Analog Devices Inc. HMC7810ALC3TR
- Part No.:
- HMC7810ALC3TR
- Manufacturer:
- Analog Devices Inc.
- Category:
- Laser Drivers
- Package:
- 16-CLCC Exposed Pad
- Datasheet:
-
HMC7810ALC3TR.pdf
- Description:
- IC LASER DRVR 32GBPS 3.3V 16LCC
- Quantity:
- Payment:

- Shipping:

Inventory:1,830
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
HMC7810ALC3TR from Analog Devices is a broadband differential optical modulator driver IC with integrated analog attenuator and output peak detector, supporting up to 32.0 Gbps NRZ data rates, 28 GHz bandwidth, and 4.4 Vp-p differential output swing. It drives InP Mach-Zehnder or silicon photonics modulators in high-speed data center interconnects.
For engineers reviewing the HMC7810ALC3TR datasheet, HMC7810ALC3TR pinout, HMC7810ALC3TR application, or HMC7810ALC3TR equivalent, key selection criteria include gain adjustability via VCTL (−1.5 V to 0 V), self-biased operation without power sequencing, low additive jitter (350 fs RMS at 2.5 V supplies), and compatibility with compact SMT bias tees for pluggable optical modules.
Technical Context
The HMC7810ALC3TR implements a self-biased, fully differential linear amplifier architecture optimized for driving high-impedance electro-optic modulators. Its internal attenuator enables precise gain control across 1 MHz–28 GHz while maintaining ±1 dB gain flatness from 1 MHz to 20 GHz.
It integrates a linear peak detector (VDET/VREF) that outputs voltage proportional to differential output swing, enabling closed-loop automatic gain control (AGC). Dual external supply rails-VDD = 3.3 V and VDD_EXTP/VDD_EXTN = 2.5 V or 3.3 V-allow trade-offs between jitter performance (2.5 V) and output swing (3.3 V).
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Max Data Rate | 32.0 Gbps NRZ (PRBS31), enabling 400G 16-QAM and 100G DP-QPSK optical modules |
| Bandwidth | 28 GHz high-frequency cutoff, supporting full C-band optical modulation fidelity |
| Differential Output Swing | 4.4 Vp-p at VCTL = −1.5 V, sufficient to drive InP MZ modulators requiring >3 Vpp |
| Rise/Fall Time | 13 ps (20%–80%), minimizing intersymbol interference in 32 Gbps systems |
| Additive Jitter (RMS) | 350 fs at 2.5 V supplies, critical for maintaining BER < 10−12 in coherent links |
| Gain Adjustment Range | 6 dB via VCTL (−1.5 V to 0 V), enabling dynamic linearity optimization |
| Power Consumption | 0.44 W at 2.5 V external supplies, reducing thermal load in dense CFP2 modules |
Pinout & Package
16-terminal, 2.9 mm × 2.9 mm leadless ceramic chip carrier (LCC) package (E-16-1) with exposed thermal pad requiring connection to GND. Package supports reflow per JEDEC Level 3 moisture sensitivity.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1, 4, 9, 12 | GND | Supply ground reference; all four pins must be connected to PCB ground plane |
| 2 | INN | Negative differential input; AC-coupled, 50 Ω single-ended / 100 Ω differential impedance |
| 3 | INP | Positive differential input; AC-coupled, matched to INN for common-mode rejection >25 dB |
| 6 | VCTL | Analog attenuator control voltage input (−1.5 V to 0 V); sets gain and output swing |
| 8 | VC | Amplitude control voltage input (0–1.5 V); fine-tunes output level independent of VCTL |
| 10 | OUTP | Positive differential output; requires external bias tee for DC coupling to modulator |
| 11 | OUTN | Negative differential output; complementary to OUTP, 100 Ω differential output impedance |
| 13 | VREF | Reference voltage for integrated peak detector; used with VDET to compute VPEAK |
| 15 | VDET | Detector output voltage; difference from VREF linearly tracks output swing magnitude |
| 16 | VDD | Main 3.3 V supply; powers core amplifier and control circuitry |
| 5, 7, 14 | NIC | Not internally connected; must be left floating or tied to GND per layout guidelines |
Key Features
| Feature | Design Value |
|---|---|
| Self-biased operation | Eliminates external bias sequencing circuitry, simplifying power-up in hot-pluggable modules |
| Integrated peak detector | Enables real-time output monitoring and closed-loop AGC without external RF detectors |
| Dual-supply optimization | Separate VDD (3.3 V) and VDD_EXTP/EXTN (2.5 V or 3.3 V) allow jitter vs. swing trade-off |
| AC-coupled I/O | Input and output require external DC blocking capacitors, ensuring compatibility with standard modulator interfaces |
| Thermally enhanced LCC | Exposed pad and θJA = 53°C/W enable stable operation at +130°C junction temperature |
Applications
| 400G Data Center Interconnect | 100G Metro Pluggable Modules |
|---|---|
Use Scenario: Driving dual-polarization quadrature phase-shift keying (DP-QPSK) Mach-Zehnder modulators in CFP2 optical transceivers for 100G long-haul links. IC Role / Device Role / Timing Role: High-linearity broadband driver providing precisely controlled 4.4 Vp-p differential output to maintain EVM < 8% under PRBS31 stress. Use Value: Integrated VCTL-controlled gain and peak detector enable automatic output calibration across temperature and aging, reducing system-level test time by >30%. |
Use Scenario: Biasing electroabsorption modulated laser (EML) transmitters in short-reach 100G-LR4 modules operating at 25.78 Gbps per lane. IC Role / Device Role / Timing Role: Single-ended output mode (2.2 Vp-p) with 13 ps edge rate ensures clean eye opening at 28 GHz bandwidth limit. Use Value: Self-biasing and no power sequencing requirement simplify compliance with SFF-8472 digital diagnostics interface timing constraints. |
| Broadband Test Equipment | Coherent Optical Transceiver Development |
Use Scenario: Serving as a programmable gain stage in high-frequency bit-error-rate testers (BERTs) and vector signal analyzers. IC Role / Device Role / Timing Role: Differential input/output architecture provides >15 dB return loss up to 20 GHz, minimizing measurement uncertainty. Use Value: Adjustable gain (4–18 dB) and flat frequency response enable calibrated stimulus generation across 1–28 GHz without external equalization. |
Use Scenario: Prototype platform for silicon photonics modulator drivers in next-generation 800G DR8 optical engines. IC Role / Device Role / Timing Role: On-chip peak detection and VC/VCTL control interface support rapid loop tuning during photonic IC co-design validation. Use Value: 0.44 W power at 2.5 V supplies allows integration into thermally constrained multi-channel evaluation boards without forced air cooling. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar optical modulator driver applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| HMC7810LC3TR | Same die, but rated for −40°C to +85°C ambient (vs. +130°C junction for HMC7810ALC3TR) | Limited to commercial-grade modules; not qualified for extended industrial temperature operation | Select when thermal margin is sufficient and cost sensitivity outweighs extended temp qualification |
| HMC1090LP5E | Higher 40 Gbps max rate, no integrated peak detector, 5× larger 5 mm × 5 mm QFN package | Requires external detector and AGC loop; better suited for lab-grade instruments than space-constrained pluggables | Choose for maximum bandwidth headroom where board area and system-level complexity are acceptable |
Compared with HMC7810LC3TR and HMC1090LP5E, the HMC7810ALC3TR uniquely combines extended temperature capability (+130°C junction), integrated peak detection for autonomous AGC, and compact 2.9 mm LCC packaging-making it the only option qualified for production CFP2/CFP4 modules requiring zero-layout redesign and full thermal derating.
Availability
HMC7810ALC3TR is available at Aetrix Electronics and suitable for 400G data center interconnects, 100G metro pluggable modules, and broadband test equipment requiring stable component supply across extended temperature ranges and long production lifecycles.
Supply support for HMC7810ALC3TR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Analog Devices, Inc. is a global leader in high-performance analog, mixed-signal, and RF technologies, headquartered in Norwood, MA, with design centers worldwide and ISO 9001-certified manufacturing.
The HMC7810ALC3TR belongs to Analog Devices' Hittite Microwave RFIC product line, engineered specifically for high-speed optical communication infrastructure-including CFP, CFP2, and QSFP-DD pluggable transceivers-where linearity, jitter, and thermal robustness are non-negotiable.
FAQ
What is the maximum data rate supported by the HMC7810ALC3TR?
The HMC7810ALC3TR supports a maximum data rate of 32.0 Gbps using nonreturn-to-zero (NRZ) encoding with a pseudorandom binary sequence (PRBS31). This specification is verified under typical conditions at 25°C with 600 mVp-p differential input and VCTL = −1.5 V, making the HMC7810ALC3TR suitable for 400G 16-QAM and 100G DP-QPSK optical module designs.
Does the HMC7810ALC3TR require external power supply sequencing?
No, the HMC7810ALC3TR is self-biased and does not require power supply sequencing. It operates reliably with simultaneous application of VDD = 3.3 V and VDD_EXTP/VDD_EXTN = 2.5 V or 3.3 V. This eliminates startup timing constraints and simplifies power management in pluggable optical modules, a key advantage confirmed in the HMC7810ALC3TR datasheet Rev. A, Page 1.
How is gain adjusted on the HMC7810ALC3TR?
Gain on the HMC7810ALC3TR is adjusted via the VCTL pin, which accepts an analog control voltage from −1.5 V to 0 V. At VCTL = −1.5 V, differential-to-differential gain is maximized at 18 dB; at VCTL = 0 V, gain drops to 4 dB. This 6 dB range is confirmed in Table 1 of the HMC7810ALC3TR datasheet and enables real-time linearity optimization without changing external components.
What is the function of the VDET and VREF pins on the HMC7810ALC3TR?
VDET and VREF form the output pair of the integrated peak detector. Their voltage difference (VPEAK = VDET − VREF) is linearly proportional to the differential output swing, enabling direct readback and closed-loop automatic gain control. As shown in Figure 12 and 13 of the HMC7810ALC3TR datasheet, this feature eliminates need for external RF detectors in production optical modules.
What package type and thermal characteristics does the HMC7810ALC3TR use?
The HMC7810ALC3TR uses a 16-terminal, 2.9 mm × 2.9 mm leadless ceramic chip carrier (LCC) package (E-16-1) with an exposed thermal pad. Its thermal resistance is θJA = 53°C/W and θJC = 51°C/W, validated per JEDEC 2S2P test board. This allows continuous operation at +130°C junction temperature, as specified in the Absolute Maximum Ratings table of the HMC7810ALC3TR datasheet.
HMC7810ALC3TR Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Analog Devices Inc.
- Series:
- -
- Package/Case:
- 16-CLCC Exposed Pad
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Obsolete
- Type:
- Laser Diode Driver
- Data Rate:
- 32Gbps
- Number of Channels:
- 1
- Voltage - Supply:
- 3.3V
- Current - Supply:
- -
- Current - Modulation:
- -
- Current - Bias:
- -
- Operating Temperature:
- -40°C ~ 130°C
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 16-LCC (2.9x2.9)
- Mounting Type:
- Surface Mount
HMC7810ALC3TR FAQ
1.How can I place an order for HMC7810ALC3TR through Aetrix?
Please submit a Request for Quotation (RFQ) for HMC7810ALC3TR on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for HMC7810ALC3TR reliable?
The price and inventory of HMC7810ALC3TR are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for HMC7810ALC3TR is usually 5 days.
3.What payment methods are accepted for HMC7810ALC3TR?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for HMC7810ALC3TR transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for HMC7810ALC3TR?
HMC7810ALC3TR orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your HMC7810ALC3TR order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for HMC7810ALC3TR?
For technical support, including HMC7810ALC3TR datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your HMC7810ALC3TR requirements.
6.How does Aetrix verify that HMC7810ALC3TR is sourced from the original manufacturer or authorized distributors?
All HMC7810ALC3TR products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that HMC7810ALC3TR meets industry standards.
7.What is the process for return or replacement of HMC7810ALC3TR?
All HMC7810ALC3TR units undergo pre-shipment inspection (PSI). If there is an issue with HMC7810ALC3TR, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The HMC7810ALC3TR part is unused and in its original packaging.
Return procedure for HMC7810ALC3TR:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
HMC7810ALC3TR Tags

-
EPC21701
EPC

-
EPC21601
EPC

-
MAX3799ETJ+T
Analog Devices Inc./Maxim Integrated

-
AD9665ACPZ-REEL7
Analog Devices Inc.

-
MAX3740AETG+T
Analog Devices Inc./Maxim Integrated

-
MAX3795ETG+
Analog Devices Inc./Maxim Integrated

-
EPC21603
EPC

-
ONET8501VRGPT
Texas Instruments

-
MAX3738ETG+T
Analog Devices Inc./Maxim Integrated

-
SY88022ALMG-TR
Microchip Technology

-
ISL78365ARZ-T7A
Renesas

-
EPC21603ENGRT
EPC
Tech Hub
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…

