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Analog Devices Inc. HMC8327LG
- Part No.:
- HMC8327LG
- Manufacturer:
- Analog Devices Inc.
- Package:
- -
- Datasheet:
-
HMC8327LG.pdf
- Description:
- E-BAND LOW BAND DOWNCONVERTER
- Quantity:
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Inventory:3,943
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Product details
Overview
HMC8327LG from Analog Devices is a fully integrated E-band in-phase/quadrature (I/Q) downconverter SiP operating at 81–86 GHz RF input, delivering 8.5 dB typical conversion gain, 30 dBc image rejection, and 6 dB typical noise figure for high-capacity wireless backhaul receivers.
For engineers reviewing the HMC8327LG datasheet, HMC8327LG pinout, HMC8327LG application, or HMC8327LG equivalent, key selection criteria include its WR-12 waveguide RF port, differential 100 Ω baseband outputs, 6× LO multiplier architecture, and DC–2 GHz IF bandwidth with I/Q phase/amplitude balance under 2°/0.5 dB.
Technical Context
The HMC8327LG integrates a low-noise amplifier, 6× LO multiplier, and image-rejecting I/Q mixer in a single surface-mount package, enabling direct-conversion receiver architectures without external image filters. Its RF path uses WR-12 waveguide input while IF outputs are differential and internally terminated to 100 Ω.
It operates with fixed bias conditions: VDLNA = 3 V, VD_MULT = 1.5 V, VG_MIXER = −1 V, and supports upper-sideband selection via external hybrid networks. All performance specs-including 30 dBc image rejection and 2 dB gain flatness-are measured at TA = −40°C to +85°C, IF = 1000 MHz, LO = 4 dBm.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| RF Frequency Range | 81–86 GHz: Matches E-band spectrum allocation for 5G mmWave backhaul and point-to-point links. |
| Conversion Gain | 8.5 dB typical: Enables single-stage downconversion without cascaded amplification in compact receiver front-ends. |
| Image Rejection | 30 dBc typical: Reduces need for external image filtering, simplifying IF chain design for DC–2 GHz baseband. |
| Noise Figure | 6 dB typical: Maintains system sensitivity in high-frequency receivers where thermal noise dominates. |
| I/Q Phase Balance | 2° typical: Limits quadrature error-induced LO leakage and sideband asymmetry in coherent demodulation. |
| Input IP3 | 2 dBm typical: Supports moderate interference environments in dense E-band deployments. |
| DC Power Dissipation | 1.0–1.25 W: Requires thermal management on PCB but avoids active cooling in most outdoor unit designs. |
| RF Port Interface | WR-12 waveguide: Ensures low-loss, high-isolation RF coupling above 75 GHz-no SMA or connectorized alternatives. |
Pinout & Package
Package: 34-lead, 13 mm × 11 mm surface-mount System-in-Package (SiP) with integrated WR-12 waveguide interface and exposed thermal pad.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDD_LNA | LNA drain supply | 3 V DC input; must be decoupled locally to suppress LNA oscillation and ensure stable gain. |
| VDD_MULT | Multiplier drain supply | 1.5 V DC input; powers 6× LO multiplier stage-sensitive to ripple due to harmonic generation. |
| VG_LNA | LNA gate bias | Tunable from −2 V to 0 V; sets LNA operating point and affects noise/gain trade-off. |
| VG_MIXER | Mixer gate bias | −1 V typical; critical for optimizing image rejection and P1dB compression point. |
| IOUT+, IOUT− | Differential I-channel output | 100 Ω differential impedance; connects directly to baseband ADC or I-path filter without termination. |
| QOUT+, QOUT− | Differential Q-channel output | 100 Ω differential impedance; enables complex-baseband sampling with minimal image distortion. |
| LO_IN | LO input port | 50 Ω RF input; accepts 13.2–14.6 GHz LO drive; return loss ≥10 dB ensures minimal reflection-induced LO pulling. |
| RFIN | RF input port | WR-12 waveguide interface; mechanical alignment critical-no solderable RF pin; requires precision waveguide transition. |
Key Features
| Feature | Design Value |
|---|---|
| Fully integrated I/Q downconverter SiP | Eliminates discrete LO multiplier, LNA, and image-reject mixer assembly-reduces layout complexity and interconnect loss at 81–86 GHz. |
| 6× LO multiplier architecture | Enables use of lower-frequency, higher-stability 13.2–14.6 GHz LO sources instead of direct 81–86 GHz synthesis. |
| Differential 100 Ω I/Q outputs | Supports direct connection to high-speed differential ADCs or analog baseband processors without external baluns or matching networks. |
| WR-12 waveguide RF input | Provides >20 dB return loss and <0.5 dB insertion loss at E-band-superior to planar transitions for production-grade mmWave systems. |
| 2° I/Q phase / 0.5 dB amplitude balance | Ensures <−40 dBc carrier suppression in zero-IF receivers and minimizes EVM degradation in 256-QAM E-band modems. |
Applications
| E-Band Point-to-Point Radio | 5G Fixed Wireless Access (FWA) |
|---|---|
Use Scenario: High-capacity backhaul link between cell sites operating in unlicensed 81–86 GHz band with 2 Gbps+ throughput. IC Role / Device Role / Timing Role: Front-end downconverter converting 81–86 GHz RF to DC–2 GHz complex baseband for digital demodulation. Use Value: 30 dBc image rejection and 6 dB noise figure enable 256-QAM operation over 1 km with <10⁻⁶ BER under rain fade. | Use Scenario: Last-mile subscriber unit receiving E-band signals from macro node in urban FWA deployment. IC Role / Device Role / Timing Role: Low-noise receive path component providing I/Q outputs to FPGA-based OFDM demodulator. Use Value: Differential 100 Ω outputs interface directly to Xilinx Zynq RFSoC ADC inputs, eliminating external baluns and reducing BOM count by 4 components. |
| Millimeter-Wave Test Equipment | Secure Tactical Data Link |
Use Scenario: Signal analyzer front-end module covering 81–86 GHz with real-time spectrum analysis capability. IC Role / Device Role / Timing Role: Calibrated downconversion stage feeding digitizer with known gain/phase response across full RF band. Use Value: 2 dB gain flatness and <2° I/Q phase balance allow ±0.5 dB amplitude accuracy and <1° phase uncertainty in vector signal analysis. | Use Scenario: Jam-resistant military comms terminal requiring low-probability-of-intercept (LPI) waveform reception. IC Role / Device Role / Timing Role: Image-suppressed receiver core enabling wide instantaneous bandwidth capture without preselector tuning. Use Value: 30 dBc image rejection prevents false detection of out-of-band jammers; 1.25 W power dissipation supports conduction-cooled ruggedized chassis integration. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar I/Q downconverter applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| HMC1098LP5E | Operates at 71–76 GHz; 25 dBc image rejection; WR-15 waveguide; no integrated LNA. | Targeted for lower E-band sub-band; requires external LNA for comparable noise performance. | Select when system LO source is 11.8–12.7 GHz and thermal budget allows discrete LNA integration. |
| HMC1125LP5E | 81–86 GHz operation; 28 dBc image rejection; includes LNA; WR-12; 7 dB conversion gain. | Slightly lower gain and image rejection; optimized for lower power consumption (0.95 W). | Prefer for battery-powered or thermally constrained portable E-band receivers where 0.5 dB NF penalty is acceptable. |
Compared with HMC1098LP5E and HMC1125LP5E, the HMC8327LG delivers highest image rejection (30 dBc) and conversion gain (8.5 dB) in the 81–86 GHz band with integrated LNA and 6× LO multiplier-making it optimal for fixed infrastructure demanding maximum dynamic range and minimal external components.
Availability
HMC8327LG is available at Aetrix Electronics and suitable for E-band communication systems, high-capacity wireless backhaul, and millimeter-wave test equipment requiring stable component supply across extended temperature ranges and long production lifecycles.
Supply support for HMC8327LG includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Analog Devices, Inc. is a global semiconductor leader specializing in high-performance analog, mixed-signal, and RF technologies for precision signal processing.
The HMC8327LG belongs to Analog Devices' Hittite Microwave product line, engineered specifically for millimeter-wave communications infrastructure-emphasizing integration, repeatability, and production-ready packaging for 5G and defense E-band systems.
FAQ
What is the RF input interface type for the HMC8327LG?
The HMC8327LG uses a WR-12 rectangular waveguide interface for RF input, not a coaxial or planar RF connector. This provides low-loss, high-isolation coupling at 81–86 GHz. Mechanical alignment to the waveguide transition is critical during PCB assembly, and no solderable RF pins are present-only DC bias and differential IF terminals are accessible via standard SMT pads.
Does the HMC8327LG require external LO filtering before the LO_IN port?
Yes, the HMC8327LG requires clean 13.2–14.6 GHz LO input with ≤0.5 dB ripple and harmonics suppressed ≥30 dBc. Because it contains a 6× multiplier, spurious responses from LO harmonics can fold into the RF band. An external bandpass filter centered at the LO frequency is recommended to prevent degradation of image rejection and noise figure in the HMC8327LG.
Can the HMC8327LG operate with single-ended IF outputs?
No-the HMC8327LG provides only differential I/Q outputs (IOUT±, QOUT±) with 100 Ω impedance. Single-ended operation requires external 90° and 180° hybrids as specified in the datasheet. Attempting to terminate one side of the differential pair degrades I/Q balance, increases LO leakage, and reduces image rejection below the rated 30 dBc in the HMC8327LG.
What is the recommended thermal management approach for the HMC8327LG?
The HMC8327LG dissipates 1.0–1.25 W and features an exposed thermal pad. It must be mounted on a 4-layer PCB with ≥4 thermal vias (0.3 mm diameter, filled and plated) connecting the pad to an internal ground plane. A minimum 10 mm² copper pour beneath the package is required. For ambient temperatures above +65°C, forced airflow ≥1 m/s or heatsink attachment is advised to maintain junction temperature within −40°C to +85°C limits.
Is the HMC8327LG pin-compatible with other Hittite SiP downconverters like HMC1125LP5E?
No-the HMC8327LG has a unique 34-lead footprint optimized for its WR-12 waveguide interface and internal bias distribution. While HMC1125LP5E shares the same frequency band and SiP form factor, its pin assignment for VDD, VG, and IF outputs differs. PCB layout is not interchangeable; redesign is required when substituting between these models, even though both use 13 mm × 11 mm packages.
HMC8327LG Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Analog Devices Inc.
- Series:
- *
- Package/Case:
- -
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Type:
- -
- PLL:
- -
- Input:
- -
- Output:
- -
- Number of Circuits:
- -
- Ratio - Input:Output:
- -
- Differential - Input:Output:
- -
- Frequency - Max:
- -
- Divider/Multiplier:
- -
- Voltage - Supply:
- -
- Operating Temperature:
- -
- Mounting Type:
- -
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- -
HMC8327LG FAQ
1.How can I place an order for HMC8327LG through Aetrix?
Please submit a Request for Quotation (RFQ) for HMC8327LG on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for HMC8327LG reliable?
The price and inventory of HMC8327LG are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for HMC8327LG is usually 5 days.
3.What payment methods are accepted for HMC8327LG?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for HMC8327LG transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for HMC8327LG?
HMC8327LG orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your HMC8327LG order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for HMC8327LG?
For technical support, including HMC8327LG datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your HMC8327LG requirements.
6.How does Aetrix verify that HMC8327LG is sourced from the original manufacturer or authorized distributors?
All HMC8327LG products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that HMC8327LG meets industry standards.
7.What is the process for return or replacement of HMC8327LG?
All HMC8327LG units undergo pre-shipment inspection (PSI). If there is an issue with HMC8327LG, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The HMC8327LG part is unused and in its original packaging.
Return procedure for HMC8327LG:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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