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Analog Devices Inc. HMC774A-SX
- Part No.:
- HMC774A-SX
- Manufacturer:
- Analog Devices Inc.
- Category:
- RF Mixers
- Package:
- Die
- Datasheet:
-
HMC774A-SX.pdf
- Description:
- MIXERS
- Quantity:
- Payment:
- Shipping:
Inventory:3,253
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Product details
Overview
HMC774A-SX from Analog Devices is a GaAs MMIC double-balanced mixer die operating from 7 GHz to 40 GHz, delivering 10.5–11 dB typical conversion loss, 32–34 dB LO-to-RF isolation, and 20 dBm IP3 across its band. It functions as both upconverter and downconverter with no external bias or matching components, deployed in millimeter-wave point-to-point radios and military test equipment.
For engineers reviewing the HMC774A-SX datasheet, HMC774A-SX pinout, HMC774A-SX application, or HMC774A-SX equivalent, key selection criteria include RF/LO frequency coverage (7–40 GHz), passive operation (no DC bias), IF bandwidth (DC–10 GHz), and bare-die mounting requirements for high-frequency microstrip integration.
Technical Context
The HMC774A-SX implements a double-balanced topology using integrated balun structures to achieve high LO-to-RF and LO-to-IF isolation-34 dB typical (7–22 GHz) and 32 dB (22–40 GHz). Its passive GaAs MMIC architecture eliminates DC biasing and enables operation with 13 dBm LO drive.
It supports both upper-sideband downconversion (RF → IF) and upconversion (IF → RF) across its full 7–40 GHz RF range, with IF port dc-coupled and rated for ≤3 mA source/sink current. Thermal resistance θJC is 274°C/W, requiring direct eutectic or conductive-epoxy mounting to a grounded RF substrate.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Frequency Range | RF: 7–40 GHz; LO: 7–40 GHz; IF: DC–10 GHz - enables mmWave transceiver architectures without band segmentation. |
| Conversion Loss | 10.5 dB (7–22 GHz), 11 dB (22–40 GHz) - defines signal path attenuation; impacts system noise figure and gain budget. |
| LO-to-RF Isolation | 34 dB (7–22 GHz), 32 dB (22–40 GHz) - suppresses LO leakage into antenna path, critical for receiver dynamic range. |
| Input IP3 | 20 dBm typical - determines third-order intermodulation handling in dense RF environments like VSATs. |
| P1dB | 11 dBm (7–22 GHz), 12 dBm (22–40 GHz) - sets usable input power ceiling before compression degrades linearity. |
| Package | 8-pad bare die (C-8-12), 1.38 mm × 0.81 mm × 0.102 mm - requires microstrip substrate mounting with <0.31 mm ribbon bonds. |
| Operating Temp | −55°C to +85°C - qualified for harsh environmental deployment in military and outdoor wireless infrastructure. |
Pinout & Package
Package: 8-pad GaAs bare die (C-8-12), 1.38 mm × 0.81 mm × 0.102 mm, metalized backside for eutectic or conductive-epoxy die attach. Requires RF microstrip routing on alumina thin-film substrates with minimal bond length.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1, 3, 4, 6, 8, Die Bottom | GND | RF/dc ground reference; must be bonded directly to substrate ground plane for impedance control and thermal dissipation. |
| 2 | LO | Local oscillator input; 50 Ω dc-coupled; accepts +13 dBm nominal drive; no external bias or matching required. |
| 5 | RF | Radio frequency port; 50 Ω dc-coupled; handles up to +21 dBm absolute max input per datasheet rating. |
| 7 | IF | Intermediate frequency output/input; dc-coupled; limited to ±3 mA current to prevent die malfunction. |
Key Features
| Feature | Design Value |
|---|---|
| Passive double-balanced architecture | Eliminates DC bias circuitry and external matching components, reducing BOM count and layout complexity in mmWave designs. |
| Optimized balun structures | Deliver ≥32 dB LO-to-RF and ≥38 dB LO-to-IF isolation, minimizing LO feedthrough in sensitive receiver front-ends. |
| DC–10 GHz IF bandwidth | Supports wideband modulation schemes (e.g., OFDM, QAM) and baseband I/Q processing without external IF filtering. |
| RoHS-compliant bare die | Meets environmental compliance for aerospace, defense, and telecom applications without lead-based solder constraints. |
| High linearity (IP2 = 40 dBm) | Enables robust operation in multi-carrier systems by suppressing second-order distortion products near band edges. |
Applications
| Point-to-Point Radios | Test Equipment & Sensors |
|---|---|
Use Scenario: High-capacity 24–38 GHz licensed backhaul links in urban and rural infrastructure. IC Role / Device Role / Timing Role: Downconverter translating 38 GHz RF to 500 MHz–5 GHz IF for digitization and demodulation. Use Value: 10.5–11 dB conversion loss and 20 dBm IP3 maintain EVM and ACLR performance under multi-tone interference. | Use Scenario: Vector network analyzer (VNA) receiver front-end for calibrated S-parameter measurement up to 40 GHz. IC Role / Device Role / Timing Role: Precision downconverter with stable LO-to-RF isolation enabling accurate amplitude/phase detection. Use Value: 34 dB LO-to-RF isolation (7–22 GHz) and 32 dB (22–40 GHz) reduce measurement uncertainty from LO leakage artifacts. |
| Military End Use | VSAT Terminals |
Use Scenario: EW/ESM receivers requiring broadband instantaneous frequency measurement across 7–40 GHz. IC Role / Device Role / Timing Role: Wideband downconverter feeding ADC with DC–10 GHz IF output for real-time spectrum analysis. Use Value: DC-coupled IF port and −55°C to +85°C operation support cold-start and high-vibration field deployment. | Use Scenario: Ka-band satellite terminal uplink/downlink transceivers in mobile or maritime platforms. IC Role / Device Role / Timing Role: Dual-mode mixer performing both upconversion (IF→RF) and downconversion (RF→IF) in shared RF chain. Use Value: Identical 7–40 GHz RF/LO coverage and 13 dBm LO drive requirement simplify dual-path LO distribution design. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar double-balanced mixer applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| HMC774ALC3B | Same die, packaged in surface-mount LC3B ceramic module; includes internal matching and hermetic sealing. | Eliminates bare-die assembly but adds 3.2 mm × 2.5 mm footprint and ~1.5 dB higher conversion loss at 40 GHz. | Select HMC774ALC3B when rapid prototyping or production volume favors SMT assembly over wire bonding. |
| QPC1006 | 7–40 GHz GaAs pHEMT mixer; 12.5 dB conversion loss; 22 dBm IP3; requires 15 dBm LO drive; 6-pin QFN package. | Higher LO drive requirement and larger package limit use in ultra-compact mmWave modules with tight thermal budgets. | Select QPC1006 only if board-level integration demands standard QFN reflow compatibility over bare-die RF performance. |
Compared with HMC774A-SX, HMC774ALC3B trades bare-die integration flexibility for simplified assembly, while QPC1006 offers QFN packaging at the cost of higher LO drive and reduced isolation-making HMC774A-SX optimal for performance-critical, space-constrained mmWave designs requiring maximum linearity and minimal external components.
Availability
HMC774A-SX is available at Aetrix Electronics and suitable for point-to-point radios, military EW receivers, and millimeter-wave test equipment requiring stable component supply across extended temperature ranges and high-frequency performance consistency.
Supply support for HMC774A-SX includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Analog Devices is a global leader in high-performance analog, mixed-signal, and RF ICs, serving communications, defense, instrumentation, and industrial markets with precision signal processing solutions.
The HMC774A-SX belongs to Analog Devices' Hittite Microwave MMIC product line, engineered specifically for broadband millimeter-wave mixing in defense radar, 5G backhaul, and satellite communication systems where passive performance, thermal stability, and wide IF bandwidth are essential.
FAQ
What is the operating temperature range for the HMC774A-SX?
The HMC774A-SX is specified for operation from −55°C to +85°C, with absolute maximum channel temperature of 175°C. This range supports deployment in outdoor wireless infrastructure, airborne systems, and military platforms where ambient conditions vary widely. Derating applies above 85°C per the 2.9 mW/°C thermal dissipation curve in the datasheet.
Does the HMC774A-SX require DC bias or external matching components?
No, the HMC774A-SX is a fully passive double-balanced mixer die and requires no DC bias or external matching components. All ports (LO, RF, IF) are internally matched to 50 Ω, and operation relies solely on proper RF substrate layout, grounding, and bond-wire integrity. This simplifies design and improves repeatability in high-frequency assemblies.
What is the maximum RF input power rating for the HMC774A-SX?
The absolute maximum RF input power for the HMC774A-SX is +21 dBm, as defined in the Absolute Maximum Ratings table. Exceeding this level risks permanent damage. For linear operation, the P1dB point is 11–12 dBm depending on frequency band, and sustained operation above P1dB degrades conversion loss and increases distortion.
How is the IF port of the HMC774A-SX configured for DC-coupled operation?
The IF port of the HMC774A-SX is dc-coupled and must not source or sink more than ±3 mA of current during operation. For true DC–10 GHz IF bandwidth, ensure the IF load presents a valid dc path with appropriate current limiting. If dc operation is unnecessary, an external series capacitor can be used to ac-couple the IF port while preserving high-frequency response.
What package type does the HMC774A-SX use, and how is it mounted?
The HMC774A-SX is supplied as an 8-pad bare die (C-8-12) measuring 1.38 mm × 0.81 mm × 0.102 mm. It must be mounted eutectically (e.g., AuSn preform at 255°C) or with conductive epoxy directly onto a grounded alumina thin-film substrate. Gold ribbon bonds (<0.31 mm length, 3 mil × 0.5 mil) connect pads 2 (LO), 5 (RF), and 7 (IF) to microstrip lines.
HMC774A-SX Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Analog Devices Inc.
- Series:
- -
- Package/Case:
- Die
- Packaging:
- Tray
- Product Status:
- Active
- RF Type:
- VSAT
- Frequency:
- 7GHz ~ 40GHz
- Number of Mixers:
- 1
- Gain:
- -
- Noise Figure:
- 12dB
- Secondary Attributes:
- Up/Down Converter
- Current - Supply:
- -
- Voltage - Supply:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- Die
HMC774A-SX FAQ
1.How can I place an order for HMC774A-SX through Aetrix?
Please submit a Request for Quotation (RFQ) for HMC774A-SX on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for HMC774A-SX reliable?
The price and inventory of HMC774A-SX are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for HMC774A-SX is usually 5 days.
3.What payment methods are accepted for HMC774A-SX?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for HMC774A-SX transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for HMC774A-SX?
HMC774A-SX orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your HMC774A-SX order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for HMC774A-SX?
For technical support, including HMC774A-SX datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your HMC774A-SX requirements.
6.How does Aetrix verify that HMC774A-SX is sourced from the original manufacturer or authorized distributors?
All HMC774A-SX products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that HMC774A-SX meets industry standards.
7.What is the process for return or replacement of HMC774A-SX?
All HMC774A-SX units undergo pre-shipment inspection (PSI). If there is an issue with HMC774A-SX, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The HMC774A-SX part is unused and in its original packaging.
Return procedure for HMC774A-SX:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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