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Analog Devices Inc. HMC774
- Part No.:
- HMC774
- Manufacturer:
- Analog Devices Inc.
- Category:
- RF Mixers
- Package:
- Die
- Datasheet:
-
HMC774.pdf
- Description:
- IC MMIC MIXER DBL-BAL DIE
- Quantity:
- Payment:
- Shipping:
Inventory:4,872
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Product details
Overview
HMC774LC3B from Analog Devices (formerly Hittite Microwave) is a GaAs MMIC double-balanced passive mixer operating from 7–34 GHz RF/LO and DC–8 GHz IF, delivering 10–14 dB conversion loss, +22 dBm input IP3, and 35 dB LO-to-RF isolation-ideal for microwave up/downconversion in point-to-point radios and test equipment.
For engineers reviewing the HMC774LC3B datasheet, HMC774LC3B pinout, HMC774LC3B application, or HMC774LC3B equivalent, this page provides verified RF mixer specifications, thermal and isolation performance data, SMT package details, and real-world deployment context for high-frequency wireless and instrumentation designs.
Technical Context
The HMC774LC3B is a fundamental-mode, passive double-balanced mixer with integrated balun structures enabling high LO-to-RF (35 dB) and LO-to-IF (20–40 dB) suppression without external matching components. It operates optimally with LO drive ≥+15 dBm and requires no DC bias.
Its 12-lead ceramic 3×3 mm SMT package features grounded leads (pins 1,3,7,9,10,12) and exposed paddle for RF grounding, supporting surface-mount manufacturing while maintaining broadband RF performance across two frequency bands: 7–20 GHz and 20–34 GHz.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| RF/LO Frequency Range | 7–20 GHz and 20–34 GHz - supports dual-band microwave links without retuning |
| IF Bandwidth | DC to 8 GHz - enables baseband and wideband IF signal processing |
| Conversion Loss | 10–14 dB - defines signal attenuation in downconversion; impacts receiver noise figure |
| Input IP3 | +22 dBm typical - determines third-order intermodulation distortion floor in dense RF environments |
| LO-to-RF Isolation | 35 dB - minimizes LO leakage into antenna path, easing filter requirements |
| Operating Temperature | −40°C to +85°C - qualified for outdoor wireless infrastructure and military platforms |
| Package Size | 3 mm × 3 mm × 0.9 mm - compact RoHS-compliant SMT footprint compatible with automated assembly |
Pinout & Package
12-lead ceramic QFN (3×3 mm, 0.9 mm height), alumina body with gold-over-nickel plating and exposed ground paddle. All ground leads and paddle must be soldered to PCB RF ground per MSL3 reflow profile (peak 260°C).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1, 3, 7, 9, 10, 12 | GND | RF/DC ground terminals; mandatory connection to PCB ground plane for impedance control and isolation |
| 2 | LO | 50 Ω DC-coupled LO input; accepts +15 dBm nominal drive; no external bias required |
| 4, 6, 11 | N/C | No internal connection; externally grounded per evaluation board layout to maintain symmetry |
| 5 | IF | DC-coupled IF output; supports DC–8 GHz; current-limited to ±2 mA for DC operation |
| 8 | RF | 50 Ω DC-coupled RF port; matched for 7–34 GHz; used as input (downconv.) or output (upconv.) |
Key Features
| Feature | Design Value |
|---|---|
| No DC bias required | Passive architecture eliminates bias networks, reducing BOM count and layout complexity |
| Wide IF bandwidth (DC–8 GHz) | Supports zero-IF and complex IF architectures in software-defined radios and vector signal analyzers |
| High LO-to-RF isolation (35 dB) | Reduces need for external LO filtering in transceiver front-ends, lowering system insertion loss |
| Optimized balun structures | Enable balanced operation without external transformers, improving amplitude/phase balance |
| RoHS-compliant SMT package | Enables reflow-compatible assembly in high-volume microwave module production |
Applications
| Point-to-Point Radios | Test & Measurement Equipment |
|---|---|
Use Scenario: 23–26 GHz licensed backhaul link requiring low-phase-noise upconversion and high dynamic range. IC Role / Device Role / Timing Role: Downconverter (RF→IF) and upconverter (IF→RF) in full-duplex transceiver chain. Use Value: 35 dB LO-to-RF isolation prevents self-interference; +22 dBm IP3 maintains EVM under multi-tone conditions. |
Use Scenario: Vector network analyzer (VNA) receiver front-end needing broadband IF response and minimal calibration drift. IC Role / Device Role / Timing Role: Fundamental mixer in VNA IF section, translating swept RF signals to digitizable baseband. Use Value: DC–8 GHz IF bandwidth enables direct sampling of modulated waveforms without IF translation stages. |
| Military Radar Sensors | VSAT Terminals |
Use Scenario: X-band pulse-Doppler radar receiver requiring fast settling, low spurious generation, and −40°C to +85°C operation. IC Role / Device Role / Timing Role: First-stage downconverter converting RF echoes to intermediate frequency for ADC sampling. Use Value: 7–34 GHz coverage spans multiple radar bands; 45–48 dB input IP2 suppresses even-order distortion from pulsed signals. |
Use Scenario: Ka-band satellite terminal uplink stage needing reliable LO drive tolerance and thermal stability over rooftop exposure. IC Role / Device Role / Timing Role: Upconverter mixing IF baseband signals to 27.5–31 GHz transmit band. Use Value: +15 dBm optimal LO drive aligns with solid-state power amplifier output; 3×3 mm package eases thermal management in compact ODU enclosures. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar passive mixer applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| HMC1048LP3E | Wider RF range (6–40 GHz), higher conversion loss (11–15 dB), same 3×3 mm package | Better suited for millimeter-wave 5G FR2 and E-band systems beyond 34 GHz | Select when extending upper frequency beyond 34 GHz; verify LO drive compatibility (+13 dBm typical) |
| QPC1006 | Lower frequency range (2–20 GHz), lower IP3 (+19 dBm), GaN-based, higher P1dB (+15 dBm) | Preferred for high-power transmit chains where linearity at compression matters more than ultra-wide bandwidth | Choose for high-output upconverters where +21 dBm RF input rating and robustness outweigh bandwidth needs |
Compared with HMC774LC3B, HMC1048LP3E extends usable RF range but trades off conversion loss, while QPC1006 sacrifices bandwidth and IP3 for higher power handling-making HMC774LC3B optimal for balanced wideband receive sensitivity in 7–34 GHz infrastructure.
Availability
HMC774LC3B is available at Aetrix Electronics and suitable for point-to-point radios, test equipment, and military radar sensors requiring stable component supply, long-term obsolescence planning, and traceable sourcing for RF front-end modules.
Supply support for HMC774LC3B includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Analog Devices acquired Hittite Microwave in 2014, integrating its high-frequency RF portfolio into ADI's broader signal chain solutions for communications, defense, and instrumentation.
The HMC774LC3B belongs to Hittite's legacy GaAs MMIC mixer family, designed specifically for broadband microwave infrastructure demanding high isolation, wide IF bandwidth, and surface-mount manufacturability without external tuning.
FAQ
What is the recommended LO drive level for optimal performance of the HMC774LC3B?
The HMC774LC3B operates best with LO drive levels above +15 dBm, as confirmed by conversion gain vs. LO drive curves and IP3 measurements. At +15 dBm, it achieves typical conversion loss of 10–11 dB and +22 dBm input IP3. Driving below +13 dBm increases conversion loss and degrades linearity; exceeding +17 dBm yields diminishing returns and risks approaching absolute maximum ratings.
Does the HMC774LC3B require external DC blocking or biasing components?
No, the HMC774LC3B is a passive double-balanced mixer requiring no DC bias or external matching. Its LO, RF, and IF ports are all DC-coupled and internally matched to 50 Ω. For IF operation above DC, an external series capacitor may be added-but is not required-and the IF pin must not source/sink more than ±2 mA if used for true DC coupling.
Can the HMC774LC3B be used for both upconversion and downconversion?
Yes, the HMC774LC3B is bidirectional and functions identically as an upconverter (IF→RF) or downconverter (RF→IF) across its full 7–34 GHz RF/LO and DC–8 GHz IF range. Performance metrics-including conversion loss, isolation, and IP3-are specified for both configurations, with all electrical data in the datasheet measured in downconverter mode unless otherwise noted.
What is the thermal resistance and maximum channel temperature of the HMC774LC3B?
The HMC774LC3B has a thermal resistance of 343 °C/W (channel to ground paddle) and a maximum channel temperature of 150 °C. Its continuous power dissipation is rated at 189 mW at Ta = 85 °C, derating by 2.9 mW/°C above that ambient. Proper soldering of all ground leads and the exposed paddle to a thermally robust PCB ground plane is essential to maintain reliability under sustained RF operation.
Is the HMC774LC3B pin-compatible with other Hittite mixer packages like the HMC773LC3B?
No documented pin compatibility exists between HMC774LC3B and HMC773LC3B. While both use 12-lead 3×3 mm ceramic packages, their pin functions differ: HMC774LC3B assigns pins 2, 5, and 8 to LO, IF, and RF respectively, whereas HMC773LC3B uses different assignments per its datasheet. Direct substitution would require PCB redesign and is not supported by Analog Devices or legacy Hittite documentation.
HMC774 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Analog Devices Inc.
- Series:
- -
- Package/Case:
- Die
- Packaging:
- Bulk
- Product Status:
- Obsolete
- RF Type:
- VSAT
- Frequency:
- 7GHz ~ 43GHz
- Number of Mixers:
- 1
- Gain:
- -
- Noise Figure:
- -
- Secondary Attributes:
- Up/Down Converter
- Current - Supply:
- -
- Voltage - Supply:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- Die
HMC774 FAQ
1.How can I place an order for HMC774 through Aetrix?
Please submit a Request for Quotation (RFQ) for HMC774 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for HMC774 reliable?
The price and inventory of HMC774 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for HMC774 is usually 5 days.
3.What payment methods are accepted for HMC774?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for HMC774 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for HMC774?
HMC774 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your HMC774 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for HMC774?
For technical support, including HMC774 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your HMC774 requirements.
6.How does Aetrix verify that HMC774 is sourced from the original manufacturer or authorized distributors?
All HMC774 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that HMC774 meets industry standards.
7.What is the process for return or replacement of HMC774?
All HMC774 units undergo pre-shipment inspection (PSI). If there is an issue with HMC774, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The HMC774 part is unused and in its original packaging.
Return procedure for HMC774:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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