Analog Devices Inc. HMC774A
- Part No.:
- HMC774A
- Manufacturer:
- Analog Devices Inc.
- Category:
- RF Mixers
- Package:
- -
- Datasheet:
-
HMC774A.pdf
- Description:
- IC MMIC MIXER DBL-BAL
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
HMC774A from Analog Devices is a GaAs MMIC double-balanced mixer operating from 7 GHz to 40 GHz, optimized for both upconversion and downconversion with 13 dBm LO drive, 10.5–11 dB typical conversion loss, and passive operation requiring no DC bias - deployed in millimeter-wave point-to-point radios and military test equipment.
For engineers reviewing the HMC774A datasheet, HMC774A pinout, HMC774A application, or HMC774A equivalent, key selection criteria include its 7–40 GHz RF/LO bandwidth, dc–10 GHz IF range, 20 dBm typical IP3, 32–50 dB LO-to-IF isolation, and 1.38 mm × 0.81 mm bare-die package suitable for microstrip-mounted millimeter-wave systems.
Technical Context
The HMC774A implements a passive, double-balanced topology using integrated balun structures to achieve high LO-to-RF and LO-to-IF isolation across two frequency bands: 7–22 GHz and 22–40 GHz. Its performance is specified at 13 dBm LO drive with IF = 500 MHz or 10 GHz, and it supports both upper-sideband downconversion and upconversion without external matching components.
This GaAs MMIC operates over −55°C to +85°C, requires no DC bias, and delivers stable conversion loss (10.5 dB typ. @ 7–22 GHz; 11 dB typ. @ 22–40 GHz), input P1dB (11–12 dBm), and noise figure (12–13 dB) across its full band - all enabled by monolithic integration of diode quad and broadband baluns.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| RF/LO Frequency Range | 7–22 GHz and 22–40 GHz - enables dual-band millimeter-wave system design without retuning. |
| IF Frequency Range | DC to 10 GHz - supports baseband through L-band IF interfaces without external DC blocking. |
| Conversion Loss | 10.5 dB typ. (7–22 GHz); 11 dB typ. (22–40 GHz) - defines signal attenuation in mixer path; impacts receiver sensitivity and transmitter output power budget. |
| LO to IF Isolation | 32 dB typ. (7–22 GHz); 50 dB typ. (22–40 GHz) - suppresses LO leakage into IF chain, reducing filtering requirements and spurious mixing. |
| Input IP3 | 20 dBm typ. - determines third-order intermodulation distortion floor; critical for multi-carrier and high-dynamic-range applications. |
| LO Drive Level | 13 dBm - fixed optimal drive level; lower drive increases conversion loss and degrades linearity. |
| Package Type | 8-pad bare die (C-8-12), 1.38 mm × 0.81 mm × 0.102 mm - requires microstrip mounting on alumina or similar high-frequency substrate. |
Pinout & Package
Package: 8-pad GaAs MMIC bare die (CHIP), dimensions 1.38 mm × 0.81 mm × 0.102 mm, metalized backside for eutectic or conductive epoxy die attach. Requires microstrip transmission lines and gold ribbon bonding per Analog Devices assembly guidelines.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1, 3, 4, 6, 8, Die Bottom | GND | RF and DC ground reference; must be connected to low-inductance RF ground plane via multiple vias or direct metallization. |
| 2 | LO | Local oscillator input port; dc-coupled, 50 Ω matched; accepts 13 dBm drive without external matching. |
| 5 | RF | Radio frequency input/output port; dc-coupled, 50 Ω matched; used as RF input (downconverter) or RF output (upconverter). |
| 7 | IF | Intermediate frequency port; dc-coupled; supports dc–10 GHz; current limited to ±3 mA for dc operation. |
Key Features
| Feature | Design Value |
|---|---|
| Passive double-balanced architecture | Eliminates DC bias circuitry and enables operation from DC IF; reduces system component count and board space. |
| Optimized balun structures | Deliver ≥32 dB LO-to-RF and ≥32 dB LO-to-IF isolation - minimizes LO feedthrough and simplifies IF filtering. |
| Wideband 7–40 GHz operation | Covers Ka-band and extended Q-band; supports flexible frequency planning in radar, comms, and instrumentation. |
| High linearity (IP2 = 40 dBm) | Enables suppression of second-order distortion products - critical for wideband receivers and image-reject architectures. |
| Small-footprint bare die | 1.38 mm × 0.81 mm size allows dense integration in compact millimeter-wave modules and phased arrays. |
Applications
| Point-to-Point Radios | Test & Measurement Equipment |
|---|---|
|
Use Scenario: High-capacity wireless backhaul links operating in 24–38 GHz licensed bands. IC Role / Device Role / Timing Role: Downconverter translating received 28 GHz RF signals to 1–3 GHz IF for digitization and demodulation. Use Value: 11 dB typical conversion loss and 50 dB LO-to-IF isolation at 28 GHz reduce baseband noise floor and relax ADC dynamic range requirements. |
Use Scenario: Vector network analyzer (VNA) receiver front-end requiring broadband signal translation. IC Role / Device Role / Timing Role: Upconverter generating calibrated RF stimulus from synthesized IF sources across 7–40 GHz. Use Value: 20 dBm IP3 and stable 10.5–11 dB conversion loss enable accurate wideband S-parameter measurements with minimal harmonic distortion. |
| Military Radar Systems | Via-Satellite Terminals (VSAT) |
|
Use Scenario: Pulse-Doppler radar transceiver modules operating in X/Ka-band for target detection and tracking. IC Role / Device Role / Timing Role: Dual-role mixer performing both transmit upconversion (IF → RF) and receive downconversion (RF → IF) in T/R module. Use Value: −55°C to +85°C operating range and passive operation ensure reliability in harsh environmental conditions without thermal derating. |
Use Scenario: Compact Ku-band VSAT terminals for maritime and airborne broadband connectivity. IC Role / Device Role / Timing Role: Downconverter translating 12–18 GHz satellite downlink signals to L-band IF for low-loss coaxial distribution. Use Value: 1.38 mm × 0.81 mm footprint enables integration into space-constrained outdoor units while maintaining >34 dB LO-to-RF isolation to prevent local oscillator radiation. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar double-balanced mixer applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| HMC774ALC3B | Same die, packaged in surface-mount ceramic leadless chip carrier (LC3B); includes internal wire bonds and solderable terminations. | Eliminates manual die bonding; suited for PCB-based prototyping and medium-volume production where bare-die assembly is impractical. | Select HMC774ALC3B when automated SMT placement and reflow compatibility are required over custom microstrip integration. |
| QPC1006 | GaAs pHEMT-based active mixer; requires +5 V bias; 6–20 GHz RF range; 19 dBm IP3; 9.5 dB conversion gain (not loss). | Provides conversion gain instead of loss; better for low-noise receiver front-ends but limited to 20 GHz max and consumes DC power. | Select QPC1006 only if system-level gain budget permits active biasing and frequency coverage ≤20 GHz suffices. |
Compared with HMC774ALC3B, the HMC774A offers lower insertion loss and tighter thermal control in custom RF modules, while QPC1006 trades passive simplicity for gain and ease of use - making HMC774A optimal for high-frequency, high-isolation, zero-bias millimeter-wave designs.
Availability
HMC774A is available at Aetrix Electronics and suitable for point-to-point radios, military radar systems, and millimeter-wave test equipment requiring stable component supply across extended temperature ranges and high-frequency performance consistency.
Supply support for HMC774A includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Analog Devices is a global leader in high-performance analog, mixed-signal, and RF ICs, serving communications, defense, instrumentation, and industrial markets with precision signal processing solutions.
The HMC774A belongs to Analog Devices' Hittite Microwave MMIC product line, engineered specifically for millimeter-wave infrastructure and defense applications demanding wideband, high-isolation, passive mixing performance from 7–40 GHz.
FAQ
What is the recommended LO drive level for optimal performance of the HMC774A?
The HMC774A is characterized and optimized for 13 dBm LO drive across its full 7–40 GHz range. Operating below this level increases conversion loss and degrades IP3 and isolation; exceeding it risks compression or reliability issues. All datasheet specifications - including 10.5–11 dB conversion loss and 20 dBm IP3 - assume 13 dBm LO input. The HMC774A does not support variable LO drive tuning.
Does the HMC774A require DC bias or external matching components?
No, the HMC774A is a fully passive double-balanced mixer requiring no DC bias and no external matching components. Its RF, LO, and IF ports are internally matched to 50 Ω and dc-coupled. Only the IF port requires external DC blocking (via series capacitor) if operation above DC is not needed. This eliminates bias networks and simplifies layout in high-frequency designs.
What is the maximum IF bandwidth supported by the HMC774A?
The HMC774A supports an IF frequency range from DC to 10 GHz, verified by datasheet measurements showing flat conversion gain and consistent IP3 up to 10 GHz. At 10 GHz IF, conversion loss remains within 1 dB of its low-frequency value, and return loss exceeds 10 dB. This enables direct sampling of wideband IF signals without intermediate frequency translation stages.
How is the HMC774A mounted and interconnected in a PCB assembly?
The HMC774A is an 8-pad bare die (C-8-12 package) requiring microstrip transmission lines on alumina or quartz substrates. It must be eutectically or conductively epoxied to a grounded RF plane, with 3-mil gold ribbon bonds (<0.31 mm length) to RF, LO, and IF pads. Die-to-substrate spacing should be 0.076 mm, and bond pad geometry matches the 0.081 mm × 0.100–0.150 mm dimensions shown in Figure 44.
What are the absolute maximum ratings for RF and LO input power on the HMC774A?
The HMC774A has an absolute maximum RF input power of 21 dBm and LO input power of 25 dBm. Exceeding these levels risks permanent damage to the GaAs diode quad or air-bridge structures. Continuous operation should remain within the specified 11–12 dBm P1dB range; the 21/25 dBm limits apply only to short-duration transient events under controlled thermal conditions.
HMC774A Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Analog Devices Inc.
- Series:
- -
- Package/Case:
- -
- Packaging:
- Tray
- Product Status:
- Active
- RF Type:
- VSAT
- Frequency:
- 7GHz ~ 34GHz
- Number of Mixers:
- 1
- Gain:
- -
- Noise Figure:
- -
- Secondary Attributes:
- -
- Current - Supply:
- -
- Voltage - Supply:
- -
- Mounting Type:
- -
- Supplier Device Package:
- -
HMC774A FAQ
1.How can I place an order for HMC774A through Aetrix?
Please submit a Request for Quotation (RFQ) for HMC774A on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for HMC774A reliable?
The price and inventory of HMC774A are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for HMC774A is usually 5 days.
3.What payment methods are accepted for HMC774A?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for HMC774A transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for HMC774A?
HMC774A orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your HMC774A order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for HMC774A?
For technical support, including HMC774A datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your HMC774A requirements.
6.How does Aetrix verify that HMC774A is sourced from the original manufacturer or authorized distributors?
All HMC774A products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that HMC774A meets industry standards.
7.What is the process for return or replacement of HMC774A?
All HMC774A units undergo pre-shipment inspection (PSI). If there is an issue with HMC774A, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The HMC774A part is unused and in its original packaging.
Return procedure for HMC774A:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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