Analog Devices Inc. HMC815BLC5TR-R5
- Part No.:
- HMC815BLC5TR-R5
- Manufacturer:
- Analog Devices Inc.
- Category:
- RF Mixers
- Package:
- 32-TFCQFN Exposed Pad
- Datasheet:
-
HMC815BLC5TR-R5.pdf
- Description:
- MIXER, UPCONVERTER
- Quantity:
- Payment:

- Shipping:

Inventory:4,417
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Product details
Overview
HMC815BLC5TR-R5 from Analog Devices is a GaAs MMIC I/Q upconverter operating from 21 GHz to 27 GHz RF, with 10.5–14.5 GHz LO input and DC–3.75 GHz IF bandwidth. It delivers 12 dB typical conversion gain, 20 dBc sideband rejection, and 20 dBm OP1dB - enabling high-fidelity single-sideband upconversion in millimeter-wave transmitters for satellite comms and radar front-ends.
For engineers reviewing the HMC815BLC5TR-R5 datasheet, HMC815BLC5TR-R5 pinout, HMC815BLC5TR-R5 application, or HMC815BLC5TR-R5 equivalent, key selection criteria include its integrated 2× LO multiplier, quadrature IF inputs (IF1/IF2), exposed-pad 32-terminal ceramic LCC package, and requirement for an external 90° hybrid to select upper or lower sideband.
Technical Context
The HMC815BLC5TR-R5 integrates a pHEMT-based I/Q mixer core with a driver amplifier and active 2× LO multiplier in a monolithic GaAs structure. Its architecture eliminates wire bonding and supports surface-mount assembly while reducing post-mix filtering needs via inherent sideband suppression.
It operates across −40°C to +85°C with three independent drain supplies (VDD1 for LO amp; VDD2/VDD3 for RF amp) and requires external biasing of VGG for RF amplifier gate control. IF ports accept differential quadrature signals, and sideband selection depends on external 90° hybrid phasing at IF1/IF2.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| RF Frequency Range | 21–27 GHz: Supports E-band point-to-point radio and military radar transmit bands. |
| LO Frequency Range | 10.5–14.5 GHz: Requires high-side or low-side injection; 2× multiplication internal to device. |
| IF Bandwidth | DC–3.75 GHz: Enables baseband-to-wideband IF upconversion without dc blocking for sub-3 mA current handling. |
| Conversion Gain | 12 dB typical: Provides net signal gain before RF power amplification, reducing system noise figure impact. |
| Sideband Rejection | 20 dBc typical: Reduces need for image-reject filtering; enables cleaner spectral output with external hybrid. |
| OIP3 | 27 dBm typical: Supports linear operation under multi-tone conditions in wideband SSB systems. |
| OP1dB | 20 dBm typical: Delivers usable saturated output power for E-band transmitter stages. |
| 2× LO to RF Isolation | 10 dB typical: Limits LO leakage into RF path, easing filter requirements at antenna interface. |
Pinout & Package
Package: 4.90 mm × 4.90 mm, 32-terminal ceramic LCC with exposed thermal pad (EPAD), RoHS compliant, MSL3 rated.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 6, 18, 21 | VDD1 / VDD3 / VDD2 | Independent supply pins: VDD1 powers LO amplifier; VDD2/VDD3 power RF amplifier stage. |
| 9 | LOIN | 50 Ω ac-coupled LO input; accepts 0–6 dBm drive for internal 2× multiplier. |
| 12 | VGG | RF amplifier gate bias control; sets operating point and linearity for RFOUT stage. |
| 14 | RFOUT | 50 Ω ac-coupled RF output; delivers upconverted 21–27 GHz signal with matched return loss ≥12 dB. |
| 29, 31 | IF1, IF2 | Quadrature IF inputs; require external 90° hybrid to select upper or lower sideband. |
| 10, 13, 15, 30, 32 | GND | RF/dc ground connections; must be tied to low-impedance ground plane with EPAD. |
| 1–5, 7, 8, 11, 16, 17, 19, 20, 22–28 | NIC | Not internally connected; may be grounded externally without performance impact. |
| EPAD | Exposed Pad | Thermal and electrical ground reference; mandatory connection to PCB ground plane for reliability and RF stability. |
Key Features
| Feature | Design Value |
|---|---|
| I/Q mixer topology | Reduces image rejection filter complexity by providing 20 dBc intrinsic sideband suppression. |
| Integrated 2× LO multiplier | Eliminates need for external frequency doubler; simplifies LO chain design and reduces board area. |
| DC–3.75 GHz IF bandwidth | Supports direct baseband upconversion and wide IF modulation schemes without dc blocking constraints. |
| Surface-mount ceramic LCC | Enables automated assembly and eliminates wire-bond reliability concerns in high-frequency modules. |
| −40°C to +85°C operation | Validated over full industrial temperature range with stable gain, OIP3, and sideband rejection. |
Applications
| Point-to-Point Radio Transmitter | Military Radar Front-End |
|---|---|
|
Use Scenario: High-capacity backhaul link operating in E-band (24–28 GHz) with QPSK/16-QAM modulation. IC Role / Device Role / Timing Role: I/Q upconverter translating baseband I/Q signals to RF with precise phase alignment and sideband control. Use Value: 20 dBc sideband rejection minimizes adjacent-channel interference; 12 dB gain offsets losses in waveguide transitions and antennas. |
Use Scenario: Active electronically scanned array (AESA) radar transmit module requiring low-phase-noise upconversion. IC Role / Device Role / Timing Role: Final-stage upconverter driving T/R module antenna elements with minimal spurious content. Use Value: 27 dBm OIP3 ensures linearity under pulsed wideband operation; 20 dBm OP1dB supports peak radar transmit power. |
| Satellite Communications Uplink | Electronic Warfare Signal Generator |
|
Use Scenario: Ka-band uplink terminal generating 27 GHz carrier with digitally modulated IF input. IC Role / Device Role / Timing Role: Single-sideband upconverter using external 90° hybrid to suppress unwanted sideband in spectrum-constrained environments. Use Value: Integrated 2× LO multiplier reduces local oscillator chain complexity and phase noise degradation. |
Use Scenario: Compact jammer platform requiring agile, broadband RF synthesis from baseband I/Q DAC outputs. IC Role / Device Role / Timing Role: Wideband upconverter supporting rapid frequency hopping across 21–27 GHz with consistent sideband control. Use Value: DC–3.75 GHz IF bandwidth accommodates fast-hopping digital IF waveforms without reconfiguration. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar I/Q upconverter applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| HMC815ALC5TR-R5 | Same die, but specified for 17–24 GHz RF range; lower sideband rejection (18 dBc typ) at 21–24 GHz. | Optimized for lower E-band edge; not validated above 24 GHz. | Select when operating ≤24 GHz and cost sensitivity outweighs top-end RF coverage. |
| HMC1040LP5E | Wider IF bandwidth (DC–6 GHz); higher OP1dB (22 dBm); larger 7×7 mm LCC package; no integrated 2× LO multiplier. | Requires external LO doubler; better suited for multi-band test equipment than compact radar modules. | Choose for wider IF flexibility and higher output power where board space permits and LO chain complexity is acceptable. |
Compared with HMC815ALC5TR-R5, the HMC815BLC5TR-R5 extends RF coverage to 27 GHz with improved sideband rejection; versus HMC1040LP5E, it trades IF bandwidth and output power for smaller footprint and integrated LO multiplication - critical for size-constrained mmWave systems.
Availability
HMC815BLC5TR-R5 is available at Aetrix Electronics and suitable for point-to-point radios, military radar transmitters, and satellite communications uplinks requiring stable component supply, controlled thermal performance, and repeatable RF behavior across temperature.
Supply support for HMC815BLC5TR-R5 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Analog Devices is a global leader in high-performance analog, mixed-signal, and RF ICs, serving aerospace, defense, communications, and industrial markets with precision signal processing solutions.
The HMC815BLC5TR-R5 belongs to Analog Devices' Hittite Microwave MMIC product line, designed specifically for millimeter-wave infrastructure and defense systems requiring integrated, surface-mount upconversion with minimal external components.
FAQ
What is the required LO drive level for optimal performance of the HMC815BLC5TR-R5?
The HMC815BLC5TR-R5 specifies a nominal LO drive of 4 dBm at the LOIN pin, with operational range from 0 dBm to 6 dBm. Performance metrics including conversion gain, sideband rejection, and OIP3 are characterized at 4 dBm; deviation beyond ±2 dBm may reduce sideband suppression or increase distortion. The internal 2× multiplier ensures robust operation without external amplification.
Does the HMC815BLC5TR-R5 require external filtering on the RF output?
The HMC815BLC5TR-R5 delivers 20 dBc sideband rejection but does not eliminate the need for final-stage bandpass filtering before antenna coupling. Its RF output contains residual image energy and harmonics; system-level spectral mask compliance typically requires a cavity or microstrip filter centered at 21–27 GHz with ≥30 dB stopband attenuation beyond the desired sideband.
Can the HMC815BLC5TR-R5 operate with DC-coupled IF inputs?
Yes - the HMC815BLC5TR-R5 supports true DC-coupled IF operation on IF1 and IF2, provided total source/sink current remains within ±3 mA per pin. For AC-coupled applications, off-chip dc blocking capacitors are recommended; DC coupling enables baseband I/Q generation directly from high-speed DACs without additional biasing circuitry.
How is sideband selection implemented in the HMC815BLC5TR-R5?
Sideband selection in the HMC815BLC5TR-R5 is determined by the relative phase relationship applied to IF1 and IF2 via an external 90° hybrid coupler. Feeding in-phase signals yields lower sideband (high-side LO); feeding quadrature signals yields upper sideband (low-side LO). No internal configuration or pin strapping is required - selection is entirely external and signal-path dependent.
What thermal management is required for continuous operation of the HMC815BLC5TR-R5?
The HMC815BLC5TR-R5 requires connection of its exposed pad (EPAD) to a low-impedance thermal and electrical ground plane with ≥5 × 5 thermal vias to a solid inner ground layer. At full bias (VDD1 = VDD2 = VDD3 = 4.5 V), total drain current reaches ~470 mA, generating ~2.1 W dissipation; θJA is 46.4°C/W, so ambient must remain ≤+65°C for junction temperature to stay below 175°C maximum rating.
HMC815BLC5TR-R5 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Analog Devices Inc.
- Series:
- -
- Package/Case:
- 32-TFCQFN Exposed Pad
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- RF Type:
- General Purpose
- Frequency:
- 21GHz ~ 27GHz
- Number of Mixers:
- 2
- Gain:
- 12dB
- Noise Figure:
- -
- Secondary Attributes:
- Up Converter
- Current - Supply:
- 270mA
- Voltage - Supply:
- 5.5V
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 32-CLCC (5x5)
HMC815BLC5TR-R5 FAQ
1.How can I place an order for HMC815BLC5TR-R5 through Aetrix?
Please submit a Request for Quotation (RFQ) for HMC815BLC5TR-R5 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for HMC815BLC5TR-R5 reliable?
The price and inventory of HMC815BLC5TR-R5 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for HMC815BLC5TR-R5 is usually 5 days.
3.What payment methods are accepted for HMC815BLC5TR-R5?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for HMC815BLC5TR-R5 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for HMC815BLC5TR-R5?
HMC815BLC5TR-R5 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your HMC815BLC5TR-R5 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for HMC815BLC5TR-R5?
For technical support, including HMC815BLC5TR-R5 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your HMC815BLC5TR-R5 requirements.
6.How does Aetrix verify that HMC815BLC5TR-R5 is sourced from the original manufacturer or authorized distributors?
All HMC815BLC5TR-R5 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that HMC815BLC5TR-R5 meets industry standards.
7.What is the process for return or replacement of HMC815BLC5TR-R5?
All HMC815BLC5TR-R5 units undergo pre-shipment inspection (PSI). If there is an issue with HMC815BLC5TR-R5, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The HMC815BLC5TR-R5 part is unused and in its original packaging.
Return procedure for HMC815BLC5TR-R5:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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