | Wider RF range (4–20 GHz), higher conversion loss (11.5 dB typ), lower IP3 (18 dBm typ); uses different GaAs process and balun design. | Better suited for sub-20 GHz infrastructure; lacks 20–26 GHz coverage and same level of LO–RF isolation. | Choose HMC1048LP3E only if operating exclusively below 20 GHz and requiring standard 3 mm × 3 mm QFN packaging. |
Compared with HMC773ALC3B, the HMC773A-SX offers superior RF path integrity and thermal resistance (θJC = 225°C/W vs. ~350°C/W) but demands precision wire bonding. Against HMC1048LP3E, it delivers extended upper-band coverage and 3 dB higher linearity-critical for Ka-band military and satellite systems.
Availability
HMC773A-SX is available at Aetrix Electronics and suitable for point-to-point radios, military radar receivers, and test & measurement equipment requiring stable component supply across extended temperature ranges and high-frequency reliability.
Supply support for HMC773A-SX includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Analog Devices is a global leader in high-performance analog, mixed-signal, and RF ICs, serving communications, defense, instrumentation, and industrial markets with precision signal processing solutions.
The HMC773A-SX belongs to Analog Devices' Hittite Microwave MMIC product line, engineered specifically for millimeter-wave wireless infrastructure, electronic warfare, and aerospace applications demanding broadband, high-linearity passive mixing.
FAQ
What is the operating temperature range for the HMC773A-SX?
The HMC773A-SX is rated for operation from −55°C to +85°C ambient temperature, with channel temperature limited to 175°C. Its performance specifications-including conversion loss, IP3, and isolation-are guaranteed across this full range when mounted per recommended eutectic or conductive epoxy techniques on thermally optimized substrates. The HMC773A-SX maintains stable RF behavior under thermal cycling typical of airborne and outdoor base station deployments.
Does the HMC773A-SX require DC bias or external matching components?
No, the HMC773A-SX is a fully passive double-balanced mixer and requires no DC bias voltage or current. Its LO and RF ports are internally 50 Ω dc-coupled, eliminating the need for external DC blocking capacitors or impedance-matching networks. This simplifies system design and preserves signal integrity at mmWave frequencies where parasitic effects dominate. The HMC773A-SX functions immediately upon proper RF/LO/IF interconnection.
What LO drive level is required for optimal performance of the HMC773A-SX?
The HMC773A-SX is characterized and optimized for LO drive levels of 13 dBm or greater. At 13 dBm, it achieves its specified conversion loss (10 dB typ), IP3 (21 dBm typ), and isolation (LO–RF ≥39 dB). Lower LO drive degrades conversion efficiency and increases noise figure; exceeding 21 dBm risks permanent damage per absolute maximum ratings. The HMC773A-SX's robust LO drive tolerance supports integration with commercial LO synthesizers without amplification stages.
Can the HMC773A-SX be used for both upconversion and downconversion?
Yes, the HMC773A-SX is a bidirectional fundamental mixer capable of both upconversion (IF → RF) and downconversion (RF → IF) across its full 6–26 GHz RF/LO range. Application notes and performance curves in the datasheet validate operation in both modes with upper and lower sidebands. Its symmetric double-balanced architecture ensures consistent linearity and isolation regardless of signal flow direction-making the HMC773A-SX ideal for TDD transceivers and reconfigurable test instruments.
What is the recommended mounting method for the HMC773A-SX die?
The HMC773A-SX die must be mounted eutectically or with conductive epoxy directly onto a low-impedance RF ground plane. Signal routing requires 50 Ω microstrip lines on 0.127 mm thick alumina thin-film substrates, with gold ribbon wire bonding to LO, RF, and IF pads. Die thickness (0.102 mm) and thermal resistance (θJC = 225°C/W) demand precise thermal interface control-any deviation from the mounting guidelines in Analog Devices' AN-1327 will degrade isolation and power handling. The HMC773A-SX is not compatible with standard SMT reflow processes.
HMC773A-SX Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Analog Devices Inc.
- Series:
- -
- Package/Case:
- Die
- Packaging:
- Tray
- Product Status:
- Active
- RF Type:
- General Purpose
- Frequency:
- 6GHz ~ 26GHz
- Number of Mixers:
- 1
- Gain:
- -
- Noise Figure:
- 10dB
- Secondary Attributes:
- Up/Down Converter
- Current - Supply:
- -
- Voltage - Supply:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- Die
HMC773A-SX FAQ
1.How can I place an order for HMC773A-SX through Aetrix?
Please submit a Request for Quotation (RFQ) for HMC773A-SX on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for HMC773A-SX reliable?
The price and inventory of HMC773A-SX are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for HMC773A-SX is usually 5 days.
3.What payment methods are accepted for HMC773A-SX?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for HMC773A-SX transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for HMC773A-SX?
HMC773A-SX orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your HMC773A-SX order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for HMC773A-SX?
For technical support, including HMC773A-SX datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your HMC773A-SX requirements.
6.How does Aetrix verify that HMC773A-SX is sourced from the original manufacturer or authorized distributors?
All HMC773A-SX products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that HMC773A-SX meets industry standards.
7.What is the process for return or replacement of HMC773A-SX?
All HMC773A-SX units undergo pre-shipment inspection (PSI). If there is an issue with HMC773A-SX, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The HMC773A-SX part is unused and in its original packaging.
Return procedure for HMC773A-SX:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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