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Analog Devices Inc. HMC774LC3B
- Part No.:
- HMC774LC3B
- Manufacturer:
- Analog Devices Inc.
- Category:
- RF Mixers
- Package:
- 12-VFCQFN Exposed Pad
- Datasheet:
-
HMC774LC3B.pdf
- Description:
- IC MMIC MIXER GAAS 12SMD
- Quantity:
- Payment:
- Shipping:
Inventory:3,867
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Product details
Overview
HMC774LC3B from Analog Devices (formerly Hittite Microwave) is a GaAs MMIC double-balanced passive mixer operating from 7 to 34 GHz RF/LO and DC–8 GHz IF, delivering 10–14 dB conversion loss, +22 dBm input IP3, and 35 dB LO-to-RF isolation - ideal for Ka-band point-to-point radio up/downconversion.
For engineers reviewing the HMC774LC3B datasheet, HMC774LC3B pinout, HMC774LC3B application, or HMC774LC3B equivalent, key selection criteria include its +15 dBm optimal LO drive level, no-DC-bias operation, 12-lead 3×3 mm ceramic SMT package, and elimination of wire bonding in surface-mount RF front-ends.
Technical Context
The HMC774LC3B employs optimized on-chip balun structures to achieve high LO-to-RF (35 dB) and LO-to-IF (20–40 dB) isolation across its full 7–34 GHz band, enabling clean spectral translation without external filtering. Its passive architecture requires no DC bias and supports both upconversion and downconversion modes.
Performance is specified at TA = +25°C with LO = +15 dBm and IF = 0.5 GHz; conversion loss varies from 10–14 dB depending on RF frequency subband (7–20 GHz vs. 20–34 GHz), while input-referred P1dB ranges from 12–13 dBm and IP2 reaches 45–48 dBm.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| RF/LO Frequency Range | 7–34 GHz - covers full Ka-band; split spec: 7–20 GHz (min 10 dB loss), 20–34 GHz (max 14 dB loss) |
| IF Bandwidth | DC–8 GHz - supports baseband through wideband IF signals without AC coupling constraints |
| Conversion Loss | 10–14 dB - defines signal attenuation in downconversion; impacts system noise figure and gain budget |
| Input IP3 | +22 dBm typical - determines third-order intermodulation distortion floor in multi-tone RF environments |
| LO-to-RF Isolation | 35 dB - minimizes LO leakage into antenna path, reducing spurious emissions and receiver desensitization |
| Operating Temperature | −40°C to +85°C - qualified for outdoor wireless infrastructure and military environmental stress |
| LO Drive Requirement | +15 dBm optimal - must be met for specified linearity and isolation; lower drive degrades IP3 and isolation |
Pinout & Package
12-lead leadless ceramic SMT package (3×3 mm, 9 mm² body), alumina substrate, gold-over-nickel plating, MSL3 rated, with exposed ground paddle requiring soldering to PCB RF ground plane.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1, 3, 7, 9, 10, 12 | GND | RF/DC ground terminals; all must be soldered to PCB ground plane and connected to exposed paddle for thermal and RF integrity |
| 2 | LO | 50 Ω DC-coupled LO input; accepts +15 dBm nominal drive; no external bias or matching required |
| 4, 6, 11 | N/C | No internal connection; externally grounded per evaluation layout to maintain RF symmetry and shielding |
| 5 | IF | DC-coupled IF output; supports DC–8 GHz; current-limited to ±2 mA to prevent damage during DC-coupled operation |
| 8 | RF | 50 Ω DC-coupled RF port; bidirectional use enables upconversion or downconversion without reconfiguration |
Key Features
| Feature | Design Value |
|---|---|
| No DC bias required | Enables simplified power architecture and eliminates bias tee insertion loss in LO/RF paths |
| Optimized balun structures | Deliver 35 dB LO-to-RF and ≥20 dB LO-to-IF isolation across full 7–34 GHz band |
| Wide IF bandwidth (DC–8 GHz) | Supports zero-IF receivers and high-speed digital IF sampling without external AC coupling |
| Leadless 3×3 mm SMT package | Eliminates wire bonding; compatible with standard reflow assembly and automated optical inspection |
| RoHS-compliant construction | Meets environmental compliance for commercial and defense supply chains without performance trade-offs |
Applications
| Point-to-Point Radios | VSAT Terminals |
|---|---|
Use Scenario: High-capacity licensed microwave links operating at 23–30 GHz with stringent EVM and adjacent-channel rejection requirements. IC Role / Device Role / Timing Role: Downconverter translating 26 GHz RF to 1–2 GHz IF for ADC digitization; also used as upconverter in transmit chain. Use Value: 35 dB LO-to-RF isolation prevents LO radiation from violating regulatory spectral masks; +22 dBm IP3 maintains linearity under multi-carrier modulation. |
Use Scenario: Ku/Ka-band satellite ground terminals requiring low-noise, high-dynamic-range signal translation in compact form factor. IC Role / Device Role / Timing Role: Double-balanced mixer in LNB and BUC assemblies, handling both receive (RF→IF) and transmit (IF→RF) paths. Use Value: DC–8 GHz IF bandwidth enables direct sampling of wide IF channels; no-DC-bias operation simplifies power supply design in remote outdoor units. |
| Test Equipment Front-Ends | Military Radar Receivers |
Use Scenario: Vector network analyzers and spectrum analyzers needing broadband, repeatable mixing performance across 7–34 GHz calibration bands. IC Role / Device Role / Timing Role: Fundamental mixer in first downconversion stage; paired with stable LO synthesizers for phase-coherent measurements. Use Value: Consistent 10–14 dB conversion loss across subbands enables accurate gain calibration; 12-lead SMT package ensures mechanical repeatability in modular test heads. |
Use Scenario: EW and radar warning receivers operating in contested RF environments with high dynamic range and jamming resilience. IC Role / Device Role / Timing Role: Front-end mixer in channelized receiver architectures, rejecting strong out-of-band interferers via inherent LO/RF isolation. Use Value: +22 dBm IP3 and 45–48 dBm IP2 suppress two-tone intermodulation from co-site transmitters; −40°C to +85°C rating supports airborne and vehicle-mounted deployment. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar double-balanced mixer applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| HMC1048LP3E | Wider RF range (6–40 GHz), higher LO drive (+17 dBm), larger 4×4 mm QFN package | Better suited for millimeter-wave test equipment requiring extended bandwidth beyond 34 GHz | Select when >34 GHz coverage or higher LO power margin is required; not drop-in due to different footprint and thermal pad |
| QPC1006 | Lower frequency (2–20 GHz), GaN-based, +30 dBm P1dB, 5×5 mm QFN | Targeted at high-power transmit mixers in 5G base stations, not low-noise receive paths | Choose only for high-P1dB transmit applications below 20 GHz; incompatible with Ka-band or DC–8 GHz IF needs of HMC774LC3B |
Compared with HMC1048LP3E and QPC1006, the HMC774LC3B uniquely balances Ka-band coverage, DC–8 GHz IF, and 3×3 mm size-making it optimal for space-constrained, wide-IF, medium-power receive/downconvert applications where LO drive is tightly controlled at +15 dBm.
Availability
HMC774LC3B is available at Aetrix Electronics and suitable for point-to-point radios, VSAT terminals, and military radar receivers requiring stable component supply, RoHS-compliant packaging, and guaranteed long-term availability in ceramic SMT format.
Supply support for HMC774LC3B includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Analog Devices acquired Hittite Microwave in 2014 and integrates its high-frequency RF portfolio into ADI's broader signal chain solutions, maintaining legacy product support and qualification rigor.
The HMC774LC3B belongs to Hittite's GaAs MMIC fundamental mixer family, designed specifically for Ka-band wireless infrastructure and defense systems demanding high isolation, wide IF bandwidth, and surface-mount manufacturability without DC bias.
FAQ
What is the recommended LO drive level for optimal performance of the HMC774LC3B?
The HMC774LC3B achieves best linearity and isolation at +15 dBm LO drive. Operating below this level reduces IP3 and LO-to-RF isolation; above +15 dBm offers diminishing returns and risks exceeding the +27 dBm absolute maximum rating. All datasheet specs assume +15 dBm LO drive at TA = +25°C and IF = 0.5 GHz, so the HMC774LC3B must be driven within ±1 dB of this level for guaranteed performance.
Can the HMC774LC3B be used for DC-coupled IF operation?
Yes, the HMC774LC3B supports true DC-coupled IF operation on Pin 5 (IF), but strict current limits apply: the IF pin must neither source nor sink more than ±2 mA. Exceeding this causes non-function or permanent damage. For AC-coupled applications above ~10 MHz, a series capacitor is recommended - the HMC774LC3B's DC–8 GHz IF bandwidth remains fully usable in either configuration.
Does the HMC774LC3B require external matching components?
No, the HMC774LC3B requires no external matching components. Its RF, LO, and IF ports are internally matched to 50 Ω and DC-coupled, eliminating baluns, bias tees, or impedance transformers. This simplifies layout and improves repeatability - a key advantage of the HMC774LC3B in high-frequency designs where parasitic sensitivity is critical.
What is the thermal management requirement for the HMC774LC3B?
The HMC774LC3B features an exposed ground paddle with 343 °C/W thermal resistance (channel-to-ground). To maintain junction temperature ≤150 °C, the paddle must be soldered to a thermally robust PCB ground plane using ≥6 vias to inner ground layers, and the assembly should be mounted to a heatsink if ambient exceeds +70°C. Continuous power dissipation is derated above +85°C ambient per the 2.9 mW/°C spec - critical for sustained HMC774LC3B reliability.
Is the HMC774LC3B pin-compatible with other Hittite mixer variants like HMC774LC3?
No, the HMC774LC3B is not pin-compatible with earlier HMC774LC3 revisions. The "B" suffix denotes a qualified revision with updated process control and screening - identical pinout and package dimensions, but distinct internal optimization for improved yield and consistency. Layout reuse is safe, but qualification data and lot traceability apply specifically to the HMC774LC3B marking.
HMC774LC3B Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Analog Devices Inc.
- Series:
- -
- Package/Case:
- 12-VFCQFN Exposed Pad
- Packaging:
- Strip
- Product Status:
- Obsolete
- RF Type:
- General Purpose
- Frequency:
- 7GHz ~ 34GHz
- Number of Mixers:
- 1
- Gain:
- -
- Noise Figure:
- -
- Secondary Attributes:
- Up/Down Converter
- Current - Supply:
- -
- Voltage - Supply:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 12-CSMT (3x3)
HMC774LC3B FAQ
1.How can I place an order for HMC774LC3B through Aetrix?
Please submit a Request for Quotation (RFQ) for HMC774LC3B on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for HMC774LC3B reliable?
The price and inventory of HMC774LC3B are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for HMC774LC3B is usually 5 days.
3.What payment methods are accepted for HMC774LC3B?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for HMC774LC3B transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for HMC774LC3B?
HMC774LC3B orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your HMC774LC3B order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for HMC774LC3B?
For technical support, including HMC774LC3B datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your HMC774LC3B requirements.
6.How does Aetrix verify that HMC774LC3B is sourced from the original manufacturer or authorized distributors?
All HMC774LC3B products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that HMC774LC3B meets industry standards.
7.What is the process for return or replacement of HMC774LC3B?
All HMC774LC3B units undergo pre-shipment inspection (PSI). If there is an issue with HMC774LC3B, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The HMC774LC3B part is unused and in its original packaging.
Return procedure for HMC774LC3B:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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