Analog Devices Inc. HMC787LC3B
- Part No.:
- HMC787LC3B
- Manufacturer:
- Analog Devices Inc.
- Category:
- RF Mixers
- Package:
- 12-CLCC Exposed Pad
- Datasheet:
-
HMC787LC3B.pdf
- Description:
- IC MIXER GAAS 3-10GHZ 12-QFN
- Quantity:
- Payment:

- Shipping:

Inventory:1,909
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Product details
Overview
HMC787LC3B from Hittite Microwave Corporation is a GaAs MMIC double-balanced mixer designed for RF/LO frequency translation between 3–10 GHz and IF bandwidth DC–4 GHz. It delivers 9 dB typical conversion loss, 55 dB LO-to-RF isolation, and operates with +17 dBm LO drive-enabling upconversion or downconversion in microwave radios and test equipment.
For engineers reviewing the HMC787LC3B datasheet, HMC787LC3B pinout, HMC787LC3B application, or HMC787LC3B equivalent, key selection criteria include its passive balun-based topology, no-external-matching requirement, 12-lead 3×3 mm ceramic SMT package, and suitability for WiMAX infrastructure and military end-use where high isolation and wide IF bandwidth are critical.
Technical Context
This GaAs MESFET-based fundamental mixer uses a passive double-balanced topology with integrated baluns to achieve high LO-to-RF (55 dB) and LO-to-IF (35–42 dB) isolation across 3–10 GHz. Its DC-coupled RF, LO, and IF ports eliminate external bias tees while maintaining 50 Ω impedance matching.
The device requires no external matching components and supports both upconverter and downconverter configurations. Performance is specified at +17 dBm LO drive and 100 MHz IF, with input-referred IP3 of 23 dBm and P1dB of 15 dBm-indicating robust linearity for medium-power microwave signal chains.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| RF/LO Frequency Range | 3–10 GHz - Enables direct mixing in X-band and upper C-band without harmonic injection. |
| IF Bandwidth | DC–4 GHz - Supports baseband I/Q demodulation and wideband IF sampling without AC coupling constraints. |
| Conversion Loss | 9 dB (typ) - Low signal attenuation preserves SNR in receiver front-ends and transmitter IF stages. |
| LO-to-RF Isolation | 55 dB - Minimizes LO leakage into antenna paths, reducing spurious emissions and improving receiver blocking immunity. |
| Input IP3 | 23 dBm - Ensures third-order intermodulation suppression in multi-carrier systems like WiMAX and microwave backhaul. |
| Package Size | 3×3 mm - Compact leadless ceramic SMT footprint compatible with high-volume RF PCB assembly and thermal management via ground paddle. |
| Operating Temp | −40°C to +85°C - Qualified for industrial and military environmental stress without derating. |
Pinout & Package
12-lead leadless ceramic SMT package (alumina body, gold-over-nickel plating, MSL3), 3×3 mm footprint with exposed ground paddle requiring solder connection to PCB RF ground plane.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1, 3, 4, 6, 7, 9 | GND | RF/DC ground terminals - must be soldered to PCB ground plane; critical for balun performance and isolation. |
| 2 | LO | DC-coupled 50 Ω matched input - accepts +17 dBm LO drive without external biasing or matching. |
| 5 | IF | DC-coupled output - supports DC–4 GHz IF; current-limited to ±8 mA for DC operation. |
| 8 | RF | DC-coupled 50 Ω matched port - bidirectional RF interface for up/downconversion between 3–10 GHz. |
| 10, 11, 12 | N/C | No internal connection - externally grounded per evaluation board layout to maintain RF symmetry and shielding. |
Key Features
| Feature | Design Value |
|---|---|
| Passive double-balanced topology | Eliminates active devices and bias networks - improves reliability, temperature stability, and wideband flatness. |
| No external matching required | Reduces BOM count and layout complexity - enables drop-in integration into 50 Ω RF signal paths. |
| High LO-to-RF isolation (55 dB) | Minimizes LO radiation in transmit chains and prevents LO pulling in sensitive receivers. |
| Wide IF bandwidth (DC–4 GHz) | Supports zero-IF architectures and high-speed digitization without IF filtering bottlenecks. |
| RoHS-compliant ceramic SMT package | Enables reflow-compatible manufacturing and stable RF performance up to +85°C ambient. |
Applications
| WiMAX Infrastructure | Microwave Radio |
|---|---|
Use Scenario: Base station transceivers operating in 3.5 GHz licensed band requiring high linearity and low conversion loss. IC Role / Device Role / Timing Role: Downconverter translating 3.5 GHz RF to 70–200 MHz IF for ADC sampling; also used as upconverter in TDD mode. Use Value: 23 dBm input IP3 and 9 dB conversion loss preserve EVM and ACLR in OFDMA transmission under multi-tone loading. |
Use Scenario: Point-to-point 6–11 GHz backhaul radios needing compact, high-isolation mixing for full-duplex operation. IC Role / Device Role / Timing Role: Bidirectional mixer in shared-antenna transceiver architecture, handling simultaneous TX/RX paths with minimal LO feedthrough. Use Value: 55 dB LO-to-RF isolation prevents self-interference and enables >100 dB dynamic range in adjacent-channel rejection tests. |
| Test Equipment & Sensors | Military End-Use |
Use Scenario: Portable spectrum analyzers and vector signal analyzers requiring broadband IF coverage and fast sweep agility. IC Role / Device Role / Timing Role: First-stage downconverter translating 3–10 GHz input to DC–4 GHz IF for real-time FFT processing. Use Value: DC-coupled IF port allows baseband I/Q generation without DC-blocking capacitors, enabling true zero-IF calibration and phase coherence. |
Use Scenario: EW/ESM receivers deployed in airborne platforms where size, thermal resilience, and EMI immunity are critical. IC Role / Device Role / Timing Role: Front-end mixer in channelized receiver architecture, operating across multiple threat bands (C/X-band) with consistent conversion loss. Use Value: −40°C to +85°C operating range and 87.7 °C/W thermal resistance ensure stable gain and isolation under vibration and rapid thermal cycling. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar double-balanced mixer applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| HMC1048LP3E | Wider RF range (2–18 GHz), higher conversion loss (10.5 dB typ), same 3×3 mm package. | Better suited for Ka-band extensions but trades off LO isolation (48 dB vs. 55 dB). | Select when broader frequency coverage outweighs need for maximum LO-to-RF isolation. |
| QPC7350 | GaAs pHEMT process, 4–8 GHz RF range, 8.5 dB conversion loss, 50 dB LO-to-RF isolation, 4×4 mm QFN. | Lower loss and smaller die area, but narrower band and reduced isolation limit use in high-dynamic-range receivers. | Prefer for cost-sensitive 5G FR1 infrastructure where 4–8 GHz coverage suffices and layout space permits larger package. |
Compared with HMC787LC3B, HMC1048LP3E extends usable RF range by 8 GHz but sacrifices 7 dB LO-to-RF isolation and adds 1.5 dB conversion loss; QPC7350 offers lower loss in a narrower band and larger footprint, making HMC787LC3B optimal for C/X-band systems prioritizing isolation, compactness, and DC–4 GHz IF flexibility.
Availability
HMC787LC3B is available at Aetrix Electronics and suitable for WiMAX infrastructure, microwave radio, and military end-use requiring stable component supply, RoHS-compliant packaging, and proven performance in high-isolation RF signal chains.
Supply support for HMC787LC3B includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Hittite Microwave Corporation, acquired by Analog Devices in 2014, specialized in high-frequency RF ICs including mixers, amplifiers, and synthesizers for defense, communications, and test equipment markets.
The HMC787LC3B belongs to Hittite's GaAs MMIC fundamental mixer product line, engineered for broadband, high-isolation frequency translation in microwave infrastructure where passive balun performance and SMT manufacturability are essential.
FAQ
What is the recommended LO drive level for optimal performance of the HMC787LC3B?
The HMC787LC3B is characterized and optimized for +17 dBm LO drive, delivering 9 dB typical conversion loss, 55 dB LO-to-RF isolation, and 23 dBm input IP3 at this level. Operating below +15 dBm increases conversion loss; above +19 dBm risks compression and accelerated degradation. The HMC787LC3B datasheet specifies all key parameters at +17 dBm, making it the design center for repeatable RF system performance.
Can the HMC787LC3B be used for zero-IF (direct-conversion) receiver applications?
Yes, the HMC787LC3B supports zero-IF operation due to its DC–4 GHz IF bandwidth and DC-coupled IF port. When used in direct-conversion receivers, the IF output can be connected directly to baseband amplifiers or ADCs without AC coupling. However, the IF port must not source or sink more than ±8 mA to avoid non-function or damage-this constraint must be verified in the baseband interface design for the HMC787LC3B.
Does the HMC787LC3B require external matching components for RF, LO, or IF ports?
No, the HMC787LC3B requires no external matching components-the RF, LO, and IF ports are internally matched to 50 Ω across 3–10 GHz (RF/LO) and DC–4 GHz (IF). This eliminates discrete baluns, transformers, or tuning stubs, simplifying layout and improving repeatability. The HMC787LC3B achieves this through monolithic GaAs MESFET balun integration, confirmed in its functional diagram and evaluation board documentation.
What is the thermal management requirement for the HMC787LC3B in continuous operation?
The HMC787LC3B features an exposed ground paddle with 87.7 °C/W thermal resistance (channel-to-ground). For continuous operation at max rated dissipation (0.74 W at 85 °C), the PCB must provide low-impedance thermal conduction via multiple vias to inner/outer ground planes. The HMC787LC3B package marking and outline drawing specify that the paddle must be soldered to RF ground-failure to do so degrades isolation, conversion loss, and thermal reliability.
Is the HMC787LC3B pin-compatible with other Hittite mixer variants such as HMC787LC3?
The HMC787LC3B is not pin-compatible with earlier HMC787LC3 revisions-the "B" suffix denotes a qualified revision with updated process control and screening, but identical pinout, package dimensions, and electrical specifications. All 12 pins (including N/C pins 10–12) retain identical functions and layout per the HMC787LC3B pin descriptions document. Thus, HMC787LC3B serves as a drop-in replacement for HMC787LC3 in existing designs.
HMC787LC3B Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Analog Devices Inc.
- Series:
- -
- Package/Case:
- 12-CLCC Exposed Pad
- Packaging:
- Bulk
- Product Status:
- Obsolete
- RF Type:
- LTE, WiMax
- Frequency:
- 3GHz ~ 10GHz
- Number of Mixers:
- 1
- Gain:
- -
- Noise Figure:
- 9dB
- Secondary Attributes:
- Up/Down Converter
- Current - Supply:
- -
- Voltage - Supply:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 12-CLCC (3x3)
HMC787LC3B FAQ
1.How can I place an order for HMC787LC3B through Aetrix?
Please submit a Request for Quotation (RFQ) for HMC787LC3B on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for HMC787LC3B reliable?
The price and inventory of HMC787LC3B are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for HMC787LC3B is usually 5 days.
3.What payment methods are accepted for HMC787LC3B?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for HMC787LC3B transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for HMC787LC3B?
HMC787LC3B orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your HMC787LC3B order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for HMC787LC3B?
For technical support, including HMC787LC3B datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your HMC787LC3B requirements.
6.How does Aetrix verify that HMC787LC3B is sourced from the original manufacturer or authorized distributors?
All HMC787LC3B products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that HMC787LC3B meets industry standards.
7.What is the process for return or replacement of HMC787LC3B?
All HMC787LC3B units undergo pre-shipment inspection (PSI). If there is an issue with HMC787LC3B, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The HMC787LC3B part is unused and in its original packaging.
Return procedure for HMC787LC3B:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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