Analog Devices Inc. HMC773LC3B
- Part No.:
- HMC773LC3B
- Manufacturer:
- Analog Devices Inc.
- Category:
- RF Mixers
- Package:
- 12-VFCQFN Exposed Pad
- Datasheet:
-
HMC773LC3B.pdf
- Description:
- IC MIXER 6-26GHZ DUAL 12-QFN
- Quantity:
- Payment:

- Shipping:

Inventory:2,694
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
HMC773LC3B from Analog Devices (formerly Hittite Microwave) is a GaAs MMIC double-balanced passive mixer operating from 6 to 26 GHz RF/LO and DC–8 GHz IF, delivering +22 dBm input IP3, 38 dB LO/RF isolation, and 9–11 dB conversion loss - ideal for microwave up/downconversion in point-to-point radios and test equipment.
For engineers reviewing the HMC773LC3B datasheet, HMC773LC3B pinout, HMC773LC3B application, or HMC773LC3B equivalent, key selection criteria include its 12-lead 3×3 mm ceramic SMT package, no-DC-bias operation, wide IF bandwidth, and verified performance at +13 dBm LO drive across full RF band.
Technical Context
The HMC773LC3B employs optimized on-chip balun structures to achieve high LO-to-RF and LO-to-IF suppression without external matching components. It functions as both upconverter and downconverter with no DC bias required and supports operation from –40°C to +85°C ambient.
Its passive architecture eliminates active devices, enabling broadband RF/LO coverage (6–26 GHz) and wide IF response (DC–8 GHz), while maintaining consistent conversion loss and isolation across temperature and LO drive levels (+13 dBm typical).
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| RF/LO Frequency Range | 6–26 GHz - enables single device coverage of Ka-band and extended X/Ku-band systems without band switching. |
| IF Bandwidth | DC–8 GHz - supports baseband, low-IF, and high-IF architectures including zero-IF receivers and wideband modulators. |
| Conversion Loss | 9–11 dB (typ.) - defines signal attenuation between RF and IF ports; impacts system noise figure and gain budget. |
| Input IP3 | +22 dBm (typ.) - indicates strong linearity for handling multi-tone signals in crowded spectral environments. |
| LO/RF Isolation | 37–39 dB (typ.) - minimizes LO leakage into antenna paths, reducing spurious emissions and receiver desensitization. |
| Package | 12-lead 3×3 mm ceramic SMT - RoHS-compliant, MSL3 rated, with exposed ground paddle for thermal and RF grounding. |
| Operating Temp | –40°C to +85°C - qualified for outdoor wireless infrastructure and military-grade environmental operation. |
Pinout & Package
12-lead leadless ceramic package (3×3 mm body, alumina substrate, gold-over-nickel plating); ground paddle must be soldered to PCB RF ground per datasheet layout guidelines.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1, 3, 7, 9, 10, 12 | GND | RF/DC ground terminals; require low-inductance connection to PCB ground plane and exposed paddle. |
| 2 | LO | AC-coupled 50 Ω matched port; accepts +13 dBm nominal LO drive without external tuning. |
| 5 | IF | DC-coupled output; supports DC–8 GHz but limited to ±2 mA current to prevent damage or non-function. |
| 8 | RF | AC-coupled 50 Ω matched port; operates bidirectionally for up/downconversion with no external components. |
| 4, 6, 11 | N/C | No internal connection; measured data assumes external grounding to maintain RF return path integrity. |
Key Features
| Feature | Design Value |
|---|---|
| No DC bias required | Enables simplified power architecture - eliminates bias tees, regulators, and associated noise sources in RF signal chains. |
| Wide IF bandwidth (DC–8 GHz) | Supports direct-conversion receivers, wideband digitization, and flexible IF filtering without external AC coupling constraints. |
| High LO/RF isolation (37–39 dB) | Reduces need for external LO filtering and improves transmitter spectral purity in full-duplex or TDD systems. |
| Passive double-balanced topology | Provides inherent rejection of even-order harmonics and common-mode LO/RF feedthrough, lowering system-level calibration burden. |
| RoHS-compliant 3×3 mm SMT package | Enables automated assembly and high-density RF layout; MSL3 rating ensures compatibility with standard reflow profiles. |
Applications
| Point-to-Point Radios | Test & Measurement Equipment |
|---|---|
Use Scenario: High-capacity licensed microwave backhaul links operating in 13–26 GHz bands requiring stable, low-distortion frequency translation. IC Role / Device Role / Timing Role: Downconverter translating received RF signal to intermediate frequency for demodulation and digital processing. Use Value: +22 dBm IP3 and 38 dB LO/RF isolation minimize adjacent-channel interference and improve EVM under multi-carrier conditions. |
Use Scenario: Vector network analyzers and spectrum analyzers needing broadband, repeatable mixing performance across multiple frequency bands. IC Role / Device Role / Timing Role: Fundamental mixer in first downconversion stage, accepting wide RF input and delivering clean IF output to ADC front-end. Use Value: DC–8 GHz IF bandwidth supports real-time analysis of modulated signals without IF switching or reconfiguration. |
| VSAT Terminals | Military Communications |
Use Scenario: Outdoor satellite terminal transceivers operating in 12–18 GHz receive and 14–14.5 GHz transmit bands with stringent size and reliability requirements. IC Role / Device Role / Timing Role: Dual-role upconverter (Tx) and downconverter (Rx) sharing same LO source in FDD architecture. Use Value: Single-device 6–26 GHz coverage reduces BOM count and simplifies thermal management in compact radome-mounted assemblies. |
Use Scenario: EW, SIGINT, and secure tactical radios requiring operation across multiple threat bands with high dynamic range and temperature resilience. IC Role / Device Role / Timing Role: Front-end mixer in channelized receiver subsystem, handling jamming-resistant wideband signal acquisition. Use Value: –40°C to +85°C qualification and robust passive design ensure reliable operation in uncontrolled environmental deployments. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar passive mixer applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| HMC1048LP3E | Wider RF range (4–20 GHz), higher conversion loss (11–13 dB), lower IP3 (+19 dBm), same 3×3 mm package. | Better suited for sub-6 GHz legacy radar and narrowband comms where LO drive margin is constrained. | Select when lower-frequency coverage and reduced LO power sensitivity outweigh need for Ka-band extension. |
| QPC1006 | Higher frequency range (10–40 GHz), higher conversion loss (10–12 dB), lower IP3 (+18 dBm), 3×3 mm QFN package with different pinout. | Targets millimeter-wave 5G FR2 and satellite payloads requiring >26 GHz operation. | Choose only if system requires >26 GHz RF support and can accommodate revised layout and thermal interface. |
Compared with HMC773LC3B, HMC1048LP3E trades Ka-band reach for improved low-band linearity and drive flexibility, while QPC1006 extends upper frequency limit at cost of linearity and introduces mechanical redesign due to non-identical pin mapping and thermal pad configuration.
Availability
HMC773LC3B is available at Aetrix Electronics and suitable for point-to-point radios, test equipment, and military communications requiring stable component supply, long-term lifecycle support, and traceable sourcing for production programs.
Supply support for HMC773LC3B includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Analog Devices acquired Hittite Microwave in 2014 and integrates its high-frequency RF portfolio into precision analog and RF solutions for communications, defense, and instrumentation markets.
The HMC773LC3B belongs to Hittite's GaAs MMIC fundamental mixer product line, designed specifically for broadband microwave systems requiring high isolation, wide IF bandwidth, and surface-mount manufacturability without external bias or matching.
FAQ
What is the recommended LO drive level for optimal performance of the HMC773LC3B?
The HMC773LC3B achieves best conversion loss, IP3, and isolation at +13 dBm LO drive, as specified in the datasheet. Performance remains stable from +11 dBm to +15 dBm, but below +11 dBm increases conversion loss and degrades linearity. Exceeding +21 dBm absolute maximum risks permanent damage. The HMC773LC3B does not require DC bias, simplifying LO driver design.
Can the HMC773LC3B be used for zero-IF (direct-conversion) receiver applications?
Yes - the HMC773LC3B supports DC-coupled IF operation up to 8 GHz, making it suitable for zero-IF architectures. Its IF port (Pin 5) must not source or sink more than ±2 mA to avoid malfunction. For true DC operation, ensure baseband circuitry complies with this current limit; otherwise, use external series capacitors for AC coupling above ~100 kHz.
Does the HMC773LC3B require external matching components or filters?
No - the HMC773LC3B is fully matched to 50 Ω on RF and LO ports and requires no external matching networks, baluns, or bias tees. Its integrated balun structure provides inherent balance and isolation. However, external DC blocking on IF may be needed depending on system DC requirements, and grounding of N/C pins is recommended per layout guidelines.
What is the thermal management requirement for continuous operation of the HMC773LC3B?
The HMC773LC3B has a junction-to-ground-paddle thermal resistance of 170 °C/W. At maximum dissipation (210 mW at +85°C ambient), proper soldering of the exposed ground paddle to a thermally robust PCB ground plane with multiple vias is mandatory. Derating begins above +85°C ambient at 3.3 mW/°C; operation beyond +85°C requires heatsinking or airflow per application-specific thermal modeling.
Is the HMC773LC3B pin-compatible with other Hittite mixer variants like HMC773LC3TR?
Yes - HMC773LC3B and HMC773LC3TR share identical 12-lead 3×3 mm ceramic package, pinout, and electrical specifications. The "B" suffix denotes tape-and-reel packaging; "TR" is an alternate reel designation. Both are functionally and mechanically interchangeable with no PCB changes required, supporting drop-in replacement in production and prototyping.
HMC773LC3B Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Analog Devices Inc.
- Series:
- -
- Package/Case:
- 12-VFCQFN Exposed Pad
- Packaging:
- Strip
- Product Status:
- Obsolete
- RF Type:
- General Purpose
- Frequency:
- 6GHz ~ 26GHz
- Number of Mixers:
- 1
- Gain:
- -
- Noise Figure:
- -
- Secondary Attributes:
- Up/Down Converter
- Current - Supply:
- -
- Voltage - Supply:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 12-CSMT (3x3)
HMC773LC3B FAQ
1.How can I place an order for HMC773LC3B through Aetrix?
Please submit a Request for Quotation (RFQ) for HMC773LC3B on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for HMC773LC3B reliable?
The price and inventory of HMC773LC3B are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for HMC773LC3B is usually 5 days.
3.What payment methods are accepted for HMC773LC3B?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for HMC773LC3B transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for HMC773LC3B?
HMC773LC3B orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your HMC773LC3B order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for HMC773LC3B?
For technical support, including HMC773LC3B datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your HMC773LC3B requirements.
6.How does Aetrix verify that HMC773LC3B is sourced from the original manufacturer or authorized distributors?
All HMC773LC3B products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that HMC773LC3B meets industry standards.
7.What is the process for return or replacement of HMC773LC3B?
All HMC773LC3B units undergo pre-shipment inspection (PSI). If there is an issue with HMC773LC3B, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The HMC773LC3B part is unused and in its original packaging.
Return procedure for HMC773LC3B:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
HMC773LC3B Tags

-
MAX2671EUT+T
Analog Devices Inc./Maxim Integrated

-
ADEX-10+
Mini-Circuits

-
ADE-2+
Mini-Circuits

-
ADE-1+
Mini-Circuits

-
LT5560EDD#PBF
Analog Devices Inc.

-
LT5560EDD#TRPBF
Analog Devices Inc.

-
LTC5562IUC#TRPBF
Analog Devices Inc.

-
MAX2681EUT+T
Analog Devices Inc./Maxim Integrated

-
ADE-1ASK+
Mini-Circuits

-
ADE-1L+
Mini-Circuits

-
ADL5350ACPZ-R7
Analog Devices Inc.

-
AD608ARZ-RL
Analog Devices Inc.
Tech Hub
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…

