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Analog Devices Inc. HMC774-SX

Part No.:
HMC774-SX
Manufacturer:
Analog Devices Inc.
Category:
RF Mixers
Package:
Die
Datasheet:
AetrixHMC774-SX.pdf
Description:
IC MMIC MIXER DBL-BAL DIE
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:2,376

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Product details

Overview

HMC774-SX from Analog Devices (formerly Hittite Microwave) is a GaAs MMIC double-balanced mixer operating from 7 to 34 GHz RF/LO and DC–8 GHz IF, delivering 10–14 dB conversion loss, +22 dBm input IP3, and 35 dB LO/RF isolation in a 12-lead 3×3 mm ceramic SMT package. It functions as an upconverter or downconverter with no DC bias required and is used in millimeter-wave point-to-point radios and test equipment.

For engineers reviewing the HMC774-SX datasheet, HMC774-SX pinout, HMC774-SX application, or HMC774-SX equivalent, key selection criteria include RF/LO frequency coverage (7–34 GHz), IF bandwidth (DC–8 GHz), LO drive sensitivity (+15 dBm typical), passive operation, and 3×3 mm RoHS-compliant ceramic package compatibility with surface-mount assembly.

Technical Context

The HMC774-SX employs optimized on-chip balun structures to achieve high LO-to-RF (35 dB) and LO-to-IF (20–40 dB) isolation, enabling clean signal translation without external matching networks. Its passive architecture eliminates DC bias requirements and supports both upconversion and downconversion modes.

It operates across two RF/LO bands: 7–20 GHz and 20–34 GHz, with IF performance validated at 0.5 GHz. Conversion gain varies with temperature and LO drive level, and spurious output suppression (e.g., mRF ± nLO) is characterized across the full band.

Key Specifications

ParameterValue and Actual Design Meaning
RF/LO Frequency Range7–20 GHz and 20–34 GHz: supports wideband mmWave radio front-ends without band switching.
IF BandwidthDC–8 GHz: enables baseband and wideband IF processing including radar pulse detection and broadband modulation.
Conversion Loss10–14 dB: defines signal attenuation through mixing path; impacts system noise figure and dynamic range budget.
Input IP3+22 dBm (typ): determines third-order intermodulation distortion floor for multi-carrier operation.
LO/RF Isolation35 dB (min): reduces LO leakage into antenna path, easing filter requirements in transceiver designs.
Operating Temp−40°C to +85°C: qualified for outdoor wireless infrastructure and military environmental conditions.
Package12-lead 3×3 mm ceramic SMT: enables compact, repeatable RF layout with ground paddle thermal and electrical connection.

Pinout & Package

12-lead leadless ceramic package (3×3 mm, 9 mm²) with exposed ground paddle; alumina body, gold-over-nickel plating, MSL3 rating, and RoHS compliance.

Pin/TerminalCircuit RoleDesign Meaning
1, 3, 7, 9, 10, 12GNDRF/DC ground connections; must be soldered to PCB ground plane with multiple vias for low-inductance return path.
2LO50 Ω DC-coupled LO input; accepts +15 dBm drive; requires no external bias or matching.
4, 6, 11N/CNo internal connection; externally grounded per evaluation board practice to maintain RF symmetry and shielding.
5IFDC-coupled IF output; supports DC–8 GHz; limited to ±2 mA current to prevent damage or non-function.
8RF50 Ω DC-coupled RF port; matched for 7–34 GHz operation; no external tuning needed.

Key Features

FeatureDesign Value
No DC bias requiredEnables simplified power architecture and eliminates bias network design, layout area, and potential instability sources.
Double-balanced topologyProvides inherent rejection of even-order harmonics and LO feedthrough, reducing filtering burden in transceiver chains.
Wide IF bandwidth (DC–8 GHz)Supports complex modulation schemes (e.g., OFDM, QAM) and ultra-wideband radar IF processing without bandwidth limitation.
Optimized balun isolationDelivers 35 dB LO/RF and 20–40 dB LO/IF isolation, minimizing LO radiation and improving receiver blocking performance.
Leadless 3×3 mm SMT packageReduces parasitic inductance vs. wire-bonded alternatives and enables automated assembly with proven RF repeatability.

Applications

Point-to-Point RadiosTest & Measurement Equipment

Use Scenario: High-capacity backhaul links operating in E-band (60–90 GHz) or V-band (40–75 GHz) using frequency translation at intermediate stages.

IC Role / Device Role / Timing Role: Downconverter translating 24–34 GHz RF signals to 0.5–8 GHz IF for digitization and demodulation.

Use Value: Enables compact, high-linearity front-end design with no external biasing or matching components, reducing BOM count and calibration complexity.

Use Scenario: Vector network analyzer (VNA) or spectrum analyzer front-end requiring broadband signal translation and low spurious generation.

IC Role / Device Role / Timing Role: Fundamental mixer in harmonic mixing or direct-conversion receiver paths for mmWave signal analysis.

Use Value: Delivers stable conversion loss and high IP3 across 7–34 GHz, supporting accurate amplitude and phase measurement without recalibration.

Military CommunicationsVSAT Terminals

Use Scenario: Secure, jam-resistant tactical radios operating in Ka-band (26.5–40 GHz) with frequency-hopping capability.

IC Role / Device Role / Timing Role: Upconverter translating baseband or IF waveforms to RF for transmission with minimal LO leakage.

Use Value: 35 dB LO/RF isolation and −40°C to +85°C operation ensure reliable performance under field-deployed thermal and EMI stress.

Use Scenario: Satellite ground terminals requiring low-noise, high-dynamic-range signal reception in Ku-band (12–18 GHz) and Ka-band (26.5–40 GHz).

IC Role / Device Role / Timing Role: Downconverter in LNB assemblies translating satellite downlink signals to lower IF for cable distribution.

Use Value: Passive operation and wide IF bandwidth support multi-channel demodulation and simultaneous frequency band monitoring.

Equivalent & Alternatives

The following parts are listed as comparable options for similar mixer applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
HMC1048LP3EWider RF/LO range (6–40 GHz); higher conversion loss (11–15 dB); same 3×3 mm package.Better suited for 40 GHz+ systems; slightly reduced dynamic range due to higher loss.Select when extending upper frequency beyond 34 GHz is required and 1 dB higher loss is acceptable.
QPC1006Lower frequency range (5–20 GHz); integrated LO amplifier; requires +5 V bias; 4×4 mm QFN package.Enables single-supply active mixing but lacks DC–8 GHz IF bandwidth and mmWave coverage.Choose for sub-20 GHz designs needing integrated LO drive and simpler LO chain, not for 20–34 GHz operation.

Compared with HMC774-SX, HMC1048LP3E extends usable frequency but trades conversion loss, while QPC1006 adds LO amplification at the cost of frequency range and IF bandwidth-neither is pin-compatible, and each serves distinct system-level trade-offs in bias architecture, size, and band coverage.

Availability

HMC774-SX is available at Aetrix Electronics and suitable for point-to-point radios, test equipment, and military communications requiring stable component supply, long-term obsolescence management, and traceable sourcing for RF front-end production.

Supply support for HMC774-SX includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Analog Devices acquired Hittite Microwave in 2014 and integrates its high-frequency RF portfolio into precision analog and RF solutions for communications, defense, and instrumentation.

The HMC774-SX belongs to Hittite's GaAs MMIC mixer product line, designed specifically for millimeter-wave wireless infrastructure and test equipment where passive, broadband, and surface-mount performance are critical.

FAQ

What is the recommended LO drive level for optimal performance of the HMC774-SX?

The HMC774-SX achieves best conversion loss and isolation with LO drive levels of +15 dBm or higher. At +15 dBm, typical conversion loss is 10–11 dB and LO/RF isolation reaches 35 dB. Lower drive (e.g., +13 dBm) increases conversion loss by ~1 dB and reduces IP3 by ~2 dBm. The HMC774-SX does not require DC bias, so LO drive is the primary performance control parameter.

Does the HMC774-SX support DC-coupled IF operation, and what are the current limits?

Yes, the HMC774-SX IF port (Pin 5) is DC-coupled and supports operation from DC to 8 GHz. However, it must not source or sink more than ±2 mA of current; exceeding this limit risks non-function or permanent damage. For AC-coupled applications, a series capacitor sized for the lowest IF frequency should be used externally.

What thermal management is required for continuous operation of the HMC774-SX?

The HMC774-SX has a channel-to-ground thermal resistance of 343 °C/W and a max continuous dissipation of 189 mW at 85 °C ambient. To maintain reliability, the exposed ground paddle must be soldered to a thermally robust PCB ground plane with ≥6 vias (0.3 mm diameter) connecting to inner/outer ground layers. Use of an external heatsink is recommended for >150 mW average power.

Can the HMC774-SX be used as both an upconverter and downconverter, and are there performance differences?

Yes, the HMC774-SX is bidirectional and functions as both upconverter and downconverter. All published specifications-including conversion loss, IP3, and isolation-are measured in downconverter mode (RF→IF) unless otherwise noted. Upconverter performance is verified per application note AN-1181 and shows comparable loss and linearity, though LO-to-RF isolation remains identical while RF-to-IF isolation differs due to port asymmetry.

What is the absolute maximum RF/IF input power rating for the HMC774-SX?

The absolute maximum RF/IF input power for the HMC774-SX is +21 dBm. Exceeding this level risks permanent damage to the internal diode quad. This rating applies regardless of whether the device is used as an upconverter or downconverter. Operation near this limit should include thermal derating and verification of peak envelope power in modulated signals.

HMC774-SX Specifications

Product attributes
Attribute value
Manufacturer:
Analog Devices Inc.
Series:
-
Package/Case:
Die
Packaging:
Bulk
Product Status:
Obsolete
RF Type:
General Purpose
Frequency:
7GHz ~ 43GHz
Number of Mixers:
1
Gain:
-
Noise Figure:
-
Secondary Attributes:
Up/Down Converter
Current - Supply:
-
Voltage - Supply:
-
Mounting Type:
Surface Mount
Supplier Device Package:
Die

HMC774-SX FAQ

1.How can I place an order for HMC774-SX through Aetrix?

Please submit a Request for Quotation (RFQ) for HMC774-SX on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for HMC774-SX reliable?

The price and inventory of HMC774-SX are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for HMC774-SX is usually 5 days.

3.What payment methods are accepted for HMC774-SX?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for HMC774-SX transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for HMC774-SX?

HMC774-SX orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your HMC774-SX order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for HMC774-SX?

For technical support, including HMC774-SX datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your HMC774-SX requirements.

6.How does Aetrix verify that HMC774-SX is sourced from the original manufacturer or authorized distributors?

All HMC774-SX products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that HMC774-SX meets industry standards.

7.What is the process for return or replacement of HMC774-SX?

All HMC774-SX units undergo pre-shipment inspection (PSI). If there is an issue with HMC774-SX, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The HMC774-SX part is unused and in its original packaging.

Return procedure for HMC774-SX:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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