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Analog Devices Inc. HMC7810ALC3TR

Part No.:
HMC7810ALC3TR
Manufacturer:
Analog Devices Inc.
Category:
Laser Drivers
Package:
16-CLCC Exposed Pad
Datasheet:
AetrixHMC7810ALC3TR.pdf
Description:
IC LASER DRVR 32GBPS 3.3V 16LCC
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:1,830

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Product details

Overview

HMC7810ALC3TR from Analog Devices is a broadband differential optical modulator driver IC with integrated analog attenuator and output peak detector, supporting up to 32.0 Gbps NRZ data rates, 28 GHz bandwidth, and 4.4 Vp-p differential output swing. It drives InP Mach-Zehnder or silicon photonics modulators in high-speed data center interconnects.

For engineers reviewing the HMC7810ALC3TR datasheet, HMC7810ALC3TR pinout, HMC7810ALC3TR application, or HMC7810ALC3TR equivalent, key selection criteria include gain adjustability via VCTL (−1.5 V to 0 V), self-biased operation without power sequencing, low additive jitter (350 fs RMS at 2.5 V supplies), and compatibility with compact SMT bias tees for pluggable optical modules.

Technical Context

The HMC7810ALC3TR implements a self-biased, fully differential linear amplifier architecture optimized for driving high-impedance electro-optic modulators. Its internal attenuator enables precise gain control across 1 MHz–28 GHz while maintaining ±1 dB gain flatness from 1 MHz to 20 GHz.

It integrates a linear peak detector (VDET/VREF) that outputs voltage proportional to differential output swing, enabling closed-loop automatic gain control (AGC). Dual external supply rails-VDD = 3.3 V and VDD_EXTP/VDD_EXTN = 2.5 V or 3.3 V-allow trade-offs between jitter performance (2.5 V) and output swing (3.3 V).

Key Specifications

Parameter Value and Actual Design Meaning
Max Data Rate32.0 Gbps NRZ (PRBS31), enabling 400G 16-QAM and 100G DP-QPSK optical modules
Bandwidth28 GHz high-frequency cutoff, supporting full C-band optical modulation fidelity
Differential Output Swing4.4 Vp-p at VCTL = −1.5 V, sufficient to drive InP MZ modulators requiring >3 Vpp
Rise/Fall Time13 ps (20%–80%), minimizing intersymbol interference in 32 Gbps systems
Additive Jitter (RMS)350 fs at 2.5 V supplies, critical for maintaining BER < 10−12 in coherent links
Gain Adjustment Range6 dB via VCTL (−1.5 V to 0 V), enabling dynamic linearity optimization
Power Consumption0.44 W at 2.5 V external supplies, reducing thermal load in dense CFP2 modules

Pinout & Package

16-terminal, 2.9 mm × 2.9 mm leadless ceramic chip carrier (LCC) package (E-16-1) with exposed thermal pad requiring connection to GND. Package supports reflow per JEDEC Level 3 moisture sensitivity.

Pin/Terminal Circuit Role Design Meaning
1, 4, 9, 12GNDSupply ground reference; all four pins must be connected to PCB ground plane
2INNNegative differential input; AC-coupled, 50 Ω single-ended / 100 Ω differential impedance
3INPPositive differential input; AC-coupled, matched to INN for common-mode rejection >25 dB
6VCTLAnalog attenuator control voltage input (−1.5 V to 0 V); sets gain and output swing
8VCAmplitude control voltage input (0–1.5 V); fine-tunes output level independent of VCTL
10OUTPPositive differential output; requires external bias tee for DC coupling to modulator
11OUTNNegative differential output; complementary to OUTP, 100 Ω differential output impedance
13VREFReference voltage for integrated peak detector; used with VDET to compute VPEAK
15VDETDetector output voltage; difference from VREF linearly tracks output swing magnitude
16VDDMain 3.3 V supply; powers core amplifier and control circuitry
5, 7, 14NICNot internally connected; must be left floating or tied to GND per layout guidelines

Key Features

Feature Design Value
Self-biased operationEliminates external bias sequencing circuitry, simplifying power-up in hot-pluggable modules
Integrated peak detectorEnables real-time output monitoring and closed-loop AGC without external RF detectors
Dual-supply optimizationSeparate VDD (3.3 V) and VDD_EXTP/EXTN (2.5 V or 3.3 V) allow jitter vs. swing trade-off
AC-coupled I/OInput and output require external DC blocking capacitors, ensuring compatibility with standard modulator interfaces
Thermally enhanced LCCExposed pad and θJA = 53°C/W enable stable operation at +130°C junction temperature

Applications

400G Data Center Interconnect 100G Metro Pluggable Modules

Use Scenario: Driving dual-polarization quadrature phase-shift keying (DP-QPSK) Mach-Zehnder modulators in CFP2 optical transceivers for 100G long-haul links.

IC Role / Device Role / Timing Role: High-linearity broadband driver providing precisely controlled 4.4 Vp-p differential output to maintain EVM < 8% under PRBS31 stress.

Use Value: Integrated VCTL-controlled gain and peak detector enable automatic output calibration across temperature and aging, reducing system-level test time by >30%.

Use Scenario: Biasing electroabsorption modulated laser (EML) transmitters in short-reach 100G-LR4 modules operating at 25.78 Gbps per lane.

IC Role / Device Role / Timing Role: Single-ended output mode (2.2 Vp-p) with 13 ps edge rate ensures clean eye opening at 28 GHz bandwidth limit.

Use Value: Self-biasing and no power sequencing requirement simplify compliance with SFF-8472 digital diagnostics interface timing constraints.

Broadband Test Equipment Coherent Optical Transceiver Development

Use Scenario: Serving as a programmable gain stage in high-frequency bit-error-rate testers (BERTs) and vector signal analyzers.

IC Role / Device Role / Timing Role: Differential input/output architecture provides >15 dB return loss up to 20 GHz, minimizing measurement uncertainty.

Use Value: Adjustable gain (4–18 dB) and flat frequency response enable calibrated stimulus generation across 1–28 GHz without external equalization.

Use Scenario: Prototype platform for silicon photonics modulator drivers in next-generation 800G DR8 optical engines.

IC Role / Device Role / Timing Role: On-chip peak detection and VC/VCTL control interface support rapid loop tuning during photonic IC co-design validation.

Use Value: 0.44 W power at 2.5 V supplies allows integration into thermally constrained multi-channel evaluation boards without forced air cooling.

Equivalent & Alternatives

The following parts are listed as comparable options for similar optical modulator driver applications.

Alternative Part Technical Difference Application Difference Selection Advice
HMC7810LC3TRSame die, but rated for −40°C to +85°C ambient (vs. +130°C junction for HMC7810ALC3TR)Limited to commercial-grade modules; not qualified for extended industrial temperature operationSelect when thermal margin is sufficient and cost sensitivity outweighs extended temp qualification
HMC1090LP5EHigher 40 Gbps max rate, no integrated peak detector, 5× larger 5 mm × 5 mm QFN packageRequires external detector and AGC loop; better suited for lab-grade instruments than space-constrained pluggablesChoose for maximum bandwidth headroom where board area and system-level complexity are acceptable

Compared with HMC7810LC3TR and HMC1090LP5E, the HMC7810ALC3TR uniquely combines extended temperature capability (+130°C junction), integrated peak detection for autonomous AGC, and compact 2.9 mm LCC packaging-making it the only option qualified for production CFP2/CFP4 modules requiring zero-layout redesign and full thermal derating.

Availability

HMC7810ALC3TR is available at Aetrix Electronics and suitable for 400G data center interconnects, 100G metro pluggable modules, and broadband test equipment requiring stable component supply across extended temperature ranges and long production lifecycles.

Supply support for HMC7810ALC3TR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Analog Devices, Inc. is a global leader in high-performance analog, mixed-signal, and RF technologies, headquartered in Norwood, MA, with design centers worldwide and ISO 9001-certified manufacturing.

The HMC7810ALC3TR belongs to Analog Devices' Hittite Microwave RFIC product line, engineered specifically for high-speed optical communication infrastructure-including CFP, CFP2, and QSFP-DD pluggable transceivers-where linearity, jitter, and thermal robustness are non-negotiable.

FAQ

What is the maximum data rate supported by the HMC7810ALC3TR?

The HMC7810ALC3TR supports a maximum data rate of 32.0 Gbps using nonreturn-to-zero (NRZ) encoding with a pseudorandom binary sequence (PRBS31). This specification is verified under typical conditions at 25°C with 600 mVp-p differential input and VCTL = −1.5 V, making the HMC7810ALC3TR suitable for 400G 16-QAM and 100G DP-QPSK optical module designs.

Does the HMC7810ALC3TR require external power supply sequencing?

No, the HMC7810ALC3TR is self-biased and does not require power supply sequencing. It operates reliably with simultaneous application of VDD = 3.3 V and VDD_EXTP/VDD_EXTN = 2.5 V or 3.3 V. This eliminates startup timing constraints and simplifies power management in pluggable optical modules, a key advantage confirmed in the HMC7810ALC3TR datasheet Rev. A, Page 1.

How is gain adjusted on the HMC7810ALC3TR?

Gain on the HMC7810ALC3TR is adjusted via the VCTL pin, which accepts an analog control voltage from −1.5 V to 0 V. At VCTL = −1.5 V, differential-to-differential gain is maximized at 18 dB; at VCTL = 0 V, gain drops to 4 dB. This 6 dB range is confirmed in Table 1 of the HMC7810ALC3TR datasheet and enables real-time linearity optimization without changing external components.

What is the function of the VDET and VREF pins on the HMC7810ALC3TR?

VDET and VREF form the output pair of the integrated peak detector. Their voltage difference (VPEAK = VDET − VREF) is linearly proportional to the differential output swing, enabling direct readback and closed-loop automatic gain control. As shown in Figure 12 and 13 of the HMC7810ALC3TR datasheet, this feature eliminates need for external RF detectors in production optical modules.

What package type and thermal characteristics does the HMC7810ALC3TR use?

The HMC7810ALC3TR uses a 16-terminal, 2.9 mm × 2.9 mm leadless ceramic chip carrier (LCC) package (E-16-1) with an exposed thermal pad. Its thermal resistance is θJA = 53°C/W and θJC = 51°C/W, validated per JEDEC 2S2P test board. This allows continuous operation at +130°C junction temperature, as specified in the Absolute Maximum Ratings table of the HMC7810ALC3TR datasheet.

HMC7810ALC3TR Specifications

Product attributes
Attribute value
Manufacturer:
Analog Devices Inc.
Series:
-
Package/Case:
16-CLCC Exposed Pad
Packaging:
Tape & Reel (TR)
Product Status:
Obsolete
Type:
Laser Diode Driver
Data Rate:
32Gbps
Number of Channels:
1
Voltage - Supply:
3.3V
Current - Supply:
-
Current - Modulation:
-
Current - Bias:
-
Operating Temperature:
-40°C ~ 130°C
Grade:
-
Qualification:
-
Supplier Device Package:
16-LCC (2.9x2.9)
Mounting Type:
Surface Mount

HMC7810ALC3TR FAQ

1.How can I place an order for HMC7810ALC3TR through Aetrix?

Please submit a Request for Quotation (RFQ) for HMC7810ALC3TR on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for HMC7810ALC3TR reliable?

The price and inventory of HMC7810ALC3TR are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for HMC7810ALC3TR is usually 5 days.

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HMC7810ALC3TR orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your HMC7810ALC3TR order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for HMC7810ALC3TR?

For technical support, including HMC7810ALC3TR datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your HMC7810ALC3TR requirements.

6.How does Aetrix verify that HMC7810ALC3TR is sourced from the original manufacturer or authorized distributors?

All HMC7810ALC3TR products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that HMC7810ALC3TR meets industry standards.

7.What is the process for return or replacement of HMC7810ALC3TR?

All HMC7810ALC3TR units undergo pre-shipment inspection (PSI). If there is an issue with HMC7810ALC3TR, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The HMC7810ALC3TR part is unused and in its original packaging.

Return procedure for HMC7810ALC3TR:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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