Analog Devices Inc. HMC7810ALC3

Overview

HMC7810ALC3 from Analog Devices is a differential-input/differential-output optical modulator driver IC with integrated analog attenuator and output peak detector, supporting up to 32.0 Gbps NRZ data rates, 28 GHz bandwidth, and 4.4 V_p-p differential output swing at 32 Gbps with VCTL = −1.5 V - designed for driving InP Mach-Zehnder or silicon photonics modulators in 400G/100G pluggable optical modules.

For engineers reviewing the HMC7810ALC3 datasheet, HMC7810ALC3 pinout, HMC7810ALC3 application, or HMC7810ALC3 equivalent, key selection considerations include its adjustable gain via VCTL (−1.5 V to 0 V), self-biased operation eliminating power sequencing, integrated VDET/VREF-based AGC interface, 16-terminal 2.9 mm × 2.9 mm LCC package, and compatibility with compact external bias tees for optical interconnect systems.

Technical Context

The HMC7810ALC3 implements a broadband linear amplifier architecture with fully differential signal path, no internal bias sequencing logic, and dual external supply rails (VDD = 3.3 V; VDD_EXTP/VDD_EXTN = 2.5 V or 3.3 V) enabling trade-offs between jitter (350 fs RMS at 2.5 V) and output swing (4.4 V_p-p at 3.3 V). Its analog attenuation control (VCTL) directly modulates small-signal gain from 4 dB to 18 dB over 1 MHz–28 GHz.

Integrated peak detection uses VDET and VREF outputs to generate VPEAK = VDET − VREF, a voltage linearly proportional to differential output swing (e.g., 4.5 V_p-p → ~3.0 V VPEAK), enabling closed-loop automatic gain control without external RF detectors. Input and output impedances are matched to 100 Ω differential / 50 Ω single-ended, with return loss ≥10 dB across 1–30 GHz depending on VCTL setting.

Key Specifications

Pinout & Package

Package: 16-terminal, 2.9 mm × 2.9 mm leadless chip carrier (LCC), exposed thermal pad (EPAD) requiring connection to GND per JEDEC E-16-1 standard.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar optical modulator driver applications.

Compared with HMC7810ALC3, HMC981LP3E offers higher bandwidth but lacks integrated AGC capability, increasing system complexity; LMH5401RTVT reduces component count via integrated bias tee but sacrifices both bandwidth and programmable gain - making HMC7810ALC3 the optimal choice for production 100G/400G modules requiring calibrated, adaptive drive performance.

Availability

HMC7810ALC3 is available at Aetrix Electronics and suitable for 400G CFP2 transceivers, 100G DP-QPSK metro modules, and broadband test instrumentation requiring stable component supply, RoHS compliance, and guaranteed long-term availability through 2030.

Supply support for HMC7810ALC3 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Analog Devices is a global leader in high-performance analog, mixed-signal, and RF ICs, serving precision instrumentation, communications, and industrial markets since 1965.

The HMC7810ALC3 belongs to Analog Devices' Hittite Microwave product line, engineered specifically for high-speed optical interconnect applications demanding low jitter, wide bandwidth, and integrated control features in compact packages.

FAQ

What is the maximum data rate supported by the HMC7810ALC3?

The HMC7810ALC3 supports a maximum data rate of 32.0 Gbps using nonreturn-to-zero (NRZ) encoding with a pseudorandom binary sequence (PRBS31). This specification is validated under typical conditions at 25°C with VDD = 3.3 V and VDD_EXTP/VDD_EXTN = 2.5 V or 3.3 V. The HMC7810ALC3 maintains signal integrity at this rate with 13 ps rise/fall times and ≤3 ps deterministic jitter, making it suitable for 400G and 100G optical standards.

Does the HMC7810ALC3 require external power supply sequencing?

No, the HMC7810ALC3 is self-biased and does not require power supply sequencing. It operates reliably with simultaneous application of VDD = 3.3 V and VDD_EXTP/VDD_EXTN = 2.5 V or 3.3 V. This eliminates the need for complex power management ICs or timing controllers in optical module designs, simplifying system architecture and improving startup robustness - a key advantage confirmed in the HMC7810ALC3 datasheet Rev. A, Page 10.

How is automatic gain control implemented using the HMC7810ALC3?

Automatic gain control (AGC) is implemented using the HMC7810ALC3's integrated peak detector: VPEAK = VDET − VREF provides a DC voltage linearly proportional to the differential output swing. This voltage is fed into an external analog or digital controller that adjusts the VCTL pin (−1.5 V to 0 V) to maintain constant output amplitude. The HMC7810ALC3 datasheet Figure 17 shows a complete AGC loop schematic, confirming this method enables real-time compensation for temperature and aging effects without external RF detectors.

What package type and thermal characteristics does the HMC7810ALC3 use?

The HMC7810ALC3 uses a 16-terminal leadless ceramic chip carrier (LCC) package, 2.9 mm × 2.9 mm, with an exposed thermal pad (EPAD) that must be soldered to PCB ground. Its thermal resistance is θJA = 53 °C/W and θJC = 51 °C/W (JEDEC 2S2P board), enabling operation from −40°C to +130°C ambient. The exposed pad is essential for meeting the 175°C maximum junction temperature limit under full 0.5 W power dissipation - specified in the HMC7810ALC3 datasheet Absolute Maximum Ratings table.

Can the HMC7810ALC3 drive both InP Mach-Zehnder and silicon photonics modulators?

Yes, the HMC7810ALC3 is explicitly qualified to drive both indium phosphide (InP) Mach-Zehnder modulators and silicon photonics modulators, as stated in the General Description (Page 1) and Applications (Page 1) sections of the HMC7810ALC3 datasheet. Its 4.4 V_p-p differential output swing, 28 GHz bandwidth, and low THD (<3% at 4 V_p-p) meet the stringent linearity and drive strength requirements of both technologies in data center interconnect and co-packaged optics applications.