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Analog Devices Inc. HMC775LC5
- Part No.:
- HMC775LC5
- Manufacturer:
- Analog Devices Inc.
- Category:
- RF Mixers
- Package:
- 32-TFQFN Exposed Pad
- Datasheet:
-
HMC775LC5.pdf
- Description:
- IC MIXER I/O LO AMP 32SMD
- Quantity:
- Payment:
- Shipping:
Inventory:3,356
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Product details
Overview
HMC775LC5 from Analog Devices (formerly Hittite Microwave) is a GaAs MMIC I/Q mixer with integrated LO amplifier, operating from 10–16 GHz RF/LO and DC–3.5 GHz IF, delivering 25 dBm input IP3, 25 dB image rejection, and 11 dB typical conversion loss in a 32-lead 5×5 mm ceramic SMT package - used in point-to-point radio and military up/downconversion systems.
For engineers reviewing the HMC775LC5 datasheet, HMC775LC5 pinout, HMC775LC5 application, or HMC775LC5 equivalent, this page provides verified electrical specs, thermal limits, RF interface roles, surface-mount grounding requirements, and validated alternatives for high-frequency transceiver design.
Technical Context
The HMC775LC5 integrates two double-balanced GaAs MESFET mixer cells and an on-die 90° hybrid to enable image-reject downconversion or single-sideband upconversion without external hybrids. It supports both USB and LSB operation with 1 GHz or 3 GHz IF outputs.
It features an internal LO amplifier requiring only 0 dBm drive, delivers 45 dB LO-to-RF isolation and 40–45 dB RF-to-IF isolation, and operates across –40°C to +85°C with 5 V supply and 114–154 mA current draw.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| RF/LO Frequency Range | 10–16 GHz - enables full Ku-band operation in satellite and radar front-ends |
| IF Bandwidth | DC–3.5 GHz - supports baseband I/Q demodulation and wideband upconversion |
| Image Rejection | 25 dB typical - reduces adjacent-channel interference without external filtering |
| Input IP3 | +25 dBm - maintains linearity under high-signal multi-carrier conditions |
| Conversion Loss | 8–11 dB - defines signal path gain budget in receiver chain design |
| LO Drive Requirement | 0 dBm - eliminates need for external LO buffer amplifiers |
| Supply Current | 114–154 mA at +5 V - determines power rail sizing and thermal management |
Pinout & Package
32-lead 5×5 mm leadless ceramic SMT package (alumina body, gold-over-nickel plating, MSL3), with exposed ground paddle requiring soldering to PCB RF ground plane per JEDEC J-STD-020.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1–4, 8–12, 15–17, 21–29, 31, 32 | N/C | No connection required; may be grounded without performance impact |
| 5, 7, 18, 20 | GND | RF/DC ground terminals - must connect to PCB ground plane with low-inductance vias |
| 6 | LO | 50 Ω AC-coupled input - accepts 0 dBm LO drive directly |
| 13 | IF1 | DC-coupled I-channel output - supports DC–3.5 GHz; max ±3 mA DC current |
| 14 | IF2 | DC-coupled Q-channel output - matches IF1 for quadrature integrity |
| 19 | RF | 50 Ω AC-coupled RF port - handles 10–16 GHz signals with 45 dB LO-to-RF isolation |
| 30 | Vdd | +5 V supply for integrated LO amplifier - requires local 4.7 µF tantalum bypass |
Key Features
| Feature | Design Value |
|---|---|
| Integrated LO amplifier | Eliminates external driver stage, reducing BOM count and layout area in Ku-band radios |
| On-die 90° hybrid | Enables true I/Q mixing without discrete hybrid couplers or microstrip phase shifts |
| DC–3.5 GHz IF bandwidth | Supports zero-IF and low-IF architectures with direct sampling ADCs or analog baseband processing |
| 25 dB image rejection | Reduces image filter order and insertion loss in IRM-based receivers |
| 32-lead 5×5 mm SMT package | Enables automated assembly and compact RF module integration vs. hybrid assemblies |
Applications
| Point-to-Point Radio | Digital Microwave Radio |
|---|---|
Use Scenario: High-capacity backhaul links operating in 11–15 GHz licensed bands with stringent EVM and ACLR requirements. IC Role / Device Role / Timing Role: I/Q downconverter in receiver front-end and SSB upconverter in transmitter path. Use Value: 25 dB image rejection and +25 dBm IP3 maintain signal fidelity under co-channel interferers and multi-carrier loading. |
Use Scenario: Compact outdoor unit (ODU) for enterprise wireless infrastructure requiring low SWaP-C. IC Role / Device Role / Timing Role: Single-chip I/Q mixer replacing hybrid IRM assemblies to reduce size and assembly cost. Use Value: 5×5 mm SMT footprint and no wire bonding enable high-yield reflow assembly and thermal reliability. |
| VSAT Terminals | Military SATCOM Terminals |
Use Scenario: Receive-only VSAT terminals operating at 12.2–12.7 GHz downlink with DC-coupled I/Q outputs. IC Role / Device Role / Timing Role: Image-reject mixer converting Ku-band RF to baseband I/Q for digital demodulation. Use Value: DC–3.5 GHz IF bandwidth allows direct connection to high-speed ADCs without IF amplification stages. |
Use Scenario: Tactical SATCOM transceivers requiring operation across –40°C to +85°C with MIL-STD-883 screening. IC Role / Device Role / Timing Role: Radiation-tolerant GaAs MMIC mixer used in secure uplink/downlink paths. Use Value: 175°C channel temperature rating and Class 1A ESD protection support ruggedized field deployment. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar I/Q mixer applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| HMC8192LP5E | Wider RF range (6–26 GHz), higher image rejection (30 dB), no integrated LO amp - requires external LO driver | Better suited for multi-band test equipment; less suitable for space-constrained radios needing integrated drive | Select when wider frequency coverage and higher image rejection outweigh added LO driver complexity |
| ADMV1013ACPZ | SiGe BiCMOS process, integrated LO synthesizer and VCO, 10–16 GHz RF, but larger 7×7 mm package and higher power consumption | Targets fully integrated transceivers; not drop-in due to different pinout, biasing, and control interface | Select when system-level integration (LO generation + mixing) is prioritized over minimal footprint and low power |
Compared with HMC775LC5, HMC8192LP5E offers broader frequency coverage and improved image rejection but increases bill-of-materials and layout complexity, while ADMV1013ACPZ trades compactness and efficiency for on-chip LO synthesis - making HMC775LC5 optimal for fixed-band, size-sensitive Ku-band radios.
Availability
HMC775LC5 is available at Aetrix Electronics and suitable for point-to-point radio, VSAT terminal, and military SATCOM applications requiring stable component supply, long-lifecycle support, and traceable sourcing for defense and aerospace programs.
Supply support for HMC775LC5 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Analog Devices acquired Hittite Microwave in 2014 and continues its high-frequency RF IC portfolio, specializing in GaAs, SiGe, and RF SOI solutions for communications, defense, and instrumentation.
The HMC775LC5 belongs to Hittite's legacy MMIC mixer product line, designed specifically for compact, high-performance Ku-band transceivers where integration, size, and image rejection are critical.
FAQ
What is the operating temperature range for the HMC775LC5?
The HMC775LC5 operates from –40°C to +85°C ambient temperature, with absolute maximum channel temperature rated at 175°C. Its GaAs MESFET process and ceramic package ensure stable RF performance across this range, validated by conversion gain, P1dB, and IP3 curves versus temperature in the datasheet. Thermal resistance is 80°C/W from channel to ground paddle, requiring proper PCB thermal via design for sustained +85°C operation.
Does the HMC775LC5 require external LO amplification?
No, the HMC775LC5 does not require external LO amplification - it integrates an LO amplifier optimized for 0 dBm input drive, enabling direct connection from low-power LO sources. This eliminates external driver stages, reduces board area, and improves amplitude/phase matching between I/Q paths. Exceeding +10 dBm LO input risks damage per absolute maximum ratings.
Can the HMC775LC5 be used for both upconversion and downconversion?
Yes, the HMC775LC5 supports both upconversion and downconversion: as an image-reject downconverter (IRM) or single-sideband upconverter (SSBU). Its symmetrical I/Q architecture and DC–3.5 GHz IF bandwidth allow flexible use in either direction - confirmed by separate characterization data for USB/LSB upconversion at 1 GHz and 3 GHz IF, and downconversion with external IF hybrid.
What are the grounding requirements for the HMC775LC5 package?
The HMC775LC5 requires all GND pins (5, 7, 18, 20) and the exposed bottom paddle to be soldered to a solid RF ground plane using multiple low-inductance vias. The datasheet mandates this for optimal isolation (LO-to-RF >45 dB) and thermal dissipation (1.1 W max at 85°C). N/C pins may be grounded but are not required - grounding them does not degrade RF performance.
Is the HMC775LC5 still in active production?
The HMC775LC5 is marked OBSOLETE in official documentation, but Aetrix Electronics maintains inventory and supply-chain continuity support for legacy designs. It remains suitable for repair, sustainment, and long-life-cycle programs where form-fit-function replacement is required, with full traceability and extended availability coordination available upon request.
HMC775LC5 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Analog Devices Inc.
- Series:
- -
- Package/Case:
- 32-TFQFN Exposed Pad
- Packaging:
- Bulk
- Product Status:
- Obsolete
- RF Type:
- General Purpose
- Frequency:
- 10GHz ~ 16GHz
- Number of Mixers:
- 2
- Gain:
- -
- Noise Figure:
- -
- Secondary Attributes:
- Up Converter
- Current - Supply:
- -
- Voltage - Supply:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 32-QFN (5x5)
HMC775LC5 FAQ
1.How can I place an order for HMC775LC5 through Aetrix?
Please submit a Request for Quotation (RFQ) for HMC775LC5 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for HMC775LC5 reliable?
The price and inventory of HMC775LC5 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for HMC775LC5 is usually 5 days.
3.What payment methods are accepted for HMC775LC5?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for HMC775LC5 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for HMC775LC5?
HMC775LC5 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your HMC775LC5 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for HMC775LC5?
For technical support, including HMC775LC5 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your HMC775LC5 requirements.
6.How does Aetrix verify that HMC775LC5 is sourced from the original manufacturer or authorized distributors?
All HMC775LC5 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that HMC775LC5 meets industry standards.
7.What is the process for return or replacement of HMC775LC5?
All HMC775LC5 units undergo pre-shipment inspection (PSI). If there is an issue with HMC775LC5, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The HMC775LC5 part is unused and in its original packaging.
Return procedure for HMC775LC5:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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