Analog Devices Inc. HMC851LC3CTR
- Part No.:
- HMC851LC3CTR
- Manufacturer:
- Analog Devices Inc.
- Package:
- 16-LFQFN Exposed Pad
- Datasheet:
-
HMC851LC3CTR.pdf
- Description:
- IC GATE XOR/XNOR 28GBPS 16QFN
- Quantity:
- Payment:

- Shipping:

Inventory:2,475
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Product details
Overview
HMC851LC3CTR from Analog Devices (formerly Hittite Microwave) is a high-speed CML XOR/XNOR logic gate IC designed for ultra-high-speed serial data path conditioning in test and measurement systems. It supports 28 Gbps data rates and 28 GHz clock frequencies, features programmable differential output voltage swing (500–1300 mVp-p), 97 ps propagation delay, and on-chip 50 Ω input termination.
For engineers reviewing the HMC851LC3CTR datasheet, HMC851LC3CTR pinout, HMC851LC3CTR application, or HMC851LC3CTR equivalent, key selection considerations include its -3.3 V single-supply operation, VR-controlled output amplitude tuning, sub-100 ps timing precision, and compatibility with AC/DC-coupled 50 Ω systems in RF ATE and broadband serial interconnects.
Technical Context
The HMC851LC3CTR implements true differential CML logic with fully terminated 50 Ω inputs (AP/AN, BP/BN) and current-mode outputs (DP/DN), enabling direct interface to high-speed backplanes and instrumentation without external biasing. Its VR pin provides analog control over differential output swing across process/voltage/temperature, supporting loss compensation in long-channel links.
It operates exclusively from a negative -3.3 V supply (Vee), with all ground pins (GND) and the exposed paddle requiring low-inductance RF grounding. Input return loss exceeds 10 dB below 20 GHz, and output return loss exceeds 10 dB below 18 GHz - critical for signal integrity at 28 Gbps.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Max Data Rate | 28 Gbps - enables NRZ serial links matching PCIe Gen6, CEI-28G, and OTU4 standards |
| Propagation Delay | 97 ps (A→D), 102 ps (B→D) - ensures deterministic timing alignment in parallel XOR-based error detection paths |
| Rise/Fall Time | 15/14 ps (20–80%) - preserves eye opening and minimizes intersymbol interference at 28 Gbps |
| Output Swing Range | 500–1300 mVp-p differential - adjustable via VR pin to compensate for PCB trace loss or receiver sensitivity |
| Supply Voltage | -3.3 V (±0.3 V) - requires stable negative rail; incompatible with positive-supply logic families |
| Jitter Performance | 0.2 psrms random jitter, 2 psp-p deterministic jitter - meets stringent BER requirements for high-fidelity test equipment |
| Input Termination | On-chip 50 Ω to ground - eliminates external resistors and layout sensitivity for AP/AN and BP/BN inputs |
Pinout & Package
Package: 16-lead ceramic SMT (3 × 3 mm, 0.5 mm pitch), alumina body, gold-over-nickel plating, RoHS-compliant, MSL3 rated. Exposed paddle must be soldered to Vee (-3.3 V) for thermal and electrical performance.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1, 4, 5, 8, 9, 12, 13, 16 | GND | RF/DC ground connections - must connect to low-impedance ground plane with multiple vias |
| 2, 3 | AP, AN | Differential CML data input pair - internally terminated to 50 Ω; accepts AC/DC coupling |
| 6, 7 | BP, BN | Differential CML data input pair - identical termination and coupling flexibility as AP/AN |
| 10, 11 | DN, DP | Differential CML data output pair - 50 Ω source impedance; directly drives 50 Ω-terminated loads |
| 14 | VR | Analog control voltage input - sets output swing level per "Output Differential vs. VR" curve; 0 V = nominal swing |
| 15 + Paddle | Vee | Negative supply (-3.3 V) connection - paddle must be soldered to Vee net for thermal dissipation and reference stability |
Key Features
| Feature | Design Value |
|---|---|
| Programmable Output Swing | 500–1300 mVp-p differential via VR pin - enables dynamic amplitude optimization for varying channel loss |
| On-Chip 50 Ω Input Termination | Eliminates external resistors and layout-dependent impedance mismatches on both input pairs |
| Sub-100 ps Propagation Delay | 97 ps A→D delay with <5 ps skew between paths - supports time-critical logic functions in high-speed test pattern generators |
| Low Power at 28 Gbps | 241 mW typical consumption - achieves high-speed logic with minimal thermal load in dense instrument modules |
| Robust Signal Integrity | 10 dB input/output return loss up to 20/18 GHz - maintains >15 dB margin against reflections in 28 Gbps eye diagrams |
Applications
| RF ATE Channel Conditioning | Broadband Signal Analysis |
|---|---|
Use Scenario: Generating real-time pass/fail decisions in automated RF test systems by comparing reference and DUT output waveforms. IC Role / Device Role / Timing Role: XOR gate performing bit-by-bit comparison of high-speed serial streams at 28 Gbps. Use Value: Sub-100 ps propagation delay ensures cycle-accurate comparison; programmable output swing adapts to varying DUT output levels without recalibration. |
Use Scenario: Extracting jitter components (random/deterministic) from high-speed serial signals using phase-aligned XOR-based sampling techniques. IC Role / Device Role / Timing Role: High-fidelity XOR mixer generating difference signals for time-domain jitter decomposition. Use Value: 0.2 psrms random jitter adds negligible noise floor; 50 Ω-terminated I/O preserves signal fidelity into spectrum analyzers or sampling oscilloscopes. |
| 28 Gbps Serial Data Interconnect | High-Speed Logic Test Fixture |
Use Scenario: Embedding logic-level signal conditioning in backplane or cable equalization evaluation boards operating at CEI-28G rates. IC Role / Device Role / Timing Role: XNOR gate used in loopback validation paths to verify data integrity end-to-end. Use Value: DC-coupled outputs interface directly to 50 Ω receivers; VR pin allows swing adjustment to match downstream ADC full-scale range. |
Use Scenario: Building reconfigurable high-speed logic test fixtures for validating ASIC/FPGA I/O compliance at 28 Gbps. IC Role / Device Role / Timing Role: Programmable XOR/XNOR element providing flexible truth-table routing for stimulus generation. Use Value: Dual-function capability (XOR/XNOR) selected via input polarity; on-chip termination simplifies fixture layout and improves repeatability. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-speed logic gate applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| HMC852LC3CTR | Dual XOR/XNOR gate in same package; higher total power (420 mW); shared VR pin for both channels | Suitable when two independent 28 Gbps logic functions are required on one die | Select HMC852LC3CTR only if dual-channel functionality justifies added power and routing complexity |
| SY100EL15ZC | Lower speed (3.2 Gbps max), ECL-compatible, +3.3 V supply, no VR control, 28-pin SOIC | Applicable only in legacy ECL systems with relaxed speed requirements and different supply architecture | Choose SY100EL15ZC only for cost-sensitive, non-28 Gbps designs where -3.3 V supply is unavailable |
Compared with HMC851LC3CTR, the HMC852LC3CTR offers integrated dual-channel operation but increases power and reduces per-channel flexibility, while the SY100EL15ZC provides pin-compatible ECL logic at <1/8 the data rate and incompatible supply polarity - neither is a drop-in replacement.
Availability
HMC851LC3CTR is available at Aetrix Electronics and suitable for RF ATE systems, broadband test equipment, and 28 Gbps serial interconnect designs requiring stable component supply, guaranteed traceability, and long-term lifecycle support.
Supply support for HMC851LC3CTR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Analog Devices acquired Hittite Microwave in 2014 and integrates its high-frequency RF and microwave IC portfolio into precision signal chain solutions.
The HMC851LC3CTR belongs to Hittite's HIGH SPEED LOGIC product line, engineered specifically for 25+ Gbps test, measurement, and communications infrastructure where sub-100 ps timing, programmable swing, and CML compatibility are mandatory.
FAQ
What is the recommended power supply configuration for the HMC851LC3CTR?
The HMC851LC3CTR requires a clean, well-decoupled -3.3 V DC supply (Vee) applied to Pin 15 and the exposed paddle. Decoupling capacitors (e.g., 4.7 µF tantalum + 100 pF ceramic) must be placed near the device. Supply tolerance is ±0.3 V; exceeding -3.6 V or -3.0 V violates absolute maximum ratings. The HMC851LC3CTR draws ~73 mA typical, resulting in ~241 mW power dissipation.
How does the VR pin affect the output voltage swing of the HMC851LC3CTR?
The VR pin on the HMC851LC3CTR is an analog control input that adjusts the differential output voltage swing from 500 mVp-p to 1300 mVp-p. Applying voltages from -0.4 V to +0.4 V shifts swing linearly - 0 V yields nominal swing (~1090 mVp-p differential). This enables real-time compensation for channel loss or receiver sensitivity mismatch without hardware changes. The HMC851LC3CTR datasheet provides precise VR vs. swing curves across temperature.
Can the HMC851LC3CTR accept DC-coupled inputs and drive DC-coupled loads?
Yes, the HMC851LC3CTR supports both DC- and AC-coupled operation on all ports. Inputs (AP/AN, BP/BN) feature on-chip 50 Ω termination to ground, allowing direct DC coupling. Outputs (DP/DN) are CML with 50 Ω source impedance and can drive either 50 Ω-to-ground or 50 Ω-to-VCC loads - DC blocking capacitors are optional when terminating to non-ground DC voltages. This flexibility is confirmed in the HMC851LC3CTR functional description and application circuit.
What is the significance of the 16-lead ceramic 3×3 mm package for the HMC851LC3CTR?
The 16-lead ceramic SMT package (3×3 mm, 0.5 mm pitch) of the HMC851LC3CTR delivers low parasitic inductance and stable RF performance up to 28 GHz. Its alumina body and gold-over-nickel plating ensure reliability under thermal cycling. The exposed paddle must be soldered to Vee for thermal conduction (Rth j-p = 59 °C/W) and reference stability. This package enables dense placement in high-frequency test equipment while maintaining signal integrity - a key requirement specified for the HMC851LC3CTR in its outline drawing and package information.
Does the HMC851LC3CTR support both XOR and XNOR logic functions simultaneously?
No - the HMC851LC3CTR implements a single XOR/XNOR function whose output polarity is determined by input signal mapping. As shown in its truth table, applying complementary logic states to inputs A and B yields either XOR (D = A ⊕ B) or XNOR (D = A ⊙ B) behavior. It is not a dual-mode configurable gate; rather, it is a fixed-function gate whose logical output depends on how differential inputs are driven. This behavior is intrinsic to the HMC851LC3CTR's CML topology and verified in its truth table and timing diagram.
HMC851LC3CTR Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Analog Devices Inc.
- Series:
- -
- Package/Case:
- 16-LFQFN Exposed Pad
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Logic Type:
- XOR/XNOR Gate
- Number of Circuits:
- 1
- Number of Inputs:
- 4
- Schmitt Trigger Input:
- No
- Output Type:
- Differential, Single-Ended
- Current - Output High, Low:
- -
- Voltage - Supply:
- -3V ~ -3.6V
- Operating Temperature:
- -40°C ~ 85°C
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 16-SMT (3x3)
HMC851LC3CTR FAQ
1.How can I place an order for HMC851LC3CTR through Aetrix?
Please submit a Request for Quotation (RFQ) for HMC851LC3CTR on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for HMC851LC3CTR reliable?
The price and inventory of HMC851LC3CTR are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for HMC851LC3CTR is usually 5 days.
3.What payment methods are accepted for HMC851LC3CTR?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for HMC851LC3CTR transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for HMC851LC3CTR?
HMC851LC3CTR orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your HMC851LC3CTR order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for HMC851LC3CTR?
For technical support, including HMC851LC3CTR datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your HMC851LC3CTR requirements.
6.How does Aetrix verify that HMC851LC3CTR is sourced from the original manufacturer or authorized distributors?
All HMC851LC3CTR products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that HMC851LC3CTR meets industry standards.
7.What is the process for return or replacement of HMC851LC3CTR?
All HMC851LC3CTR units undergo pre-shipment inspection (PSI). If there is an issue with HMC851LC3CTR, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The HMC851LC3CTR part is unused and in its original packaging.
Return procedure for HMC851LC3CTR:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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